公开(公告)号：US20080083975A1

公开(公告)日：2008-04-10

申请号：US11539814

申请日：2006-10-09

Applicant: Clinton Chao ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan ,  Kim Chen ,  Mark Shane Peng ,  Tjandra Winata Karta

Inventor： Clinton Chao ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan ,  Kim Chen ,  Mark Shane Peng ,  Tjandra Winata Karta

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L25/0657 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A stacked structure includes a first die coupled to a first substrate and having a first conductive structure formed through the first die. A second die is mounted over the first die. The second die is coupled to the first substrate by the first conductive structure. At least one first support structure formed from a second substrate is provided over the first substrate, adjacent to at least one of the first die and the second die. A top surface of the first support structure is substantially coplanar with a top surface of at least one of the first and second dies adjacent to the first support structure. The stacked structure further includes a heat spreader mounted over the second die.

Abstract translation: 层叠结构包括耦合到第一衬底并具有通过第一裸片形成的第一导电结构的第一管芯。 第二模具安装在第一模具上。 第二管芯通过第一导电结构耦合到第一衬底。 从第二基板形成的至少一个第一支撑结构设置在第一基板上，与第一模具和第二模具中的至少一个相邻。 第一支撑结构的顶表面与邻近第一支撑结构的第一和第二模具中的至少一个的顶表面基本共面。 层叠结构还包括安装在第二模具上的散热器。

公开(公告)号：US5690344A

公开(公告)日：1997-11-25

申请号：US589079

申请日：1996-01-23

Applicant: Kim Chen

Inventor： Kim Chen

IPC: A63C17/00 ,  A63C17/06

CPC classification number: A63C17/0046 ,  A63C17/061

Abstract: An in-line roller skate having an improved sole plate structure includes a boot with an outer sole provided with a plurality of downwardly extending projections. Each projection is provided with a vertically oriented, elongated slot for receiving a bushing of an elastic plastic material for absorbing shock, and at least two pairs of mounting plates for clamping rollers between each pair pivotally-mounted to the corresponding projections. Each pair of mounting pairs secures two rollers at either end thereof. The mounting plates are arranged to be pairs of two and each pair of mounting plates is independently mounted to the projections of the boot. The in-line roller skate has good floor or ground adaptability and shock-absorbing effects.

Abstract translation: 具有改进的底板结构的直排轮溜冰鞋包括具有设置有多个向下延伸的突起的外底的护罩。 每个突起设置有垂直定向的细长槽，用于接收用于吸收冲击的弹性塑料材料的衬套，以及至少两对安装板，用于夹紧每对之间的辊，枢转地安装到相应的突起。 每对安装对在其任一端固定两个辊。 安装板被布置为成对的两个，并且每对安装板独立地安装到靴的突起。 在线溜冰鞋具有良好的地板或地面适应性和减震效果。

公开(公告)号：US07514775B2

公开(公告)日：2009-04-07

申请号：US11539814

申请日：2006-10-09

Applicant: Clinton Chao ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan ,  Kim Chen ,  Mark Shane Peng ,  Tjandra Winata Karta

Inventor： Clinton Chao ,  Tsorng-Dih Yuan ,  Hsin-Yu Pan ,  Kim Chen ,  Mark Shane Peng ,  Tjandra Winata Karta

IPC: H01L23/498

CPC classification number: H01L25/0657 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A stacked structure includes a first die coupled to a first substrate and having a first conductive structure formed through the first die. A second die is mounted over the first die. The second die is coupled to the first substrate by the first conductive structure. At least one first support structure formed from a second substrate is provided over the first substrate, adjacent to at least one of the first die and the second die. A top surface of the first support structure is substantially coplanar with a top surface of at least one of the first and second dies adjacent to the first support structure. The stacked structure further includes a heat spreader mounted over the second die.

Abstract translation: 层叠结构包括耦合到第一衬底并具有通过第一裸片形成的第一导电结构的第一管芯。 第二模具安装在第一模具上。 第二管芯通过第一导电结构耦合到第一衬底。 从第二基板形成的至少一个第一支撑结构设置在第一基板上，与第一模具和第二模具中的至少一个相邻。 第一支撑结构的顶表面与邻近第一支撑结构的第一和第二模具中的至少一个的顶表面基本共面。 层叠结构还包括安装在第二模具上的散热器。

公开(公告)号：US20080250182A1

公开(公告)日：2008-10-09

申请号：US11697744

申请日：2007-04-09

Applicant: Clinton Chao ,  Louis Liu ,  Lewis Chu ,  Mark Shane Peng ,  Chao-Shun Hsu ,  Kim Chen

Inventor： Clinton Chao ,  Louis Liu ,  Lewis Chu ,  Mark Shane Peng ,  Chao-Shun Hsu ,  Kim Chen

IPC: G06F13/14

CPC classification number: G06F17/5045 ,  G06F2217/40

Abstract: SiP design systems and methods. The system comprises a system partitioning module, a subsystem integration module, a physical design module, and an analysis module. The system partitioning module partitions a target system into subsystem partitions according to partition criteria. The subsystem integration module generates an architecture design and/or a cost estimation for the target system according to the subsystem partitions, at least one SiP platform, and IC geometry data. The physical design module generates a SiP physical design with physical routing for the target system according to the architecture design, the subsystem partitions, the SiP platform, and the IC geometry data. The analysis module performs a performance check within the subsystem partitions based on the SiP physical design and/or simulations of the target system.

Abstract translation: SiP设计系统和方法。 该系统包括系统分区模块，子系统集成模块，物理设计模块和分析模块。 系统分区模块根据分区标准将目标系统划分为子系统分区。 子系统集成模块根据子系统分区，至少一个SiP平台和IC几何数据生成目标系统的架构设计和/或成本估算。 物理设计模块根据架构设计，子系统分区，SiP平台和IC几何数据，为目标系统生成具有物理路由的SiP物理设计。 分析模块基于SiP物理设计和/或目标系统的模拟来执行子系统分区内的性能检查。

公开(公告)号：US20080018350A1

公开(公告)日：2008-01-24

申请号：US11525581

申请日：2006-09-22

Applicant: Clinton Chao ,  Chih-Hsien Chang ,  John C.Y. Chiang ,  Mark Shane Peng ,  Hua-Shu Wu ,  Kim Chen ,  Wen-Hung Wu ,  Tjandra Winada Karta

Inventor： Clinton Chao ,  Chih-Hsien Chang ,  John C.Y. Chiang ,  Mark Shane Peng ,  Hua-Shu Wu ,  Kim Chen ,  Wen-Hung Wu ,  Tjandra Winada Karta

IPC: G01R31/02

CPC classification number: G01R1/07378

Abstract: An interposer for converting pitches includes an interconnect structure over the semiconductor substrate, an active circuit formed on the semiconductor substrate, wherein the active circuit is electrically connected to the interconnect structure, a first plurality of pads with a first pitch over the interconnect structure, a second plurality of pads underlying the semiconductor substrate, and a plurality of through-substrate vias in the semiconductor substrate, wherein the first and the second plurality of pads are interconnected through the plurality of through-substrate vias.

Abstract translation: 用于转换间距的插入件包括半导体衬底上的互连结构，形成在半导体衬底上的有源电路，其中有源电路电连接到互连结构，在互连结构上具有第一间距的第一多个焊盘， 半导体衬底下面的第二多个衬垫，以及半导体衬底中的多个穿通衬底通孔，其中第一和第二多个焊盘通过多个贯穿衬底通孔互连。

公开(公告)号：US06817884B1

公开(公告)日：2004-11-16

申请号：US10629627

申请日：2003-07-30

Applicant: Mao-Hsiung Chen ,  Kim Chen

Inventor： Mao-Hsiung Chen ,  Kim Chen

IPC: H01R13627

CPC classification number: H01R13/642 ,  H01R13/6275

Abstract: A multi-I/O-port-41-channel connector includes first and second connectors, in which associated connecting pins and plugholes as well as a fastening device is available to thereby prevent any possible faulty connection and provide a convenient operation for enhanced fastening or detaching of the connectors.

Abstract translation: 多I / O-port-41通道连接器包括第一和第二连接器，其中相关联的连接销和插孔以及紧固装置可用于由此防止任何可能的故障连接并提供方便的操作以增强紧固或 拆卸连接器。

公开(公告)号：US07565635B2

公开(公告)日：2009-07-21

申请号：US11697744

申请日：2007-04-09

Applicant: Clinton Chao ,  Louis Liu ,  Lewis Chu ,  Mark Shane Peng ,  Chao-Shun Hsu ,  Kim Chen

Inventor： Clinton Chao ,  Louis Liu ,  Lewis Chu ,  Mark Shane Peng ,  Chao-Shun Hsu ,  Kim Chen

IPC: G06F17/50 ,  G06F9/45

CPC classification number: G06F17/5045 ,  G06F2217/40

Abstract: SiP design systems and methods. The system comprises a system partitioning module, a subsystem integration module, a physical design module, and an analysis module. The system partitioning module partitions a target system into subsystem partitions according to partition criteria. The subsystem integration module generates an architecture design and/or a cost estimation for the target system according to the subsystem partitions, at least one SiP platform, and IC geometry data. The physical design module generates a SiP physical design with physical routing for the target system according to the architecture design, the subsystem partitions, the SiP platform, and the IC geometry data. The analysis module performs a performance check within the subsystem partitions based on the SiP physical design and/or simulations of the target system.

Abstract translation: SiP设计系统和方法。 该系统包括系统分区模块，子系统集成模块，物理设计模块和分析模块。 系统分区模块根据分区标准将目标系统划分为子系统分区。 子系统集成模块根据子系统分区，至少一个SiP平台和IC几何数据生成目标系统的架构设计和/或成本估算。 物理设计模块根据架构设计，子系统分区，SiP平台和IC几何数据，为目标系统生成具有物理路由的SiP物理设计。 分析模块基于SiP物理设计和/或目标系统的模拟来执行子系统分区内的性能检查。