ACTIVE ELECTRONICALLY SCANNED ARRAY ANTENNA
    1.
    发明申请
    ACTIVE ELECTRONICALLY SCANNED ARRAY ANTENNA 有权
    主动电子扫描阵列天线

    公开(公告)号:US20130321228A1

    公开(公告)日:2013-12-05

    申请号:US13483404

    申请日:2012-05-30

    IPC分类号: H01Q13/10

    摘要: An antenna is provided and includes a radiator aperture assembly including a plurality of radiator sticks, each radiator stick including a row of radiating elements configured to transmit and receive RF energy and a body having opposite sides, conductive elements coupled to the radiating elements and a plate disposed proximate to the radiator aperture assembly through which the conductive elements extend. Complementary opposite sides of the respective bodies of adjacent radiator sticks and a surface of the plate are configured to form a slot radiator.

    摘要翻译: 提供了一种天线,其包括散热器孔组件,其包括多个辐射棒,每个散热器棒包括配置成发射和接收RF能量的一排辐射元件和具有相对侧的主体,耦合到辐射元件的导电元件和板 靠近散热器孔组件设置,导电元件通过该组件延伸。 相邻散热器棒的各个主体的相互相对的两侧和板的表面被构造成形成狭槽散热器。

    Differential High Power Amplifier for a Low Profile, Wide Band Transmit Array
    4.
    发明申请
    Differential High Power Amplifier for a Low Profile, Wide Band Transmit Array 有权
    差分大功率放大器,适用于薄型宽带发射阵列

    公开(公告)号:US20130314288A1

    公开(公告)日:2013-11-28

    申请号:US13479792

    申请日:2012-05-24

    IPC分类号: H01Q1/50 H01Q13/00 H01Q9/16

    摘要: An integrated differential high power amplifier-radiator array that overcomes the prior art impedance match issues is described. An impedance matching balun is used to feed a high output impedance, differential HPA, which in turn drives a wide band radiator or array of radiators having a matching input impedance to provide a highly efficient, compact transmit system. In one exemplary embodiment, the HPA may be a high impedance Class-B HPA configured as a push-pull cascode amplifier. A high impedance isolator or circulator may be used between the HPA and the radiator. One of ordinary skill in the art will readily appreciate that a receive implementation, using a properly matched low noise amplifier in place of the HPA, is also possible. Similarly, with the addition of a slotline circulator, transceiver operation is also attainable with the addition of an impedance matched receive chain.

    摘要翻译: 描述了克服现有技术的阻抗匹配问题的集成差分大功率放大器 - 散热器阵列。 阻抗匹配平衡不平衡变换器用于馈送高输出阻抗差分HPA,差分HPA又驱动具有匹配输入阻抗的宽带辐射器或散热器阵列,以提供高效,紧凑的发射系统。 在一个示例性实施例中,HPA可以是被配置为推挽式共源共栅放大器的高阻抗Class-B HPA。 可以在HPA和散热器之间使用高阻抗隔离器或循环器。 本领域普通技术人员将容易理解,使用适当匹配的低噪声放大器代替HPA的接收实现也是可能的。 类似地,通过添加槽式循环器,也可以通过添加阻抗匹配的接收链来实现收发器操作。

    Low profile and compact surface mount circulator on ball grid array
    6.
    发明授权
    Low profile and compact surface mount circulator on ball grid array 有权
    球形阵列上的低轮廓和紧凑的表面贴装循环器

    公开(公告)号:US08234777B2

    公开(公告)日:2012-08-07

    申请号:US13197674

    申请日:2011-08-03

    IPC分类号: H01P1/38

    摘要: A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.

    摘要翻译: 表面贴装循环器。 新型环行器包括基板,设置在基板的第一表面上的预定数量的微带线,设置在基板的第二表面上的接地层和预定数量的电触点,以及用于将每条微带线耦合到 电触点之一。 在说明性实施例中,循环器使用边缘包裹金属化将微带线包裹在衬底的一侧以与相应的接触件连接。 然后可以使用球栅阵列来连接具有电路板的基板的第二表面处的信号触点和接地。 循环器还包括在衬底的第一表面上的磁体,其在连接微带线的谐振器电路和位于地下的衬底的第二表面上的极片以向衬底提供磁偏置。

    LOW PROFILE AND COMPACT SURFACE MOUNT CIRCULATOR ON BALL GRID ARRAY
    7.
    发明申请
    LOW PROFILE AND COMPACT SURFACE MOUNT CIRCULATOR ON BALL GRID ARRAY 有权
    球形阵列上的低轮廓和紧凑的表面安装圆形

    公开(公告)号:US20110290862A1

    公开(公告)日:2011-12-01

    申请号:US13197674

    申请日:2011-08-03

    IPC分类号: H05K13/04 H05K13/00 B23K31/02

    摘要: A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.

    摘要翻译: 表面贴装循环器。 新型环行器包括基板,设置在基板的第一表面上的预定数量的微带线,设置在基板的第二表面上的接地层和预定数量的电触点,以及用于将每条微带线耦合到 电触点之一。 在说明性实施例中,循环器使用边缘包裹金属化将微带线包裹在衬底的一侧以与相应的接触件连接。 然后可以使用球栅阵列来连接具有电路板的基板的第二表面处的信号触点和接地。 循环器还包括在衬底的第一表面上的磁体,其在连接微带线的谐振器电路和位于地下的衬底的第二表面上的极片以向衬底提供磁偏置。

    Low profile and compact surface mount circulator on ball grid array
    8.
    发明授权
    Low profile and compact surface mount circulator on ball grid array 有权
    球形阵列上的低轮廓和紧凑的表面贴装循环器

    公开(公告)号:US08040199B2

    公开(公告)日:2011-10-18

    申请号:US12220993

    申请日:2008-07-30

    IPC分类号: H01P1/32

    摘要: A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.

    摘要翻译: 表面贴装循环器。 新型环行器包括基板,设置在基板的第一表面上的预定数量的微带线,设置在基板的第二表面上的接地层和预定数量的电触点,以及用于将每个微带线耦合到 电触点之一。 在说明性实施例中,循环器使用边缘包裹金属化将微带线包裹在衬底的一侧以与相应的接触件连接。 然后可以使用球栅阵列来连接具有电路板的基板的第二表面处的信号触点和接地。 循环器还包括在衬底的第一表面上的磁体,其在连接微带线的谐振器电路和位于地下的衬底的第二表面上的极片以向衬底提供磁偏置。

    Low profile and compact surface mount circulator on ball grid array
    9.
    发明申请
    Low profile and compact surface mount circulator on ball grid array 有权
    球形阵列上的低轮廓和紧凑的表面贴装循环器

    公开(公告)号:US20100026409A1

    公开(公告)日:2010-02-04

    申请号:US12220993

    申请日:2008-07-30

    IPC分类号: H01P1/38 H01L21/60

    摘要: A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.

    摘要翻译: 表面贴装循环器。 新型环行器包括基板,设置在基板的第一表面上的预定数量的微带线,设置在基板的第二表面上的接地层和预定数量的电触点,以及用于将每个微带线耦合到 电触点之一。 在说明性实施例中,循环器使用边缘包裹金属化将微带线包裹在衬底的一侧以与相应的接触件连接。 然后可以使用球栅阵列来连接具有电路板的基板的第二表面处的信号触点和接地。 循环器还包括在衬底的第一表面上的磁体,其在连接微带线的谐振器电路和位于地下的衬底的第二表面上的极片以向衬底提供磁偏置。

    Differential high power amplifier for a low profile, wide band transmit array
    10.
    发明授权
    Differential high power amplifier for a low profile, wide band transmit array 有权
    差分高功率放大器,用于低调,宽带发射阵列

    公开(公告)号:US09316723B2

    公开(公告)日:2016-04-19

    申请号:US13479792

    申请日:2012-05-24

    摘要: An integrated differential high power amplifier-radiator array that overcomes the prior art impedance match issues is described. An impedance matching balun is used to feed a high output impedance, differential HPA, which in turn drives a wide band radiator or array of radiators having a matching input impedance to provide a highly efficient, compact transmit system. In one exemplary embodiment, the HPA may be a high impedance Class-B HPA configured as a push-pull cascode amplifier. A high impedance isolator or circulator may be used between the HPA and the radiator. One of ordinary skill in the art will readily appreciate that a receive implementation, using a properly matched low noise amplifier in place of the HPA, is also possible. Similarly, with the addition of a slotline circulator, transceiver operation is also attainable with the addition of an impedance matched receive chain.

    摘要翻译: 描述了克服现有技术的阻抗匹配问题的集成差分大功率放大器 - 散热器阵列。 阻抗匹配平衡不平衡变换器用于馈送高输出阻抗差分HPA,差分HPA又驱动具有匹配输入阻抗的宽带辐射器或散热器阵列,以提供高效,紧凑的发射系统。 在一个示例性实施例中,HPA可以是被配置为推挽式共源共栅放大器的高阻抗Class-B HPA。 可以在HPA和散热器之间使用高阻抗隔离器或循环器。 本领域普通技术人员将容易理解,使用适当匹配的低噪声放大器代替HPA的接收实现也是可能的。 类似地,通过添加槽式循环器,也可以通过添加阻抗匹配的接收链来实现收发器操作。