-
1.发明授权公开(公告)号：US09035192B2
公开(公告)日：2015-05-19
申请号：US12974476
申请日：2010-12-21
申请人： Gyu Ho Lee , Young Woo Park , Il Rae Cho , Young Hun Kim , Kyoung Soo Park , Jin Seong Park , Dong Seon Uh , Kyung Jin Lee , Kwang Jin Jung
发明人： Gyu Ho Lee , Young Woo Park , Il Rae Cho , Young Hun Kim , Kyoung Soo Park , Jin Seong Park , Dong Seon Uh , Kyung Jin Lee , Kwang Jin Jung
摘要： An anisotropic conductive adhesive composite and film include a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.
摘要翻译： 各向异性导电粘合剂复合物和膜包括粘合剂和分散在粘合剂中的导电颗粒。 导电颗粒包括铜芯颗粒和涂覆在相应的铜芯颗粒的表面上的金属涂层。
-
2.发明申请Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same 有权使用各向异性导电膜的Pcb的连接结构和粘附方法以及使用其的连接条件的评价方法公开(公告)号：US20090000807A1
公开(公告)日：2009-01-01
申请号：US12161487
申请日：2007-01-22
申请人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
发明人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/091 , H05K2203/0278 , Y10T29/41 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144
摘要： A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
摘要翻译： 根据本发明的使用各向异性导电膜的PCB的连接结构，其具有通过使用包括绝缘粘合剂作为基底的各向异性导电膜和分散在绝缘粘合剂中的导电颗粒通过热压缩而彼此连接的构件，其中至少 任何一个构件具有柔性，并且由于通过热压缩形成的凹痕，具有柔性的构件的表面粗糙度值（Ra）为0.1至5.0μm。
-
3.发明申请CONNECTING STRUCTURE AND ADHESION METHOD OF PCB USING ANISOTROPIC CONDUCTIVE FILM, AND METHOD FOR EVALUATING CONNECTING CONDITION USING THE SAME 审中-公开使用各向异性导电膜的PCB的连接结构和粘合方法以及使用其评估连接条件的方法公开(公告)号：US20110290538A1
公开(公告)日：2011-12-01
申请号：US13152000
申请日：2011-06-02
申请人： Chul-Jong HAN , Yoon-Jae CHUNG , Jong-Yoon JANG , Jeong-Beom PARK , Yong-Seok HAN , Sung-Uk CHOI , Il-Rae CHO , Hyuk-Soo MOON , Kyung-Joon LEE
发明人： Chul-Jong HAN , Yoon-Jae CHUNG , Jong-Yoon JANG , Jeong-Beom PARK , Yong-Seok HAN , Sung-Uk CHOI , Il-Rae CHO , Hyuk-Soo MOON , Kyung-Joon LEE
IPC分类号： H05K1/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/091 , H05K2203/0278 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144
摘要： A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
摘要翻译： 根据本发明的使用各向异性导电膜的PCB的连接结构，其具有通过使用包括绝缘粘合剂作为基底的各向异性导电膜和分散在绝缘粘合剂中的导电颗粒通过热压缩而彼此连接的构件，其中至少 任何一个构件具有柔性，并且由于通过热压缩形成的凹痕，具有柔性的构件的表面粗糙度值（Ra）为0.1〜5.0μm。
-
公开(公告)号：US07993417B2
公开(公告)日：2011-08-09
申请号：US12161487
申请日：2007-01-22
申请人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
发明人： Chul-Jong Han , Yoon-Jae Chung , Jong-Yoon Jang , Jeong-Beom Park , Yong-Seok Han , Sung-Uk Choi , Il-Rae Cho , Hyuk-Soo Moon , Kyung-Joon Lee
IPC分类号： H01L21/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2201/091 , H05K2203/0278 , Y10T29/41 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144
摘要： A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
摘要翻译： 根据本发明的使用各向异性导电膜的PCB的连接结构，其具有通过使用包括绝缘粘合剂作为基底的各向异性导电膜和分散在绝缘粘合剂中的导电颗粒通过热压缩而彼此连接的构件，其中至少 任何一个构件具有柔性，并且由于通过热压缩形成的凹痕，具有柔性的构件的表面粗糙度值（Ra）为0.1〜5.0μm。
-
5.发明申请ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITE AND FILM, AND CIRCUIT CONNECTING STRUCTURE INCLUDING THE SAME 有权各向异性导电粘合复合材料和薄膜，以及包括其中的电路连接结构公开(公告)号：US20110155430A1
公开(公告)日：2011-06-30
申请号：US12974476
申请日：2010-12-21
申请人： Gyu Ho LEE , Young Woo Park , Il Rae Cho , Young Hun Kim , Kyoung Soo Park , Jin Seong Park , Dong Seon Uh , Kyung Jin Lee , Kwang Jin Jung
发明人： Gyu Ho LEE , Young Woo Park , Il Rae Cho , Young Hun Kim , Kyoung Soo Park , Jin Seong Park , Dong Seon Uh , Kyung Jin Lee , Kwang Jin Jung
摘要： An anisotropic conductive adhesive composite and film includes a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.
摘要翻译： 各向异性导电粘合剂复合材料和膜包括粘合剂和分散在粘合剂中的导电颗粒。 导电颗粒包括铜芯颗粒和涂覆在相应的铜芯颗粒的表面上的金属涂层。
-
-
-
-
搜索结果
5 条记录 (耗时 0.015 秒)
