公开(公告)号：US4016396A

公开(公告)日：1977-04-05

申请号：US571167

申请日：1975-04-24

Applicant: Javathu K. Hassan ,  Carl V. Rabstejnek

Inventor： Javathu K. Hassan ,  Carl V. Rabstejnek

IPC: G05B19/39 ,  G05B11/18

CPC classification number: G05B19/39 ,  G05B2219/34388 ,  G05B2219/41457 ,  G05B2219/42249 ,  G05B2219/42251

Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined positon relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position of the workpiece relative to a fixed reference and emits a signal output which is compared, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site. Thereafter the error between the actual position address and the desired position address, although very small, is fed to second apparatus for positioning the tool a very small amount to precisely position the tool relative to the workpiece.

Abstract translation: 用于通过将工件定位在预定位置，然后将工具相对于现场以最小总时间定位在精确的预定位置，将工件和工具相对于彼此定位在精确位置的装置。 该装置包括连接到工件的闭环位置和速度敏感伺服系统，伺服系统包括用于将工件定位在预定位置的定位装置。 位置指示器确定工件相对于固定基准的实际位置，并发出在误差发生器中与工件相对于基准的期望位置进行比较的信号输出。 来自误差发生器的差分信号被施加到定位器，并用于将工件带到现场。 定位器具有与来自误差发生器的定位信号配合的速度反馈，以将工件驱动到预定位置。 此后，尽管非常小的实际位置地址和期望的位置地址之间的误差被馈送到第二装置，用于将工具定位非常小以精确地定位工具相对于工件。

公开(公告)号：US4270999A

公开(公告)日：1981-06-02

申请号：US79759

申请日：1979-09-28

Applicant: Javathu K. Hassan ,  John A. Paivanas

Inventor： Javathu K. Hassan ,  John A. Paivanas

IPC: B01J19/08 ,  B01J19/26 ,  C23C14/34 ,  C23F4/00 ,  H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  C23F1/00 ,  C23C15/00

CPC classification number: H01J37/3244 ,  C23C14/34 ,  C23F4/00

Abstract: A method and apparatus for obtaining a uniform gaseous molecular field under high vacuum conditions encountered in a dry etching process. In the method a source of a gas is provided and introduced into a manifold. The manifold feeds at least one nozzle and the gas is passed through the manifold and through the nozzle into a chamber maintained under vacuum conditions. The pressure of the gas and the configuration of the manifold and nozzle are such that the gas is caused to exit from the nozzle into the chamber under vacuum at sonic velocity.

Abstract translation: 一种用于在干蚀刻工艺中遇到的高真空条件下获得均匀气态分子场的方法和装置。 在该方法中，提供气体源并将其引入歧管。 歧管馈送至少一个喷嘴，气体通过歧管并通过喷嘴进入保持在真空条件下的室。 气体的压力和歧管和喷嘴的构造使得气体在真空下以声速从喷嘴排出到室中。

公开(公告)号：US3968885A

公开(公告)日：1976-07-13

申请号：US501005

申请日：1974-08-27

Applicant: Javathu K. Hassan ,  Alfred Mack ,  Michael R. Wojtaszek

Inventor： Javathu K. Hassan ,  Alfred Mack ,  Michael R. Wojtaszek

IPC: B23Q7/14 ,  B25J15/00 ,  H01L21/00 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B25J3/00

CPC classification number: H01L21/68707 ,  B23Q7/1431 ,  B25J15/0052 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67742 ,  Y10S414/135 ,  Y10S414/139

Abstract: A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elevator, which is within the vacuum chamber, through an opening, which is vacuum sealed by the elevator at this time, in the top wall of the vacuum chamber. A lid is then placed over the opening from the exterior to cooperate with the elevator to form an ante chamber which the wafer disposed therein. The ante chamber, which is purged prior to the lid being placed over the opening, is then reduced to a vacuum of 5 .times. 10.sup..sup.-2 torr. The elevator then lowers the wafer into a horizonal plane in which a transfer mechanism is located to transfer the wafer from the elevator to an X-Y table on which the wafer is mounted for pattern writing of the chips. The transfer mechanism includes an arm, which is indexed 180.degree. during each antivation of an indexing means connected thereto, and gripping means at each end of the arm to simultaneously grasp and release wafers on the elevator and X-Y table to interchange the wafers between the elevator and the table.

Abstract translation: 其上形成有芯片的半导体晶片从100级环境移动到真空室中，其中通过电子束对芯片进行图案写入，而不会显着影响真空室中的真空水平。 最初将晶片设置在真空室内的电梯上，该电梯此时由电梯真空密封在真空室的顶壁中。 然后将盖子从外部放置在开口上方以与电梯配合以形成设置在其中的晶片的前室。 然后在盖子被放置在开口之前被清除的前室被减小到5×10 -2托的真空。 然后，电梯将晶片降低到水平平面中，在该水平平面中，传送机构位于其中，以将晶片从电梯传送到其上安装有晶片的X-Y台，用于芯片的图案写入。 传送机构包括臂，其在与其连接的分度装置的每个防止期间被分度180度，并且在臂的每个端部处的夹持装置，以在电梯和XY工作台上同时抓住并释放晶片，以在电梯之间交换晶片 和桌子。

公开(公告)号：US4474397A

公开(公告)日：1984-10-02

申请号：US442206

申请日：1982-11-16

Applicant: Javathu K. Hassan ,  John A. Paivanas

Inventor： Javathu K. Hassan ,  John A. Paivanas

IPC: H01L21/677 ,  B65H3/08 ,  B65H3/14 ,  B65H5/14 ,  B65H5/22 ,  B66C1/00 ,  B66C1/02 ,  H01L21/683

CPC classification number: H01L21/6838

Abstract: An aspirator jet suction pick-up device for moving green sheets or other flexible materials employs a source of gas under positive pressure into the head with exhaust via a network of slots disposed along the pick-up surface of the head. As the gas exhausts through the ends of the slots via a manifold or plenum, an open groove on the pick-up surface entrains aspirated air causing a localized suction force. The suction force due to aspiration uniformly and stably holds a flexible sheet on the pick-up surface.

Abstract translation: 用于移动生片或其它柔性材料的抽吸器吸气拾取装置通过经由头部的拾取表面设置的槽的网络，将具有正压力的气体源引入具有排气的头部。 当气体经由歧管或气室经过槽的端部排出时，拾取表面上的开放槽夹带抽吸的空气，引起局部抽吸力。 由于抽吸均匀且稳定地将柔性片保持在拾取表面上。

公开(公告)号：US4019015A

公开(公告)日：1977-04-19

申请号：US553385

申请日：1975-02-26

Applicant: Javathu K. Hassan ,  Carl V. Rabstejnek ,  Anthony D. Wutka

Inventor： Javathu K. Hassan ,  Carl V. Rabstejnek ,  Anthony D. Wutka

IPC: G05B19/39 ,  H01J37/304 ,  B23K15/00

CPC classification number: H01J37/3045 ,  G05B19/39 ,  G05B2219/34388 ,  G05B2219/41457 ,  G05B2219/42249 ,  G05B2219/42251

Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined position relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position to the workpiece relative to a fixed reference and emits a signal output which is compared, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site. Thereafter the error between the actual position address and the desired position address, although very small, is fed to second apparatus for positioning the tool a very small amount to precisely position the tool relative to the workpiece.

Abstract translation: 用于通过将工件定位在预定位置，然后将工具相对于现场以最小总时间定位在精确的预定位置，将工件和工具相对于彼此定位的精确位置的装置。 该装置包括连接到工件的闭环位置和速度敏感伺服系统，伺服系统包括用于将工件定位在预定位置的定位装置。 位置指示器确定相对于固定基准的工件的实际位置，并且发出在误差发生器中与工件相对于基准的期望位置进行比较的信号输出。 来自误差发生器的差分信号被施加到定位器，并用于将工件带到现场。 定位器具有与来自误差发生器的定位信号配合的速度反馈，以将工件驱动到预定位置。 此后，尽管非常小的实际位置地址和期望的位置地址之间的误差被馈送到第二装置，用于将工具定位非常小以精确地定位工具相对于工件。

公开(公告)号：US4395165A

公开(公告)日：1983-07-26

申请号：US218232

申请日：1980-12-19

Applicant: I. Joseph DeRobertis ,  Javathu K. Hassan ,  Robert L. Judge ,  John A. Paivanas

Inventor： I. Joseph DeRobertis ,  Javathu K. Hassan ,  Robert L. Judge ,  John A. Paivanas

IPC: B65G49/07 ,  B65G51/03 ,  B65H5/22 ,  H01L21/677 ,  B65G51/02

CPC classification number: H01L21/67784 ,  B65G51/03

Abstract: A transport system is disclosed, including an air film shuttle conveyor for conveying semiconductor chips from a loading to an unloading station, the conveyor comprising a base plate and upstanding side guide walls extending longitudinally of the base plate, the guide walls being spaced apart a distance slightly greater than the lateral dimension of said chips; further included are means providing a laminar air flow which surrounds the chips and forms an air film supporting them and propelling them downstream such that the slight spacing between the chips and the guide walls causes the flow resistance to be higher in the one region defined by said slight spacing than in the region defined by the spacing between the chips, whereby a continuous and flexible separation action occurs between the chips.

Abstract translation: 公开了一种运输系统，包括用于将半导体芯片从装载站运送到卸载站的空气膜穿梭式输送机，该输送机包括基板和沿基板纵向延伸的直立侧引导壁，导向壁间隔一段距离 略大于所述芯片的横向尺寸; 进一步包括提供围绕芯片的层流气流的装置，并形成支撑它们并将它们推向下游的空气膜，使得芯片和引导壁之间的轻微间隔导致在由所述第一区域限定的一个区域中的流动阻力更高 在由芯片之间的间隔限定的区域中的间隔小，由此在芯片之间发生连续且灵活的分离动作。

公开(公告)号：US4348139A

公开(公告)日：1982-09-07

申请号：US145156

申请日：1980-04-30

Applicant: Javathu K. Hassan ,  John A. Paivanas

Inventor： Javathu K. Hassan ,  John A. Paivanas

IPC: B65G49/07 ,  B65G51/03 ,  H01L21/67 ,  H01L21/677 ,  B65G51/02

CPC classification number: B65G51/03 ,  H01L21/67784

Abstract: A manufacturing processing system comprises a plurality of processing stations, preferably vacuum stations, interconnected by air track, preferably an axi-radial air track with novel sections rotatable about a transverse axis in the plane of the track and normal to the travel of the objects, hereafter referred to as swivelators. Certain of the swivelators are formed with axial movable portions capable of moving beyond the plane of the air track surface and returning to the plane, so that these swivelators can pick up and set down objects in predetermined positions in the manufacturing processing station with an air force so as to not make physical contact with the objects. A novel gas lock device is positioned in the air track between those processing stations, in which the gas pressure must be separated so as to essentially eliminate the possibility of gas contaminant passing from one station to the next. The gas lock comprises an air track compartment having closable sides or panels in the path of the travel of the object being transported along the air track.

Abstract translation: 制造处理系统包括多个处理站，优选为真空站，优选地是通过空气轨道互连的处理站，优选地具有可绕着轨道的平面中的横向轴线旋转且垂直于物体行进的新颖部分的轴向径向空气轨道， 以下简称旋转机。 某些旋转器形成有能够移动超过空气轨道表面的平面并返回到平面的轴向可移动部分，使得这些旋转器可以利用空气力拾取并放置在制造加工站中的预定位置的物体 以免与物体接触。 一种新型的气体锁定装置位于这些处理站之间的空气轨道中，其中必须分离气体压力，以便基本上消除气体污染物从一个站到下一个站的可能性。 气锁包括在沿着空气轨道传送的物体的行进路径中具有可封闭侧面或空间的空气轨道舱。

公开(公告)号：US4257637A

公开(公告)日：1981-03-24

申请号：US79767

申请日：1979-09-28

Applicant: Javathu K. Hassan ,  John A. Paivanas

Inventor： Javathu K. Hassan ,  John A. Paivanas

IPC: B65H23/18 ,  B25J15/06 ,  B65H3/14 ,  B66C1/02 ,  G01V9/00 ,  H05K13/02

CPC classification number: B66C1/0218 ,  B66C1/0268

Abstract: A contactless air film lift-up device constructed to utilize the pressure-velocity relationship expressed in the Bernoulli principle to provide a desired pick-up action, while at the same time generating a lateral restraining force through a further utilization of the Bernoulli principle.

Abstract translation: 一种非接触式空气膜提升装置，其构造为利用伯努利原理中表达的压力 - 速度关系提供期望的拾取动作，同时通过进一步利用伯努利原理产生横向约束力。

公开(公告)号：US4165132A

公开(公告)日：1979-08-21

申请号：US772394

申请日：1977-02-28

Applicant: Javathu K. Hassan ,  John A. Paivanas

Inventor： Javathu K. Hassan ,  John A. Paivanas

IPC: B65G49/07 ,  B65G51/03 ,  B65H29/24 ,  H01L21/22 ,  H01L21/677 ,  B65G51/02

CPC classification number: B65G51/03 ,  H01L21/67784

Abstract: This specification deals with the stopping, positioning, orienting and redirecting a semiconductor wafer being transported along a track on an air film or bed of air. The stopping mechanism is an air jet located in a groove in the track, wafers passing over this air jet on an air film are sensed by a pneumatic sensor that turns on the air jet to set up an air stream under the transporting surface of the air film. This air stream sucks the fluid in the air film along with it in the groove causing a vacuum in the bed in the area of the nozzle of the air jet. The wafers are then stopped by the suction of the vacuum. Positioning, orienting and redirecting is done using the air jet and pneumatic sensor in combination with special air jet arrangements and operations.

Abstract translation: 本规范涉及沿着空气膜或空气床上的轨道传送的半导体晶片的停止，定位，定向和重定向。 停止机构是位于轨道中的凹槽中的空气喷射，通过空气薄膜上的空气射流的晶片由气动传感器感测，气动传感器接通空气射流以在空气的输送表面下方设置空气流 电影。 该空气流将空气膜中的流体与空气膜一起吸入槽中，从而在空气喷嘴的喷嘴区域中在床中产生真空。 然后通过抽真空将晶片停止。 使用空气喷射和气动传感器结合特殊的空气喷射装置和操作来进行定位，定向和重定向。