公开(公告)号：US07279357B2

公开(公告)日：2007-10-09

申请号：US11122094

申请日：2005-05-05

申请人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

发明人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

IPC分类号： H01L21/311 ,  H01L21/3205 ,  H01L23/48

CPC分类号： H01L23/3114 ,  H01L23/5227 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.

摘要翻译： 半导体器件具有半导体芯片，第一绝缘膜和电感器。 半导体芯片包括形成在芯片的主表面上的集成电路和形成在芯片的主表面上并电连接到集成电路的多个焊盘电极。 绝缘树脂材料的第一绝缘膜形成在半导体芯片的主表面上，覆盖集成电路，并且包括设置在各个焊盘电极上的多个接触孔。 电感器形成在第一绝缘膜的电感器形成区域上，并且电感器的两个端子分别通过接触孔连接到焊盘电极。 第一绝缘膜的电感器形成区域形成为比接触孔周围的第一绝缘膜的一部分厚。

公开(公告)号：US5650870A

公开(公告)日：1997-07-22

申请号：US636650

申请日：1996-04-23

申请人： Kazuyuki Kaino ,  Yosuke Ogue

发明人： Kazuyuki Kaino ,  Yosuke Ogue

IPC分类号： G02B5/09 ,  G02B26/08

CPC分类号： G02B5/09

摘要： A rotary polygon mirror has reflecting mirror faces formed at side faces of a prism of a predetermined height, and includes an axially symmetrical projection formed along at least parts of outer peripheral edges of the prism on upper and lower faces of the prism.

摘要翻译： 旋转多面镜具有形成在预定高度的棱镜的侧面的反射镜面，并且包括在棱镜的上表面和下表面上沿着棱镜的外周边缘的至少一部分形成的轴对称的突起。

公开(公告)号：US5131559A

公开(公告)日：1992-07-21

申请号：US656826

申请日：1991-02-19

申请人： Hideho Ariyoshi ,  Kazuyuki Kaino

发明人： Hideho Ariyoshi ,  Kazuyuki Kaino

IPC分类号： B65D1/04 ,  B29C45/00 ,  B29C45/26 ,  B29L22/00 ,  B65D1/24

CPC分类号： B65D1/24 ,  B29C45/2624

摘要： A resin casing of a box-like configuration has side walls, a bottom wall and a plurality of partition walls. Each partition wall has two opposite end portions tapered, at which the partition wall is integrally formed with the side wall. Thus, the cooling speed is made constant at every portion in the resin casing to avoid shrinkage marks and unwanted raised lines.

摘要翻译： 盒状构造的树脂壳体具有侧壁，底壁和多个隔壁。 每个分隔壁具有锥形的两个相对的端部，分隔壁与侧壁一体形成。 因此，树脂壳体中的每个部分的冷却速度恒定，以避免收缩痕迹和不需要的凸起线。

公开(公告)号：US06559528B2

公开(公告)日：2003-05-06

申请号：US09785503

申请日：2001-02-20

申请人： Kazumi Watase ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Takahiro Kumakawa ,  Kazuyuki Kaino ,  Yoshifumi Nakamura

发明人： Kazumi Watase ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Takahiro Kumakawa ,  Kazuyuki Kaino ,  Yoshifumi Nakamura

IPC分类号： H01L23498

CPC分类号： H01L24/97 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49872 ,  H01L24/45 ,  H01L24/48 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/85399 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a semiconductor device 10 comprising a first semiconductor element 11 with an arrangement of first element electrodes 12, a second semiconductor element 13 with an arrangement of second element electrodes 14, a connection member 15 electrically connecting together a portion 12b of the first element electrodes 12 and the second element electrodes 14, an insulation layer 17 covering a major surface 11a of the first semiconductor element 11 and a backside surface 13b of the second semiconductor element 13, a wiring layer 22 formed on the insulation layer 17 and electrically connected to the first element electrode portion 12b exposed in an opening portion 21, and an external electrode 23 formed, as a portion of the wiring layer 22, on the insulation layer 17.

摘要翻译： 公开了一种半导体器件10，其包括具有第一元件电极12的布置的第一半导体元件11，具有第二元件电极14的布置的第二半导体元件13，将第一元件电极的部分12b电连接在一起的连接构件15 12和第二元件电极14，覆盖第一半导体元件11的主表面11a和第二半导体元件13的背面13b的绝缘层17，形成在绝缘层17上并电连接到第二半导体元件13的布线层22的布线层22。 露出在开口部分21中的第一元件电极部分12b和作为布线层22的一部分形成在绝缘层17上的外部电极23。

公开(公告)号：US20050199979A1

公开(公告)日：2005-09-15

申请号：US11122094

申请日：2005-05-05

申请人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

发明人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

IPC分类号： H01L21/768 ,  H01L21/822 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522 ,  H01L27/04 ,  H01L29/00

CPC分类号： H01L23/3114 ,  H01L23/5227 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.

摘要翻译： 半导体器件具有半导体芯片，第一绝缘膜和电感器。 半导体芯片包括形成在芯片的主表面上的集成电路和形成在芯片的主表面上并电连接到集成电路的多个焊盘电极。 绝缘树脂材料的第一绝缘膜形成在半导体芯片的主表面上，覆盖集成电路，并且包括设置在各个焊盘电极上的多个接触孔。 电感器形成在第一绝缘膜的电感器形成区域上，并且电感器的两个端子分别通过接触孔连接到焊盘电极。 第一绝缘膜的电感器形成区域形成为比接触孔周围的第一绝缘膜的一部分厚。

公开(公告)号：US06924173B2

公开(公告)日：2005-08-02

申请号：US10387457

申请日：2003-03-14

申请人： Kazumi Watase ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Takahiro Kumakawa ,  Kazuyuki Kaino ,  Yoshifumi Nakamura

发明人： Kazumi Watase ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Takahiro Kumakawa ,  Kazuyuki Kaino ,  Yoshifumi Nakamura

IPC分类号： H01L25/18 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L21/58

CPC分类号： H01L24/97 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49872 ,  H01L24/45 ,  H01L24/48 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/85399 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a semiconductor device 10 comprising a first semiconductor element 11 with an arrangement of first element electrodes 12, a second semiconductor element 13 with an arrangement of second element electrodes 14, a connection member 15 electrically connecting together a portion 12b of the first element electrodes 12 and the second element electrodes 14, an insulation layer 17 covering a major surface 11a of the first semiconductor element 11 and a backside surface 13b of the second semiconductor element 13, a wiring layer 22 formed on the insulation layer 17 and electrically connected to the first element electrode portion 12b exposed in an opening portion 21, and an external electrode 23 formed, as a portion of the wiring layer 22, on the insulation layer 17.

摘要翻译： 公开了一种半导体器件10，其包括具有第一元件电极12的布置的第一半导体元件11，具有第二元件电极14的布置的第二半导体元件13，连接构件15，其将第一元件 电极12和第二元件电极14，覆盖第一半导体元件11的主表面11a和第二半导体元件13的背面13b的绝缘层17，形成在绝缘层17上的布线层22， 连接到暴露在开口部分21中的第一元件电极部分12b和形成为绝缘层17上的布线层22的一部分的外部电极23。

公开(公告)号：US5561545A

公开(公告)日：1996-10-01

申请号：US260238

申请日：1994-06-14

申请人： Kazuyuki Kaino ,  Yosuke Ogue

发明人： Kazuyuki Kaino ,  Yosuke Ogue

IPC分类号： G02B5/09 ,  G02B26/08

CPC分类号： G02B5/09

摘要： A rotary polygon mirror has reflecting mirror faces formed at side faces of a prism of a predetermined height, and includes an axially symmetrical projection formed along at least parts of outer peripheral edges of the prism on upper and lower faces of the prism.

摘要翻译： 旋转多面镜具有形成在预定高度的棱镜的侧面的反射镜面，并且包括在棱镜的上表面和下表面上沿着棱镜的外周边缘的至少一部分形成的轴对称的突起。

公开(公告)号：US06914331B2

公开(公告)日：2005-07-05

申请号：US10442139

申请日：2003-05-21

申请人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

发明人： Nozomi Shimoishizaka ,  Kazuyuki Kaino ,  Yoshifumi Nakamura ,  Keiji Miki ,  Kazumi Watase ,  Ryuichi Sahara

IPC分类号： H01L21/768 ,  H01L21/822 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/522 ,  H01L27/04 ,  H01L23/498

CPC分类号： H01L23/3114 ,  H01L23/5227 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.

摘要翻译： 半导体器件具有半导体芯片，第一绝缘膜和电感器。 半导体芯片包括形成在芯片的主表面上的集成电路和形成在芯片的主表面上并电连接到集成电路的多个焊盘电极。 绝缘树脂材料的第一绝缘膜形成在半导体芯片的主表面上，覆盖集成电路，并且包括设置在各个焊盘电极上的多个接触孔。 电感器形成在第一绝缘膜的电感器形成区域上，并且电感器的两个端子分别通过接触孔连接到焊盘电极。 第一绝缘膜的电感器形成区域形成为比接触孔周围的第一绝缘膜的一部分厚。

公开(公告)号：US5500069A

公开(公告)日：1996-03-19

申请号：US227330

申请日：1994-04-14

申请人： Yousuke Ogue ,  Takahiro Kuyama ,  Kazuyuki Kaino

发明人： Yousuke Ogue ,  Takahiro Kuyama ,  Kazuyuki Kaino

IPC分类号： B29C67/00 ,  B32B31/00

CPC分类号： B29C67/0066

摘要： A three-dimensional object-forming method for forming an object of a three-dimensional shape with photosetting resin, includes the following steps. The desired three-dimensional shape is represented by a set of data related to sectional shapes of the three-dimensional shape cut at predetermined intervals distance of. The laser light is scanned, from above a tank containing liquid of photosetting resin not yet hardened, outward around a predetermined point of each sectional shape in a manner to trace similar figures to an arbitrary shape, to thereby to set a surface of a resin layer in a shape corresponding to one sectional shape. The set resin layer is sunk into the liquid of the photosetting resin not yet hardened by a distance of a cross section. A plurality of the set resin layers of the photosetting resin is laminated by repeating the scanning and sinking steps on the basis of the set of data. The laser light can be scanned at predetermined intervals of distance and in parallel to a direction of each sectional shape and then the desired number of the set resin layers are rotated so that the scanning directions of the resin layers are different from each other.

摘要翻译： 用光固化树脂形成三维形状物体的三维物体形成方法包括以下步骤。 期望的三维形状由与以预定间隔距离切割的三维形状的截面形状有关的一组数据表示。 激光从包含光固化树脂的液体的容器的上方未被硬化地扫描，以每个截面形状的预定点向外，以跟踪相似的图形为任意形状，从而设定树脂层的表面 形状对应于一个截面形状。 固定的树脂层沉积在未固化横截面距离的光固化树脂的液体中。 通过基于该组数据重复扫描和沉降步骤来层叠多个光固化树脂的固化树脂层。 可以以预定的距离间隔并且平行于每个截面形状的方向扫描激光，然后旋转所需数量的树脂层，使得树脂层的扫描方向彼此不同。