公开(公告)号：US06228233B1

公开(公告)日：2001-05-08

申请号：US09201796

申请日：1998-11-30

申请人： Jayant Lakshmikanthan ,  Joe Stevens

发明人： Jayant Lakshmikanthan ,  Joe Stevens

IPC分类号： C25D1700

CPC分类号： C25D17/06 ,  C25D7/123 ,  C25D17/001

摘要： The present invention provides a bladder assembly 130 for use in an electroplating cell 100. The bladder assembly 130 comprises a mounting plate 132, a bladder 136, and an annular manifold 146. One or more inlets 142 are formed in the mounting plate 146 and are coupled to a fluid source 138. The manifold 146 is adapted to be received in a recess 140 formed in the lower face of the mounting plate 132 and secures the bladder 136 thereto. Outlets 154 formed in the manifold 146 communicate with the inlets 142 to route a fluid from the fluid source 138 into the bladder 136 to inflate the same. A substrate 121 disposed on a contact ring 114 opposite the bladder 136 is thereby selectively biased toward a seating surface of the contact ring 114. A pumping system 159 coupled at the backside of the substrate 121 provides a pressure or vacuum condition.

摘要翻译： 本发明提供一种用于电镀单元100中的气囊组件130.气囊组件130包括安装板132，气囊136和环形歧管146.一个或多个入口142形成在安装板146中，并且是 联接到流体源138.歧管146适于容纳在形成在安装板132的下表面中的凹部140中并将囊136固定到其上。 形成在歧管146中的出口154与入口142连通，以将流体从流体源138引导到气囊136中以使其膨胀。 因此，设置在与囊状物136相对的接触环114上的基底121被选择性地朝向接触环114的就座表面偏置。耦合在基底121的背面的泵送系统159提供压力或真空条件。

公开(公告)号：US5810931A

公开(公告)日：1998-09-22

申请号：US692932

申请日：1996-07-30

申请人： Joe Stevens ,  Howard Grunes ,  Igor Kogan

发明人： Joe Stevens ,  Howard Grunes ,  Igor Kogan

IPC分类号： H01L21/683 ,  H01L21/203 ,  H01L21/205 ,  H01L21/687 ,  C23C16/00 ,  B05C13/00 ,  C23C14/00 ,  C23F1/02

CPC分类号： H01L21/68721

摘要： The present invention provides a method and apparatus for protecting the edge of a substrate and securing the substrate to the support member during processing. The present invention preferably provides minimal contact with the substrate and provides improved edge exclusion. Support tabs extend inwardly from the lower roof surface to support the apparatus on the substrate and the inner terminus of the apparatus approaches the edge of the substrate to provide the improved edge exclusion. A variable height lower roof surface is provided over the edge of the substrate to provide an effective increased roof aspect ratio (width of the roof:height of the roof above the substrate) over the edge of the substrate which reduces the likelihood that a bridging layer will form between the apparatus and the substrate or beyond the substrate.

摘要翻译： 本发明提供了一种用于在加工过程中保护基板的边缘并将基板固定到支撑部件上的方法和装置。 本发明优选提供与基底的最小接触并提供改进的边缘排除。 支撑片从下屋顶表面向内延伸以支撑衬底上的装置，并且装置的内端靠近衬底的边缘以提供改进的边缘排除。 在衬底的边缘上设置可变的高度较低的屋顶表面，以在衬底的边缘上提供有效增加的屋顶纵横比（屋顶的宽度：衬底上方的屋顶的高度），这降低了桥接层 将在该设备和该基板之间或超过该基板之间形成。

公开(公告)号：US06516815B1

公开(公告)日：2003-02-11

申请号：US09350212

申请日：1999-07-09

申请人： Joe Stevens ,  Donald Olgado ,  Alex Ko ,  Yeuk-Fai Edwin Mok

发明人： Joe Stevens ,  Donald Olgado ,  Alex Ko ,  Yeuk-Fai Edwin Mok

IPC分类号： B08B302

CPC分类号： H01L21/6708 ,  Y10S134/902

摘要： The present invention provides an apparatus for etching a substrate, comprising: a container; a substrate support disposed in the container; a rotation actuator attached to the substrate support; and a fluid delivery assembly disposed in the container to deliver an etchant to a peripheral portion of a substrate disposed on the substrate support. Preferably, the substrate support comprises a vacuum chuck and the fluid delivery assembly comprises one or more nozzles. The invention also provide a method for etching a substrate, comprising: rotating a substrate positioned on a rotatable substrate support; and delivering an etchant to a peripheral portion of the substrate. Preferably, the substrate is rotated at between about 100 rpm and about 1000 rpm, and the etchant is delivered in a direction that is substantially tangent to the peripheral portion of the substrate at an incident angle between about 0 degrees and about 45 degrees from a surface of substrate.

摘要翻译： 本发明提供了一种用于蚀刻基板的设备，包括：容器; 设置在所述容器中的基板支撑件; 附接到基板支撑件的旋转致动器; 以及设置在所述容器中以将蚀刻剂输送到设置在所述基板支撑件上的基板的周边部分的流体输送组件。 优选地，衬底支撑件包括真空卡盘，并且流体输送组件包括一个或多个喷嘴。 本发明还提供了一种用于蚀刻衬底的方法，包括：旋转位于可旋转衬底支架上的衬底; 以及向衬底的周边部分输送蚀刻剂。 优选地，基板在约100rpm和约1000rpm之间旋转，并且蚀刻剂沿着与基板的周边部分基本相切的方向以距离表面大约0度至大约45度的入射角度被输送 的底物。

公开(公告)号：US06267853B1

公开(公告)日：2001-07-31

申请号：US09350210

申请日：1999-07-09

申请人： Yezdi Dordi ,  Muhammad Atif Malik ,  Henan Hao ,  Timothy H. Franklin ,  Joe Stevens ,  Donald Olgado

发明人： Yezdi Dordi ,  Muhammad Atif Malik ,  Henan Hao ,  Timothy H. Franklin ,  Joe Stevens ,  Donald Olgado

IPC分类号： C25B1500

CPC分类号： C25D17/001 ,  C25D7/123 ,  H01L21/2885 ,  H05K3/241

摘要： The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes an edge bead removal/spin-rinse-dry (EBR/SRD) station disposed on the mainframe adjacent the loading station, a rapid thermal anneal chamber attached to the loading station, a seed layer repair station disposed on the mainframe, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

摘要翻译： 本发明提供了一种电化学沉积系统，其被设计成具有可扩展以适应未来设计和间隙填充要求的柔性结构，并提供令人满意的生产量以满足其它处理系统的需求。 电化学沉积系统通常包括具有主机晶片传送机器人的主机，与主机连接设置的加载站，与主机连接设置的一个或多个处理单元，以及流体连接到该主机的一个或多个 电加工电池。 优选地，电化学沉积系统包括设置在与装载站相邻的主机上的边缘珠去除/旋转干燥（EBR / SRD）站，附接到装载站的快速热退火室，种子层修复站 设置在主机上，以及用于控制电化学沉积过程和电化学沉积系统的部件的系统控制器。

公开(公告)号：US06251236B1

公开(公告)日：2001-06-26

申请号：US09201486

申请日：1998-11-30

申请人： Joe Stevens

发明人： Joe Stevens

IPC分类号： C25D1700

CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

摘要： The present invention provides a cathode contact ring for use in an electroplating cell. The contact ring comprises an insulative body having a substrate seating surface and one or more conducting members disposed in the insulative body. The conducting members provide discrete conducting pathways and are defined by inner and outer conducting pads linked by conducting members. A power supply is attached to the conducting members to deliver current and voltage to a substrate during processing. The substrate seating surface comprises an isolation gasket extending diametrically interior to the inner conducting pads such that electrolyte is prevented from depositing on the backside of the substrate. The insulative body provides seating surfaces for other cell components, such as the lid, so that no additional insulating material is needed to isolate the components. A portion of the insulative body is disposed through a plurality of holes formed in the conducting framework. The holes provide increased integration and, consequently, increased strength and durability of the contact ring.

摘要翻译： 本发明提供一种用于电镀电池的阴极接触环。 接触环包括具有基板安置表面的绝缘体和设置在绝缘体内的一个或多个导电构件。 导电构件提供离散的导电路径，并且由通过导电构件连接的内部和外部导电垫限定。 电源连接到导电构件，以在处理期间将电流和电压传递到衬底。 衬底安置表面包括在内部传导焊盘的内部直径延伸的隔离垫片，使得防止电解质沉积在衬底的背面上。 绝缘体为诸如盖的其它电池组件提供座面，使得不需要额外的绝缘材料来隔离组件。 绝缘体的一部分通过形成在导电框架中的多个孔布置。 这些孔提供增加的一体化，并因此提高接触环的强度和耐久性。

公开(公告)号：US06599402B2

公开(公告)日：2003-07-29

申请号：US10178469

申请日：2002-06-24

申请人： Yezdi Dordi ,  Joe Stevens ,  Roy Edwards ,  Bob Lowrance ,  Michael Sugarman ,  Mark Denome

发明人： Yezdi Dordi ,  Joe Stevens ,  Roy Edwards ,  Bob Lowrance ,  Michael Sugarman ,  Mark Denome

IPC分类号： C25D1706

CPC分类号： H01L21/68721 ,  C25D5/20 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/08 ,  C25D21/00 ,  C25D21/18 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/68792

摘要： An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

公开(公告)号：US5993170A

公开(公告)日：1999-11-30

申请号：US57518

申请日：1998-04-09

申请人： Joe Stevens ,  Allen Thompson ,  Norman Cowan ,  David Alvarez

发明人： Joe Stevens ,  Allen Thompson ,  Norman Cowan ,  David Alvarez

IPC分类号： F04B35/00 ,  F04B39/00 ,  F04B39/04 ,  H05B1/00

CPC分类号： F04B35/008 ,  F04B39/0005 ,  F04B39/04

摘要： An improved method and apparatus are disclosed for isolating product gas from compressor operating fluid. A portion of a piston rod directly exposed to the compressor's operating fluid (the oily portion of the piston rod) is atmospherically isolated from the remaining portion of the piston rod by providing the piston rod with a collar that separates the oily portion of the piston rod from the remainder of the piston rod. A first and a second flexible membrane are coupled to the collar to form a first isolation region, and a second isolation region; the first isolation region encases the oily portion of the piston rod and atmospherically isolates it from the second isolation region, and the second isolation region provides additional isolation from both the operating fluid and the ambient environment. A higher pressure is maintained along the backside of the piston that compresses the product gas than the pressure within the adjacent isolation region. Pairs of wipers with vents coupled therebetween additionally may be employed to further improve product gas isolation.

摘要翻译： 公开了一种改进的方法和装置，用于从压缩机工作流体中分离产物气体。 直接暴露于压缩机的工作流体（活塞杆的油性部分）的活塞杆的一部分与活塞杆的剩余部分大气隔离，为活塞杆提供一个将活塞杆的油性部分分开的套环 从活塞杆的其余部分。 第一和第二柔性膜耦合到套环以形成第一隔离区域和第二隔离区域; 第一隔离区域包围活塞杆的油性部分并使其与第二隔离区域大气隔离，并且第二隔离区域提供与工作流体和周围环境的额外隔离。 沿着活塞的背面保持较高的压力，其压缩产品气体而不是相邻隔离区域内的压力。 可以采用具有连接在其上的通风口的擦拭器对以进一步改善产品气体隔离。

公开(公告)号：US06475357B2

公开(公告)日：2002-11-05

申请号：US09820426

申请日：2001-03-28

申请人： Jayant Lakshmikanthan ,  Joe Stevens

发明人： Jayant Lakshmikanthan ,  Joe Stevens

IPC分类号： C25D1700

CPC分类号： C25D17/06 ,  C25D7/123 ,  C25D17/001

摘要： The present invention provides a bladder assembly for use in an electroplating cell. The bladder assembly comprises a mounting plate, a bladder, and an annular manifold. One or more inlets are formed in the mounting plate and are coupled to a fluid source. The manifold is adapted to be received in a recess formed in the lower face of the mounting plate and secures the bladder thereto. Outlets formed in the manifold communicate with the inlets to route a fluid from the fluid source into the bladder to inflate the same. A substrate disposed on a contact ring opposite the bladder is thereby selectively biased toward a seating surface of the contact ring. A pumping system 159 coupled at the backside of the substrate 121 provides a pressure or vacuum condition.

摘要翻译： 本发明提供一种用于电镀电池的气囊组件。 气囊组件包括安装板，气囊和环形歧管。 一个或多个入口形成在安装板中并且联接到流体源。 歧管适于容纳在形成在安装板的下表面中的凹部中并将气囊固定到其上。 形成在歧管中的出口与入口连通，以将流体从流体源引导到气囊中以使其膨胀。 因此，设置在与气囊相对的接触环上的基板被选择性地偏压到接触环的就座表面。 耦合在基板121背面的泵送系统159提供压力或真空条件。

公开(公告)号：US06416647B1

公开(公告)日：2002-07-09

申请号：US09294240

申请日：1999-04-19

申请人： Yezdi Dordi ,  Joe Stevens ,  Roy Edwards ,  Bob Lowrance ,  Michael Sugarman ,  Mark Denome

发明人： Yezdi Dordi ,  Joe Stevens ,  Roy Edwards ,  Bob Lowrance ,  Michael Sugarman ,  Mark Denome

IPC分类号： C25D504

CPC分类号： H01L21/68721 ,  C25D5/20 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/08 ,  C25D21/00 ,  C25D21/18 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/68792

摘要： The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers. The substrate support member also rotates and vibrates during processing to enhance the electro-deposition onto the substrate plating surface.

摘要翻译： 本发明提供一种用于半导体衬底的面朝上处理的电化学沉积池，包括衬底支撑构件，连接到衬底镀层表面的阴极，设置在衬底支撑构件上方的阳极和流体地供应电镀液的电镀溶液入口 连接阳极和基板电镀表面。 优选地，阳极包括设置在液体可渗透结构中的消耗性金属源，并且阳极和空腔环限定用于将电镀溶液保持并分配到基板电镀表面的空腔。 优选地，衬底支撑构件包括具有设置在衬底支撑表面上的真空端口的真空吸盘，其用于在加工期间提供吸力并且提供吹出气体流以防止衬底转移期间的背面污染。 衬底支撑构件在加工过程中也旋转并振动，以增强对衬底镀层表面的电沉积。

公开(公告)号：US5990453A

公开(公告)日：1999-11-23

申请号：US982683

申请日：1997-12-02

申请人： Ashok K. Das ,  Joe Stevens ,  Erich Tzou ,  Matt Tsai

发明人： Ashok K. Das ,  Joe Stevens ,  Erich Tzou ,  Matt Tsai

IPC分类号： H01L21/00 ,  A21B1/00

CPC分类号： H01L21/67109

摘要： An improved processing chamber is provided that withstands numerous high pressure/high temperature processing cycles without heater breakage. The processing chamber contains a high conductivity, a high emissivity and/or a high transmissivity shield positioned in sufficient proximity to a heater to prohibit gas currents such as convection current loops from forming between the shield and the heater. The shield is preferably a thin anodized metal or a sapphire sheet.

摘要翻译： 提供了一种改进的处理室，其承受许多高压/高温处理循环而没有加热器断裂。 处理室包含高导电率，高发射率和/或高透射率屏蔽，其位于足够靠近加热器的位置，以防止诸如对流电流环之间的气流在屏蔽和加热器之间形成。 该屏蔽件优选为薄的阳极氧化金属或蓝宝石片。