公开(公告)号：US5669775A

公开(公告)日：1997-09-23

申请号：US524361

申请日：1995-09-05

Applicant: Jeffrey Scott Campbell ,  James D. Herard ,  Ronald Peter Nowak ,  John Robert Slack ,  David Brian Stone

Inventor： Jeffrey Scott Campbell ,  James D. Herard ,  Ronald Peter Nowak ,  John Robert Slack ,  David Brian Stone

IPC: H01R12/70 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H01R9/09

CPC classification number: H01R23/661 ,  H05K1/189 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/2009 ,  H05K3/0058

Abstract: A support structure is attached to the front or back side of a flexible circuit by direct mounting to the flexible circuit flat ribbon cable, thereby providing a stress-free region of the cable in which the flexible circuit electrical components can be mounted. The support structure comprises a flat ring that is attached to the cable by adhesive, soldering, or mechanical fastening. The flat ring mounts on one side of the flat ribbon cable and encloses an area of the cable that is sufficiently large for the mounting of the flexible circuit electrical components. The flat ribbon cable within the enclosed area is held flat and free from stress, even as the cable is handled. Thus, any components mounted within the enclosed area are not subjected to bending moments. The invention also can be incorporated into cable connectors, such as multi-pin connectors at the ends of cables, and can include support hooks and air cooling baffles.

Abstract translation: 支撑结构通过直接安装到柔性电路扁平带状电缆而附接到柔性电路的前侧或后侧，由此提供电缆的无应力区域，其中可安装柔性电路电气部件。 支撑结构包括通过粘合剂，焊接或机械紧固附接到电缆的平环。 扁平环安装在扁平带状电缆的一侧，并且包围电缆的足够大的区域以用于安装柔性电路电气部件。 封闭区域内的扁平带状电缆保持平坦，无应力，即使电缆处理。 因此，安装在封闭区域内的任何部件都不会受到弯矩的影响。 本发明还可以结合到电缆连接器中，例如在电缆端部处的多针连接器，并且可以包括支撑钩和空气冷却挡板。

公开(公告)号：US6037658A

公开(公告)日：2000-03-14

申请号：US944615

申请日：1997-10-07

Applicant: William Louis Brodsky ,  Glenn Lee Kehley ,  Sanjeev Balwant Sathe ,  John Robert Slack

Inventor： William Louis Brodsky ,  Glenn Lee Kehley ,  Sanjeev Balwant Sathe ,  John Robert Slack

IPC: H01L23/42 ,  H01L23/433 ,  H01L23/10 ,  H01L23/34

CPC classification number: H01L24/31 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29076 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/83051 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/10253

Abstract: An electronic package including as part thereof a thermally conductive arrangement for restricting thermal fluid material motion about a heat-generating device, thereby assuring effective heat transference from the heat-generating device (e.g., module) to a cooling member (e.g., spaced heat sink), this arrangement preferably including: (1) a thermal fluid (e.g., thermal grease); and (2) structural elements (e.g., wire mesh, heat sink ridges, etc.). For restricting fluid movement, sealing structures (e.g., external gaskets) may be used to further assure fluid containment to a specified location. Pressure generation means (e.g., a plunger) can be used to increase fluid pressure when pressure droppages occur.

Abstract translation: 一种电子封装，其包括作为其导热装置的一部分，用于限制围绕发热装置的热流体材料运动，从而确保从发热装置（例如，模块）到冷却构件（例如，间隔开的散热器）的有效热传递 ），该布置优选地包括：（1）热流体（例如导热油脂）; 和（2）结构元件（例如，丝网，散热片脊等）。 为了限制流体运动，可以使用密封结构（例如，外部垫圈）来进一步确保流体容纳到指定位置。 压力产生装置（例如，柱塞）可用于在出现压力降时增加流体压力。