知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

17 条记录 (耗时 0.019 秒)

    MOBILE DEVICE PAYMENT SYSTEM AND METHOD
    3.
    发明申请
    MOBILE DEVICE PAYMENT SYSTEM AND METHOD 有权

    公开(公告)号：US20210383446A1

    公开(公告)日：2021-12-09

    申请号：US17408467

    申请日：2021-08-22

    申请人： Andrew A. Boemi ,  John L. Snyder ,  Peter C. Vogelberger

    发明人： Andrew A. Boemi ,  John L. Snyder ,  Peter C. Vogelberger

    IPC分类号： G06Q30/06 ,  G06Q20/32 ,  G06Q20/34 ,  G06Q10/08 ,  G06Q20/10 ,  G06Q20/12 ,  G06Q20/20 ,  G06Q20/24

    摘要： A mobile device payment system and method, the method for a mobile device user to purchase goods/services from merchants with financing by a mobile device manufacturer including: providing a mobile device; establishing a user account; establishing merchant accounts; transforming the merchant accounts into a universal merchant account data set; providing the universal merchant account data set to the mobile device user; storing the universal merchant account data set; requesting the mobile device manufacturer to load consumer credit; loading the credit amount; identifying goods/services for purchase; determining a total price for the identified goods/services and a merchant identifier associated with the selected merchant; actuating a purchase button; retrieving merchant bank deposit instructions; retrieving purchase credit; and routing the retrieved credit to the selected merchant in accordance with the retrieved merchant credit deposit instructions.

    Method and apparatus for correcting offsets of two detectors using respective functions of a difference
    5.
    发明授权
    Method and apparatus for correcting offsets of two detectors using respective functions of a difference 失效
    使用差异的各种功能来校正两个检测器的偏移的方法和装置

    公开(公告)号：US06011584A

    公开(公告)日：2000-01-04

    申请号：US960053

    申请日：1997-10-29

    申请人： Rustin W. Allred ,  John B. Allen ,  John L. Snyder, III ,  Donald C. Whitney ,  Anthony L. Leatham

    发明人： Rustin W. Allred ,  John B. Allen ,  John L. Snyder, III ,  Donald C. Whitney ,  Anthony L. Leatham

    IPC分类号： G01J1/02 ,  G01J1/38 ,  G01J5/48 ,  H04N5/217 ,  H04N5/33 ,  H04N5/349 ,  H04N5/365 ,  H04N5/367

    CPC分类号： H04N5/3656 ,  H04N5/33 ,  H04N5/367 ,  H04N5/349

    摘要： A dithered offset correction method wherein, according to a first embodiment, updates are made of the offset correction during each iteration and, after four iterations, the offset for each pixel or detector element is updated from all of its neighbors to provide faster convergence than is obtainable by the prior art. In accordance with a second embodiment, the offset for each detector element is updated for every iteration and, for each update, the update is made with information from an entire row or an entire column of data. After four iterations, each offset has been updated with information from every detector element in the focal plane array. This provides even more rapid convergence compared to the prior art.

    摘要翻译： 抖动偏移校正方法，其中，根据第一实施例，在每次迭代期间对偏移校正进行更新，并且在四次迭代之后，从其所有邻居更新每个像素或检测器元件的偏移，以提供更快的收敛 可通过现有技术获得。 根据第二实施例，针对每个迭代更新每个检测器元件的偏移，并且对于每个更新，使用来自整个行或整个数据列的信息进行更新。 在四次迭代之后，利用来自焦平面阵列中的每个检测器元件的信息来更新每个偏移。 与现有技术相比，这提供了更快速的收敛。

    Process for the manufacture of metal joining paste
    6.
    发明授权
    Process for the manufacture of metal joining paste 失效
    金属接合膏的制造方法

    公开(公告)号：US4218248A

    公开(公告)日：1980-08-19

    申请号：US897931

    申请日：1978-04-21

    申请人： John L. Snyder ,  Paul D. Johnson

    发明人： John L. Snyder ,  Paul D. Johnson

    IPC分类号： B23K35/22 ,  B23K35/02 ,  B23K35/36 ,  C09D5/10

    CPC分类号： B23K35/36 ,  B23K35/025

    摘要： A process for making metal joining paste, particularly suitable for precision soldering and brazing, which comprises preparing a paste vehicle by mixing together, at an elevated temperature, paste ingredients including solvent, flux and specialized additives, cooling said vehicle, and blending metal powder therewith. Blending preferably is subsequent to cooling, but can be simultaneous with cooling, though without significant exposure of the metal to the vehicle at elevated temperature. Cooling of the vehicle takes place under shock cooling conditions, such as to obtain a fine particle size suspension, and is to a final temperature inhibitive of significant reaction of metal powder with vehicle acidic constituents. The present invention provides increased viscosity control and suspension stability necessary for fine bore automatic dispensing of the paste.

    摘要翻译： 一种制造金属接合膏的方法，特别适用于精密焊接和钎焊，其包括通过在升高的温度下将包括溶剂，助熔剂和专用添加剂的糊料成分混合在一起制备糊剂载体，冷却所述载体并与其混合金属粉末 。 混合优选在冷却之后，但是可以与冷却同时进行，尽管在高温下没有将金属显着暴露于车辆。 车辆的冷却在冲击冷却条件下进行，例如获得细粒度的悬浮液，并且是对金属粉末与载体酸性成分的显着反应的最终温度抑制。 本发明提供了增加粘度控制和悬浮液稳定性，这对孔的微孔自动分配是必需的。

    Mobile device payment system and method
    7.
    发明授权
    Mobile device payment system and method 有权

    公开(公告)号：US10262351B2

    公开(公告)日：2019-04-16

    申请号：US15794132

    申请日：2017-10-26

    申请人： Andrew A. Boemi ,  John L. Snyder ,  Peter C. Vogelberger

    发明人： Andrew A. Boemi ,  John L. Snyder ,  Peter C. Vogelberger

    IPC分类号： G06Q30/00 ,  G06Q30/06 ,  G06Q20/32 ,  G06Q20/34 ,  G06Q10/08 ,  G06Q20/10 ,  G06Q20/12 ,  G06Q20/20 ,  G06Q20/24

    摘要： A mobile device payment system and method, the method for a mobile device user to purchase goods/services from merchants with financing by a mobile device manufacturer including: providing a mobile device; establishing a user account; establishing merchant accounts; transforming the merchant accounts into a universal merchant account data set; providing the universal merchant account data set to the mobile device user; storing the universal merchant account data set; requesting the mobile device manufacturer to load consumer credit; loading the credit amount; identifying goods/services for purchase; determining a total price for the identified goods/services and a merchant identifier associated with the selected merchant; actuating a purchase button; retrieving merchant bank deposit instructions; retrieving purchase credit; and routing the retrieved credit to the selected merchant in accordance with the retrieved merchant credit deposit instructions.

    Copper alloy brazing paste
    8.
    发明授权
    Copper alloy brazing paste 失效
    铜合金钎焊膏

    公开(公告)号：US4231815A

    公开(公告)日：1980-11-04

    申请号：US65374

    申请日：1979-08-09

    申请人： John L. Snyder

    发明人： John L. Snyder

    IPC分类号： B23K35/02 ,  B23K35/30 ,  B23K35/34

    CPC分类号： B23K35/025 ,  B23K35/302

    摘要： Copper-manganese alloy brazing pastes can be substantially improved by the inclusion of a minor amount of silicon in the alloy. The brazing alloy can contain by weight between about 0.5% and 3% silicon to provide a brazing composition for brazing at temperatures between about 1650.degree. C. and 1850.degree. C.

    摘要翻译： 铜 - 锰合金钎焊膏可以通过在合金中加入少量硅来显着提高。 钎焊合金可以含有约0.5％至3％的硅，以提供在约1650℃至1850℃之间的钎焊钎焊组合物。