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公开(公告)号：US4513623A
公开(公告)日：1985-04-30
申请号：US530525
申请日：1983-09-09
Applicant: Anthony D. Kurtz , Joseph R. Mallon, Jr.
Inventor： Anthony D. Kurtz , Joseph R. Mallon, Jr.
CPC classification number: G01L19/0084 , G01L19/14 , G01L19/143
Abstract: A transducer housing consists of a first and a second section. The first section contains an internal hollow into which a transistor header is mounted. The header, as mounted in the first section, is firmly secured within the section by means of a locking ring or other arrangement. Located in the internal hollow of the first section is a printed circuit board which has a plurality of apertures on the surface thereof each of which communicates with an extending tubular post on the opposite surface. Leads from the header are directed through the apertures in the printed circuit board and extend into the tubular posts. The second housing section is emplaced on the first section and contains a series of hollow metal tubular connectors or posts. These are inserted over the metal tubular posts of the header containing the leads and are crimped so that the posts of the transistor header as well as the leads are connected both electrically and mechanically to the tubular posts extending from the second housing section. Based on the above noted configuration, the housing sections serve to hold the transducer as mounted in the header in a firm and fixed position while enabling installation and interconnection of the transistor header in a rapid and simple manner based on the fact that the leads emanating from the header are crimped internally within the housing sections.
Abstract translation: 传感器外壳由第一和第二部分组成。 第一部分包含安装晶体管集管的内部空心。 安装在第一部分中的头部通过锁定环或其他布置牢固地固定在该部分内。 位于第一部分的内部中空部分中的印刷电路板在其表面上具有多个孔，每个孔与相对表面上的延伸管状柱连通。 从集管引出的引导通过印刷电路板中的孔并延伸到管状柱中。 第二壳体部分放置在第一部分上并且包含一系列中空金属管状连接器或柱。 这些插入到包含引线的插头的金属管状柱上，并且被压接，使得晶体管集管的端子以及引线电连接和机械连接到从第二壳体部分延伸的管状柱体。 基于上述配置，壳体部分用于将固定在集管中的换能器固定在固定位置，同时能够以快速且简单的方式安装和互连晶体管集管，基于以下事实：从 插头内部压接在外壳部分内。
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公开(公告)号：US4483196A
公开(公告)日：1984-11-20
申请号：US472851
申请日：1983-03-07
Applicant: Anthony D. Kurtz , Joseph R. Mallon, Jr. , Timothy A. Nunn
Inventor： Anthony D. Kurtz , Joseph R. Mallon, Jr. , Timothy A. Nunn
CPC classification number: G01L9/0052 , G01L9/0002
Abstract: A pressure transducer employs a tubular glass structure of a "D" shaped cross section, with the arcuate section of the "D" shaped configuration being substantially thicker than the base section. A sensor array is positioned on the underside of the base section while a pressure conducting fluid is directed through the tubular member to provide deflection of the base to cause the sensor array to provide an output indicative of pressure variations in the fluid medium. The sensor array as positioned on the underside of the base is both electrically and mechanically isolated from the pressure conducting medium.
Abstract translation: 压力传感器采用“D”形横截面的管状玻璃结构，“D”形构造的弓形部分基本上比基部部分厚。 传感器阵列定位在基部的下侧，同时压力传导流体被引导通过管状构件以提供基部的偏转，以使传感器阵列提供指示流体介质中的压力变化的输出。 位于基座下侧的传感器阵列与导电介质电气和机械隔离。
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Patent Agency Ranking
公开(公告)号：US3930823A
公开(公告)日：1976-01-06
申请号：US358143
申请日：1973-05-07
Applicant: Anthony D. Kurtz , Joseph R. Mallon, Jr.
Inventor： Anthony D. Kurtz , Joseph R. Mallon, Jr.
CPC classification number: G01L9/0055
Abstract: A dielectrically isolated pressure transducer comprises a silicon diaphragm having on a surface thereof at least one piezoresistive sensor mounted in close proximity with a dielectric insulator, the diaphragm is secured about a non-active peripheral area to an annular ring housing by a glass bond fabricated from a glass material having a low melting temperature when compared to ordinary glass.
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公开(公告)号：US5062302A
公开(公告)日：1991-11-05
申请号：US574387
申请日：1990-08-27
Applicant: Kurt E. Petersen , Phillip W. Barth , Janusz Bryzek , Joseph R. Mallon, Jr.
Inventor： Kurt E. Petersen , Phillip W. Barth , Janusz Bryzek , Joseph R. Mallon, Jr.
CPC classification number: G01L19/0618 , G01L19/0636 , G01L9/0042 , G01L9/0054 , G01L9/0073 , Y10S73/04
Abstract: An electromechanical sensor is provided which comprises: first semiconductor wafer including a first stop surface residing in a first shallow recessed region of the first wafer; a second semiconductor wafer; wherein the first and second semiconductor wafers are laminated together such that the first recessed region of the first wafer and the second wafer define a first chamber in which the first stop surface and the second wafer are disposed close enough together such that the first stop surface restrains the second wafer from deflecting beyond the first stop surface; and an apparatus for measuring deflection of the second wafer.
Abstract translation: 提供了一种机电传感器，其包括：第一半导体晶片，其包括位于第一晶片的第一浅凹陷区域中的第一停止表面; 第二半导体晶片; 其中所述第一和第二半导体晶片被层压在一起，使得所述第一晶片和所述第二晶片的所述第一凹陷区域限定第一室，其中所述第一止动表面和所述第二晶片被设置得足够靠近在一起，使得所述第一止动表面限制 所述第二晶片从所述第一止动表面偏转; 以及用于测量第二晶片的偏转的装置。
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公开(公告)号：US4879903A
公开(公告)日：1989-11-14
申请号：US241030
申请日：1988-09-02
Applicant: Jeffery E. Ramsey , Janusz Bryzek , Joseph R. Mallon, Jr.
Inventor： Jeffery E. Ramsey , Janusz Bryzek , Joseph R. Mallon, Jr.
IPC: G01L9/00
CPC classification number: G01L19/0084 , G01L19/142 , Y10S73/04 , Y10T29/49103
Abstract: A pressure measurement apparatus is provided which comprises: a housing formed from a thermoplastic material and defining a chamber, the housing including an upper wall region and a lower wall region and first and second opposed side-wall regions disposed between the upper and lower wall regions, the upper wall region including first and second vent ports formed therein; a semiconductor pressure transducer mounted within the chamber, the pressure transducer including a first surface in communication with the first vent port and including a second surface in communication with the second vent port; at least one first pin terminal extending through the first side-wall region, the at least one first pin terminal including a short segment within the chamber and an elongated segment outside the chamber; and at least one second pin terminal extending through the second side-wall region, the at least one second pin terminal including a short segment within the chamber and an elongated segment outside the chamber.
Abstract translation: 提供了一种压力测量装置，其包括：由热塑性材料形成并限定腔室的壳体，所述壳体包括上壁区域和下壁区域以及设置在上壁区域和下壁区域之间的第一和第二相对侧壁区域 所述上壁区域包括形成在其中的第一和第二排气口; 安装在所述腔室内的半导体压力传感器，所述压力传感器包括与所述第一通气口连通的第一表面，并且包括与所述第二通气口连通的第二表面; 延伸穿过第一侧壁区域的至少一个第一引脚端子，所述至少一个第一引脚端子包括在该腔室内的短段和在腔室外部的细长段; 以及延伸穿过所述第二侧壁区域的至少一个第二销端子，所述至少一个第二销端子包括所述室内的短段和所述室外的细长段。
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公开(公告)号：US4481497A
公开(公告)日：1984-11-06
申请号：US437109
申请日：1982-10-27
Applicant: Anthony D. Kurtz , Joseph R. Mallon, Jr. , Timothy A. Nunn
Inventor： Anthony D. Kurtz , Joseph R. Mallon, Jr. , Timothy A. Nunn
CPC classification number: G01L19/148 , G01L9/0055 , Y10T29/49103
Abstract: A hybrid transducer employing a ceramic substrate having on a surface a suitable geometry for defining an active or clamped area, a semiconductor strain gage is positioned on said substrate within said active area and connections are made to said gage by conductors printed on said substrate by thick or thin film techniques. Thick film printing techniques or thin film deposition techniques are employed to print the conductors, terminal areas, compensating resistors and stop members.
Abstract translation: 一种采用陶瓷衬底的混合传感器，其在表面上具有用于限定有源或夹紧区域的合适几何形状，半导体应变计定位在所述有源区域内的所述衬底上，并且通过厚度印刷在所述衬底上的导体与所述量规连接 或薄膜技术。 使用厚膜印刷技术或薄膜沉积技术来印刷导体，端子区域，补偿电阻器和阻挡件。
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公开(公告)号：US5060526A
公开(公告)日：1991-10-29
申请号：US358771
申请日：1989-05-30
Applicant: Phillip W. Barth , Kurt E. Petersen , Joseph R. Mallon, Jr.
Inventor： Phillip W. Barth , Kurt E. Petersen , Joseph R. Mallon, Jr.
CPC classification number: G01L9/0019
Abstract: An electromechanical sensor is provided which comprises: a first silicon wafer which defines a resonant element; wherein the resonant element is doped with approximately the same impurity concentration as a background dopant concentration of the first wafer; and a second single crystal wafer which defines a device for coupling mechanical stress from the second wafer to the resonant element; wherein the first and second wafers are fusion bonded together.
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