摘要:
An antenna is provided and includes a radiator aperture assembly including a plurality of radiator sticks, each radiator stick including a row of radiating elements configured to transmit and receive RF energy and a body having opposite sides, conductive elements coupled to the radiating elements and a plate disposed proximate to the radiator aperture assembly through which the conductive elements extend. Complementary opposite sides of the respective bodies of adjacent radiator sticks and a surface of the plate are configured to form a slot radiator.
摘要:
An antenna is provided and includes a radiator aperture assembly including a plurality of radiator sticks, each radiator stick including a row of radiating elements configured to transmit and receive RF energy and a body having opposite sides, conductive elements coupled to the radiating elements and a plate disposed proximate to the radiator aperture assembly through which the conductive elements extend. Complementary opposite sides of the respective bodies of adjacent radiator sticks and a surface of the plate are configured to form a slot radiator.
摘要:
An integrated differential high power amplifier-radiator array that overcomes the prior art impedance match issues is described. An impedance matching balun is used to feed a high output impedance, differential HPA, which in turn drives a wide band radiator or array of radiators having a matching input impedance to provide a highly efficient, compact transmit system. In one exemplary embodiment, the HPA may be a high impedance Class-B HPA configured as a push-pull cascode amplifier. A high impedance isolator or circulator may be used between the HPA and the radiator. One of ordinary skill in the art will readily appreciate that a receive implementation, using a properly matched low noise amplifier in place of the HPA, is also possible. Similarly, with the addition of a slotline circulator, transceiver operation is also attainable with the addition of an impedance matched receive chain.
摘要:
The present invention relates to active electronically scanned array antennas. A thin, low cost design is provided by coupling electromagnetic energy into periodically driven long slots (205) using circulators with integrated probes (107). The long slots (205) are formed as grooves (114) in a conductive base plate (103), each groove (114) bracketed on both sides by conductive strips (108). The circulators with integrated probes (107) are installed between the conductive strips (108) and the base plate (103), to reduce fabrication costs of the machined parts and to facilitate the making of connections between the circulators and the antenna electronics. The probes (128) protrude partway into the slots (205) and provide coupling to waves propagating in free space.
摘要:
A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.
摘要:
A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.
摘要:
A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.
摘要:
A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.
摘要:
An integrated differential high power amplifier-radiator array that overcomes the prior art impedance match issues is described. An impedance matching balun is used to feed a high output impedance, differential HPA, which in turn drives a wide band radiator or array of radiators having a matching input impedance to provide a highly efficient, compact transmit system. In one exemplary embodiment, the HPA may be a high impedance Class-B HPA configured as a push-pull cascode amplifier. A high impedance isolator or circulator may be used between the HPA and the radiator. One of ordinary skill in the art will readily appreciate that a receive implementation, using a properly matched low noise amplifier in place of the HPA, is also possible. Similarly, with the addition of a slotline circulator, transceiver operation is also attainable with the addition of an impedance matched receive chain.