摘要:
A system for the laser scribing of semiconductor devices includes a laser light source operable to selectably deliver laser illumination at a first wavelength and at a second wavelength which is shorter than the first wavelength. The system further includes a support for a semiconductor device and an optical system which is operative to direct the laser illumination from the light source to the semiconductor device. The optical system includes optical elements which are compatible with the laser illumination of the first wavelength and the laser illumination of the second wavelength. In specific instances, the first wavelength is long wavelength illumination such as illumination of at least 1000 nanometers, and the second wavelength is short wavelength illumination which in specific instances is 300 nanometers or shorter. By the use of the differing wavelengths, specific layers of the semiconductor device may be scribed without damage to subjacent layers. Also disclosed are specific scribing processes.
摘要:
A system for the laser scribing of semiconductor devices includes a laser light source operable to selectably deliver laser illumination at a first wavelength and at a second wavelength which is shorter than the first wavelength. The system further includes a support for a semiconductor device and an optical system which is operative to direct the laser illumination from the light source to the semiconductor device. The optical system includes optical elements which are compatible with the laser illumination of the first wavelength and the laser illumination of the second wavelength. In specific instances, the first wavelength is long wavelength illumination such as illumination of at least 1000 nanometers, and the second wavelength is short wavelength illumination which in specific instances is 300 nanometers or shorter. By the use of the differing wavelengths, specific layers of the semiconductor device may be scribed without damage to subjacent layers. Also disclosed are specific scribing processes.
摘要:
A light weight photovoltaic device for use in stratospheric and outer space applications. The device includes a protective surface coating on the light incident side thereof. The protective coating does not deleteriously affect the photovoltaic properties of the solar cell, is formed of a material which protects said solar cell from the harsh conditions in the stratospheric or outer space environment in which the photovoltaic device is adapted to be used; and remains substantially unchanged when exposed to the harsh conditions in the stratosphere or outer space. The protective coating is preferably made of a spray coated silicone based material and is between 0.01 and 2 mil thick.
摘要:
A photovoltaic module comprised of a plurality of series connected photovoltaic cells disposed upon a substrate is fabricated utilizing thin film device techniques. A body of photovoltaic stock material comprised of an electrically conductive substrate having at least a bottom electrode layer, a body of photovoltaic material, and a top electrode layer supported thereupon is patterned so as to define a number of individual, electrically isolated photovoltaic cells and a number of electrically isolated connection zones. The connection zones are patterned to each include a portion of the bottom electrode material and are configured so that the bottom electrode material in each segment of the connection zone is exposed, and is in electrical communication with the bottom electrode portion of a particular cell. A current collecting grid structure is disposed on the top electrode of each cell and is placed in electrical communication with the bottom electrode of an adjoining cell via the electrode layer in an appropriate connection zone. In this manner, a series interconnection between the cells is established. Electrical terminals may be affixed to the module, and the finished module may be encapsulated in a body of protective materials. The substrate used in the manufacture of the module may comprise a thin, flexible layer of polymeric material and the disclosed techniques may be utilized to fabricate ultra lightweight photovoltaic modules. Also disclosed are specific module structures.
摘要:
A web of a first sheet material and a web of a second sheet material are laminated together by a process wherein the sheet materials are wound, in an interleaved relationship, upon a roller having a radially displaceable outer surface. The roller and webs and then subjected to heating and/or a low-pressure environment so as to complete the lamination. A body of adhesive material, such as a hot melt adhesive, may be interposed between the webs and the heating or low pressure environment can activate this adhesive. Further disposed are particular configurations of rollers with radially displaceable surfaces.
摘要:
An ultra lightweight semiconductor device such as a photovoltaic device is fabricated on a non-etchable barrier layer which is disposed upon an etchable substrate. The device is contacted with an appropriate etchant for a period of time sufficient to remove at least a portion of the thickness of the substrate. The barrier layer prevents damage to the photovoltaic material during the etching process. Photovoltaic devices fabricated by this method have specific power levels in excess of 300 w/kg.
摘要:
A web of a first sheet material and a web of a second sheet material are laminated together by a process wherein the sheet materials are wound, in an interleaved relationship, upon a roller having a radially displaceable outer surface. The roller and webs and then subjected to heating and/or a low-pressure environment so as to complete the lamination. A body of adhesive material, such as a hot melt adhesive, may be interposed between the webs and the heating or low pressure environment can activate this adhesive. Further disposed are particular configurations of rollers with radially displaceable surfaces.
摘要:
A thin film semiconductor device such as a photovoltaic device is fabricated on a lightweight substrate material which is affixed to a layer of material which is in turn supported by a carrier. Following the fabrication of the device, the carrier is removed such as by an etching process, leaving the layer of material adhered to the substrate. The adhered layer provides a balancing force to the back side of the substrate which minimizes or eliminates the tendency of the semiconductor device supported on the opposite side of the substrate to cause the substrate to curl. Also disclosed are devices and structures made by this method.
摘要:
A photovoltaic module comprised of a plurality of series connected photovoltaic cells disposed upon a substrate is fabricated utilizing thin film device techniques. A body of photovoltaic stock material comprised of an electrically conductive substrate having at least a bottom electrode layer, a body of photovoltaic material, and a top electrode layer supported thereupon is patterned so as to define a number of individual, electrically isolated photovoltaic cells and a number of electrically isolated connection zones. The connection zones are patterned to each include a portion of the bottom electrode material and are configured so that the bottom electrode material in each segment of the connection zone is exposed, and is in electrical communication with the bottom electrode portion of a particular cell. A current collecting grid structure is disposed on the top electrode of each cell and is placed in electrical communication with the bottom electrode of an adjoining cell via the electrode layer in an appropriate connection zone. In this manner, a series interconnection between the cells is established. Electrical terminals may be affixed to the module, and the finished module may be encapsulated in a body of protective materials. The substrate used in the manufacture of the module may comprise a thin, flexible layer of polymeric material and the disclosed techniques may be utilized to fabricate ultra lightweight photovoltaic modules. Also disclosed are specific module structures.
摘要:
A method for making a semiconductor device having front-surface electrical terminals in which the device is manufactured so as to include a bottom electrode, a top electrode and a semiconductor body therebetween. A first bus bar is disposed in a groove in the semiconductor body. It is in electrical communication with the bottom electrode, and includes a tab portion which projects from the device. A second bus bar is in electrical communication with the top electrode, and is disposed atop the first electrode, and electrically insulated therefrom. The tab of the first bus bar provides one terminal of the device and is folded onto the second bus bar and is electrically insulated therefrom. The second bus bar provides the second terminal of the device.