公开(公告)号：US08038838B2

公开(公告)日：2011-10-18

申请号：US11945342

申请日：2007-11-27

申请人： Ju Won Kim ,  Ki Hoon Choi ,  Jung Keun Cho ,  Kyo Woog Koo ,  Jung Bong Choi

发明人： Ju Won Kim ,  Ki Hoon Choi ,  Jung Keun Cho ,  Kyo Woog Koo ,  Jung Bong Choi

IPC分类号： H01L21/68 ,  H01L21/027

CPC分类号： H01L21/68728 ,  H01L21/68742

摘要： A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.

摘要翻译： 旋转头包括夹紧销配置为卡盘和解锁基板。 夹持销和基板的接触部分在防止处理溶液残留在接触部分的过程中变化。

公开(公告)号：US20090305613A1

公开(公告)日：2009-12-10

申请号：US12273064

申请日：2008-11-18

申请人： Ki Hoon Choi ,  Gyo-Woog Koo ,  Jung-Bong Choi

发明人： Ki Hoon Choi ,  Gyo-Woog Koo ,  Jung-Bong Choi

IPC分类号： B24B1/00 ,  B24B7/20 ,  B24B53/02 ,  B08B3/12

CPC分类号： H01L21/67051 ,  B24B37/30

摘要： Provided are a single type substrate treating apparatus and method. A polishing unit is disposed in a process chamber for polishing a substrate chemically and mechanically, and a cleaning unit is disposed in the same process chamber for cleaning the substrate. Therefore, according to the single substrate treating apparatus and method, a polishing process and a cleaning process can be performed on a substrate in the same process chamber by a single substrate treating method in which substrates are treated one by one.

摘要翻译： 提供单一基板处理装置和方法。 抛光单元设置在用于对化学和机械抛光的处理室中，并且清洁单元设置在相同的处理室中，用于清洁基板。 因此，根据单个基板处理装置和方法，可以通过单个基板处理方法在相同的处理室中的基板上进行抛光处理和清洁处理，其中基板一个接一个地处理。

公开(公告)号：US20080127888A1

公开(公告)日：2008-06-05

申请号：US11945342

申请日：2007-11-27

申请人： Ju Won Kim ,  Ki Hoon Choi ,  Jung Keun Cho ,  Kyo Woog Koo ,  Jung Bong Choi

发明人： Ju Won Kim ,  Ki Hoon Choi ,  Jung Keun Cho ,  Kyo Woog Koo ,  Jung Bong Choi

IPC分类号： B05C13/02 ,  B05D3/12 ,  B05C5/00 ,  B05C13/00

CPC分类号： H01L21/68728 ,  H01L21/68742

摘要： A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.

摘要翻译： 旋转头包括夹紧销配置为卡盘和解锁基板。 夹持销和基板的接触部分在防止处理溶液残留在接触部分的过程中变化。

公开(公告)号：US20090325469A1

公开(公告)日：2009-12-31

申请号：US12273829

申请日：2008-11-19

申请人： Gyo-Woog KOO ,  Chang-Ro Yoon ,  Jung-Gun Cho ,  Ki-Hoon Choi ,  Jung-Bong Choi ,  Duk-Hyun Son ,  Se-Hun Goo

发明人： Gyo-Woog KOO ,  Chang-Ro Yoon ,  Jung-Gun Cho ,  Ki-Hoon Choi ,  Jung-Bong Choi ,  Duk-Hyun Son ,  Se-Hun Goo

IPC分类号： B24B1/00 ,  B24B7/04 ,  B24B41/06

CPC分类号： B24B37/30 ,  H01L21/6838 ,  H01L21/68728 ,  H01L21/68742

摘要： Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.

摘要翻译： 提供了一种基板支撑单元和使用该基板支撑单元的单一基板抛光装置。 在抛光过程中，通过真空抽吸将衬底的底表面附接到衬底支撑单元，并且在后清洗过程中，衬底由衬底支撑单元支撑在与衬底支撑单元间隔开的位置，用于 清洁基底的底面。 因此，根据基板支撑单元和使用基板支撑单元的基板研磨装置，在基板由单一基板支撑单元支撑的状态下，对基板的顶面进行研磨的工序和后处理 可以依次执行用于清洁基板的顶表面和底表面的清洁。

公开(公告)号：US08287333B2

公开(公告)日：2012-10-16

申请号：US12273064

申请日：2008-11-18

申请人： Ki Hoon Choi ,  Gyo-Woog Koo ,  Jung Bong Choi

发明人： Ki Hoon Choi ,  Gyo-Woog Koo ,  Jung Bong Choi

IPC分类号： B24B1/00

CPC分类号： H01L21/67051 ,  B24B37/30

摘要： Provided are a single type substrate treating apparatus and method. A polishing unit is disposed in a process chamber for polishing a substrate chemically and mechanically, and a cleaning unit is disposed in the same process chamber for cleaning the substrate. Therefore, according to the single substrate treating apparatus and method, a polishing process and a cleaning process can be performed on a substrate in the same process chamber by a single substrate treating method in which substrates are treated one by one.

摘要翻译： 提供单一基板处理装置和方法。 抛光单元设置在用于对化学和机械抛光的处理室中，并且清洁单元设置在相同的处理室中，用于清洁基板。 因此，根据单个基板处理装置和方法，可以通过单个基板处理方法在相同的处理室中的基板上进行抛光处理和清洁处理，其中基板被逐个处理。

公开(公告)号：US08113918B2

公开(公告)日：2012-02-14

申请号：US12273829

申请日：2008-11-19

申请人： Gyo-Woog Koo ,  Chang-Ro Yoon ,  Jung-Gun Cho ,  Ki-Hoon Choi ,  Jung-Bong Choi ,  Duk-Hyun Son ,  Se-Hun Goo

发明人： Gyo-Woog Koo ,  Chang-Ro Yoon ,  Jung-Gun Cho ,  Ki-Hoon Choi ,  Jung-Bong Choi ,  Duk-Hyun Son ,  Se-Hun Goo

IPC分类号： B24B5/02

CPC分类号： B24B37/30 ,  H01L21/6838 ,  H01L21/68728 ,  H01L21/68742

摘要： Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.

摘要翻译： 提供了一种基板支撑单元和使用该基板支撑单元的单一基板抛光装置。 在抛光过程中，通过真空抽吸将衬底的底表面附接到衬底支撑单元，并且在后清洗过程中，衬底由衬底支撑单元支撑在与衬底支撑单元间隔开的位置，用于 清洁基底的底面。 因此，根据基板支撑单元和使用基板支撑单元的基板研磨装置，在基板由单一基板支撑单元支撑的状态下，对基板的顶面进行研磨的工序和后处理 可以依次执行用于清洁基板的顶表面和底表面的清洁。