公开(公告)号：US20090022452A1

公开(公告)日：2009-01-22

申请号：US12240543

申请日：2008-09-29

Applicant: David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, JR. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Drew D. Perkins

Inventor： David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, JR. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Drew D. Perkins

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0612 ,  H01S5/12 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04J14/02

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract translation: 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。

公开(公告)号：US06886993B2

公开(公告)日：2005-05-03

申请号：US10077003

申请日：2002-02-14

Applicant: Jean-Marc Verdiell ,  Eric Zbinden ,  Robert Kohler ,  Jonas Webjorn ,  Sylvain Colin ,  Marc Epitaux

Inventor： Jean-Marc Verdiell ,  Eric Zbinden ,  Robert Kohler ,  Jonas Webjorn ,  Sylvain Colin ,  Marc Epitaux

IPC: G02B6/42 ,  G02B6/36

CPC classification number: G02B6/4237 ,  G02B6/4208 ,  G02B6/4226

Abstract: A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

Abstract translation: 描述了一个包。 在一个实施例中，包装包括多个光学元件和多个挠曲件，其中至少一个光学元件附接到每个挠曲件。 光学元件可以彼此对准。 在替代实施例中，多个光学元件附接到单个挠曲件。

公开(公告)号：US06585427B2

公开(公告)日：2003-07-01

申请号：US09885240

申请日：2001-06-19

Applicant: Marc Finot ,  Marc Epitaux ,  Jonas Webjorn ,  Jean-Marc Verdiell ,  Robert Kohler

Inventor： Marc Finot ,  Marc Epitaux ,  Jonas Webjorn ,  Jean-Marc Verdiell ,  Robert Kohler

IPC: G02B600

CPC classification number: G02B6/4237 ,  G02B6/4204 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4248 ,  G02B6/4251 ,  G02B6/4257 ,  G02B6/4265

Abstract: A flexure and package including the same are provided. In one embodiment, the flexure is coupled to a second optical element and a substrate to maintain the second optical element in alignment with a first optical element. The flexure comprises a body, a pair of front and back legs. The attachment of the rear legs to the substrate causes the flexure to move from a first flexure position to a second flexure position, the distance between the first flexure position and the second flexure position equaling an offset distance. A specified length of the body is chosen such that the offset distance causes a second offset distance of the second optical component held by the flexure, and this second offset distance is within a specified range. The second offset distance is equal to the difference between a primary second optical component position and a secondary second optical component position.

Abstract translation: 提供了包括其的挠曲和包装。 在一个实施例中，挠曲件耦合到第二光学元件和基板，以保持第二光学元件与第一光学元件对准。 挠曲件包括主体，一对前后腿。 后腿附接到基底使得弯曲部从第一弯曲位置移动到第二弯曲位置，第一弯曲位置与第二挠曲位置之间的距离等于偏移距离。 选择身体的指定长度，使得偏移距离导致由弯曲部保持的第二光学部件的第二偏移距离，并且该第二偏移距离在特定范围内。 第二偏移距离等于初级第二光学部件位置和次级第二光学部件位置之间的差。

公开(公告)号：US07773837B2

公开(公告)日：2010-08-10

申请号：US12240543

申请日：2008-09-29

Applicant: David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Drew D. Perkins

Inventor： David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Drew D. Perkins

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0612 ,  H01S5/12 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04J14/02

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract translation: 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。

公开(公告)号：US07680368B2

公开(公告)日：2010-03-16

申请号：US11773960

申请日：2007-07-06

Applicant: David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Drew D. Perkins

Inventor： David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Drew D. Perkins

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0612 ,  H01S5/12 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04J14/02

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract translation: 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。

公开(公告)号：US07672546B2

公开(公告)日：2010-03-02

申请号：US11767311

申请日：2007-06-22

Applicant: David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Marco E. Sosa

Inventor： David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Marco E. Sosa

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0612 ,  H01S5/12 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04J14/02

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract translation: 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。

公开(公告)号：US07519246B2

公开(公告)日：2009-04-14

申请号：US11869420

申请日：2007-10-09

Applicant: David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Ting-Kuang Chiang ,  Robert Grencavich ,  Vinh D. Nguyen ,  Donald J. Pavinski, Jr. ,  Marco E. Sosa

Inventor： David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Ting-Kuang Chiang ,  Robert Grencavich ,  Vinh D. Nguyen ,  Donald J. Pavinski, Jr. ,  Marco E. Sosa

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0612 ,  H01S5/12 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04J14/02

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract translation: 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。

公开(公告)号：US07062114B2

公开(公告)日：2006-06-13

申请号：US10852988

申请日：2004-05-25

Applicant: Jonas Webjorn ,  Robert Grencavich ,  Vinh D. Nguyen ,  Donald J. Pavinski, Jr.

Inventor： Jonas Webjorn ,  Robert Grencavich ,  Vinh D. Nguyen ,  Donald J. Pavinski, Jr.

IPC: G02B6/12

CPC classification number: G02B6/12011 ,  B82Y20/00 ,  G01R31/31728 ,  G01R31/318511 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12021 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  G02B6/4204 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  G02F2203/69 ,  H01L31/125 ,  H01S5/0014 ,  H01S5/0085 ,  H01S5/02248 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/06832 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/3408 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/2914 ,  H04B10/50 ,  H04J14/02 ,  H04J14/0246 ,  H04J14/025 ,  H04J14/0258 ,  H04J14/0265 ,  H04J14/0276 ,  H04J14/0282

Abstract: A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.

Abstract translation: 具有形成在芯片的主表面上的多个电光部件的光子集成电路（PIC）芯片和包括在芯片的主表面上延伸的基板的基板，该基板在基板和主体之间形成气隙 表面，基板支持电引线，用于电连接到芯片主表面上的一些电光元件。

公开(公告)号：US06511236B1

公开(公告)日：2003-01-28

申请号：US09390945

申请日：1999-09-07

Applicant: Jonas Webjorn ,  Jean-Marc Verdiell

Inventor： Jonas Webjorn ,  Jean-Marc Verdiell

IPC: G02B636

CPC classification number: G02B6/4226 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4225 ,  G02B6/4237 ,  G02B6/424 ,  G02B6/4248 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package for optical components and a method for making the package are disclosed. The package comprises a quasi-planar substrate having a positioning floor, a platform and an optional ring frame of precisely determined height. Optical components picked and placed on a substrate floor, a raised platform and frame. A flexure assembly allows fine positioning of components requiring critical optical alignment.

Abstract translation: 公开了一种用于光学部件的封装以及用于制造封装的方法。 该包装包括具有定位底板，平台和精确确定高度的可选环形框架的准平面基板。 光学元件拾取并放置在基板地板，升高的平台和框架上。 弯曲组件允许精细定位需要关键光学对准的部件。

公开(公告)号：US07512295B2

公开(公告)日：2009-03-31

申请号：US11766077

申请日：2007-06-20

Applicant: David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Drew D. Perkins

Inventor： David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Drew D. Perkins

IPC: G02B6/12

CPC classification number: G02B6/12011 ,  B82Y20/00 ,  G01R31/31728 ,  G01R31/318511 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12021 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  G02B6/4204 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  G02F2203/69 ,  H01L31/125 ,  H01S5/0014 ,  H01S5/0085 ,  H01S5/02248 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/06832 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/3408 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/2914 ,  H04B10/50 ,  H04J14/02 ,  H04J14/0246 ,  H04J14/025 ,  H04J14/0258 ,  H04J14/0265 ,  H04J14/0276 ,  H04J14/0282

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract translation: 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。