摘要:
A liquid crystal display module device includes a frame receiving a backlight assembly provided with optical sheets, a liquid crystal panel mounted onto the frame, a bottom case affixed to the frame, a top case enclosing edge portions of the liquid crystal panel and coupled to the bottom case, and a clip inserted into a first region of a coupled portion of the bottom case and the top case.
摘要:
A backlight assembly for a liquid crystal display includes a lamp to irradiate light; a light guide plate to guide incident light from the lamp to a display panel; a plurality of optical sheets disposed in front of the light guide plate, and each optical sheet having an eye part with a through-hole; a guide panel to house the lamp, and having a jaw-like step part to mount the light guide plate and the optical sheets; and an adhesive pad having a lower end that passes through the through-hole and provided on the guide panel, and an upper end that adheres to the display panel.
摘要:
Disclosed is a surface plasmon optic device that has a periodic array of apertures in a dielectric substrate and a metal film formed on the dielectric substrate and emits light from metal-air interface. The surface plasmon optic device includes a surface plasmon generating apparatus, a surface plasmon detecting apparatus, a surface plasmon controlling apparatus, an etching apparatus, etc. if a metal diffraction grating is disposed on the metal film having a well-defined interface, propagation of the surface plasmon can be efficiently reflected, divided and controlled. Further, radiating surface plasmon having a half period of a lattice constant formed at air-metal (1, 0) can be preserved at a distance of at least a few micron.
摘要:
Disclosed is a surface plasmon optic device that has a periodic array of apertures in a dielectric substrate and a metal film formed on the dielectric substrate and emits light from metal-air interface. The surface plasmon optic device includes a surface plasmon generating apparatus, a surface plasmon detecting apparatus, a surface plasmon controlling apparatus, an etching apparatus, etc. if a metal diffraction grating is disposed on the metal film having a well-defined interface, propagation of the surface plasmon can be efficiently reflected, divided and controlled. Further, radiating surface plasmon having a half period of a lattice constant formed at air-metal (1, 0) can be preserved at a distance of at least a few micron.
摘要:
The present invention provides methods and pharmaceutical compositions for inhibiting expressions of HIF and HIF regulated genes, inhibiting angiogenesis, inducing cell cycle arrest in tumor cells, and treating cell proliferating diseases or conditions.
摘要:
The present invention provides methods and pharmaceutical compositions for inhibiting expressions of HIF and HIF regulated genes, inhibiting angiogenesis, inducing cell cycle arrest in tumor cells, and treating cell proliferating diseases or conditions.
摘要:
The present invention provides methods and pharmaceutical compositions for inhibiting expressions of HIF-1 and HIF-1-regulated genes, angiogenesis, tumor growth, or tumor progression/metastasis comprising contacting the tumor cells or tissue with a composition comprising 3-(5′-hydroxymethyl-2′-furyl)-1-benzylindazole, or a novel derivative thereof.
摘要:
The present invention relates to a flexible single-crystal film and a method of manufacturing the same from a single-crystal wafer. That is, the present invention can manufacture a silicon-on-insulator (SOI) wafer comprising a base wafer, one or more buried insulator layers, and a single-crystal layer into a flexible single-crystal film with a desired thickness by employing various wafer thinning techniques. The method for manufacturing a flexible film comprises the steps of (i) providing a SOI wafer comprising a base wafer, one or more buried insulator layers on the base wafer, and a single-crystal layer on said one or more buried insulator layers, (ii) forming one or more protective insulator layers on said single-crystal layer, (iii) removing said base wafer, and (iv) removing one or more of the insulator layers.