公开(公告)号：US20130184377A1

公开(公告)日：2013-07-18

申请号：US13812972

申请日：2011-07-19

申请人： Ichirou Ogura ,  Yousuke Hirota ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Nobuya Nakamura

发明人： Ichirou Ogura ,  Yousuke Hirota ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Nobuya Nakamura

IPC分类号： C08L73/00

CPC分类号： C08L73/00 ,  C08G8/04 ,  C08L63/00 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.

摘要翻译： 本发明提供了一种热稳定性树脂组合物，其具有优异的流动性，并且实现了适用于近期电子元件相关材料的耐湿可靠性，并且在无卤素状态下与环境和谐相处的高阻燃性，其固化产物，半导体 使用该组合物的封装材料，以及赋予这些性能的酚醛树脂和环氧树脂。 作为必要成分，作为必要成分的热固性树脂组合物包含环氧树脂（A）和酚醛树脂（B），酚醛树脂（B）具有作为基本骨架的酚醛树脂结构，其中多个 含酚羟基的芳族骨架（ph）通过具有芳烃结构的亚烷基或亚甲基彼此键合，并且酚醛树脂结构的芳香核具有萘甲基或蒽基甲基。

公开(公告)号：US08487052B2

公开(公告)日：2013-07-16

申请号：US13389692

申请日：2010-08-06

申请人： Atsuko Kobayashi ,  Ichirou Ogura

发明人： Atsuko Kobayashi ,  Ichirou Ogura

IPC分类号： C08L63/10 ,  B32B27/04

CPC分类号： C08L63/10 ,  B29C70/48 ,  B29C2945/7605 ,  B29K2023/06 ,  B29K2995/0088 ,  C08F283/10 ,  C08G59/08 ,  C08G59/1466 ,  C08J5/24 ,  C08J2363/02 ,  C08L63/00 ,  C08L2205/05 ,  Y10T428/31511 ,  C08L25/04 ,  C08L33/02

摘要： The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.

摘要翻译： 本发明提供一种纤维增强复合材料用树脂组合物，其具有优异的流动性和浸渍在纤维基材中，并且产生具有优异耐热性的固化产物。 纤维增强复合材料用树脂组合物含有作为必要成分的聚（缩水甘油氧基芳基）化合物（A），作为不饱和羧酸或其酸酐的可聚合单体（B），分子量为160或 较少的芳族乙烯基化合物或（甲基）丙烯酸酯（C）和自由基聚合引发剂（D），其中组分（A）中的缩水甘油氧基的相对于酸基的当量比[缩水甘油氧基/酸基] 在组分（B）中的比例为1/1至1 / 0.48，组分（B）与组分（C）的摩尔比[（B）/（C）]在1 / 0.55至1 / 2。

公开(公告)号：US20120308832A1

公开(公告)日：2012-12-06

申请号：US13577235

申请日：2011-01-19

申请人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

发明人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC分类号： C08G8/28 ,  B32B27/38 ,  C08G59/14

CPC分类号： H05K1/0326 ,  C08G8/08 ,  C08G8/12 ,  C08K5/13 ,  H05K2201/012 ,  Y10T428/31515 ,  C08L61/06

摘要： A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n=1 and n=2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

摘要翻译： 用作环氧树脂固化剂的酚醛树脂组合物包括由通式（1）表示的萘酚酚醛清漆树脂（a1）（其中R1和R2各自独立地表示氢原子，烷基或烷氧基，和 n为重复单元，1以上的整数）和通式（2）表示的化合物（a2）（式中，R 1和R 2各自独立地表示氢原子，烷基或烷氧基），式 存在于组合物中的通式（1）中n = 1且n = 2的化合物的总比例在10〜35％的范围内，通式（1）中n的平均值在 3.0〜7.0，组合物中化合物（a2）的含量为1〜6％。

公开(公告)号：US08168731B2

公开(公告)日：2012-05-01

申请号：US13124694

申请日：2009-08-07

申请人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

发明人： Yutaka Satou ,  Kazuo Arita ,  Ichirou Ogura

IPC分类号： B32B27/04 ,  C08L63/00 ,  H05K1/03

CPC分类号： C08G59/08 ,  C08G59/3218 ,  H05K1/03 ,  H05K1/0326 ,  Y10T156/10 ,  Y10T428/249951

摘要： Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).

摘要翻译： 本发明提供一种固化性树脂组合物，它具有良好的耐热性和低热膨胀性，并且在溶剂中具有良好的溶解性，其固化产物，包含该组合物的印刷线路板，赋予这些性能的新型环氧树脂，和 生产相同。 固化性树脂组合物含有作为必要成分的环氧树脂（A），其分子结构中含有萘结构和环己二烯酮结构通过亚甲基彼此键合的缩水甘油氧基和骨架; 和固化剂（B）。

公开(公告)号：US20090099303A1

公开(公告)日：2009-04-16

申请号：US12280934

申请日：2006-11-10

申请人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

发明人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

IPC分类号： C08L63/08 ,  C08G65/38

CPC分类号： C08G59/3218 ,  C08G59/245 ,  C08L63/00

摘要： The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).

摘要翻译： 本发明提供环氧树脂组合物，新型环氧树脂，新型酚醛树脂和半导体封装材料。 环氧树脂组合物的固化物具有优异的阻燃性，耐热性和固化性。 环氧树脂组合物是在半导体装置或电路基板装置中使用的优选的树脂组合物，具有萘结构通过氧原子与亚芳基键合的结构，并且在两者中的芳香核总数 萘结构和亚芳基为2-8。 环氧树脂组合物基本上包括在芳环中具有缩水甘油氧基作为取代基的环氧树脂（A）和固化剂（B）。

公开(公告)号：US20090052909A1

公开(公告)日：2009-02-26

申请号：US11814462

申请日：2006-01-21

申请人： Tomoyuki Hino ,  Kazuhiko Kurata ,  Yutaka Urino ,  Ichirou Ogura ,  Junichi Sasaki ,  Youichi Hashimoto

发明人： Tomoyuki Hino ,  Kazuhiko Kurata ,  Yutaka Urino ,  Ichirou Ogura ,  Junichi Sasaki ,  Youichi Hashimoto

IPC分类号： G02B6/28 ,  H04B10/12

CPC分类号： G02B6/3897 ,  G02B6/43

摘要： One or more one-dimensional array-shaped photoelectric conversion modules 302 are mounted on a board 301. A one-dimensional array-shaped light receiving/emitting element 303 is mounted in each of the one-dimensional array-shaped photoelectric conversion modules 302. Further, the one-dimensional array-shaped photoelectric conversion modules 302 are mechanically and optically connected to a flexible fiber sheet 306 through an optical connector 305. As parallel transmission paths 306 from the one-dimensional array-shaped photoelectric conversion modules 302 approach an end of a board 301, they are laminated with each other and connected to a two-dimensional array-shaped optical connector 307 at an end of the board. Further, a wavelength multiplexer/demultiplexer is connected to the optical connector.

摘要翻译： 一个或多个一维阵列状光电转换模块302安装在板301上。一维阵列状光接收/发射元件303安装在一维阵列状光电转换模块302的每一个中。 此外，一维阵列状光电转换模块302通过光连接器305机械地和光学地连接到柔性纤维片材306上。由于一维阵列状光电转换模块302的平行传输路径306接近尾端 板301彼此层叠并连接到板的一端的二维阵列状光连接器307。 此外，波长多路复用器/解复用器连接到光学连接器。

公开(公告)号：US08729192B2

公开(公告)日：2014-05-20

申请号：US12280934

申请日：2006-11-10

申请人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

发明人： Kazuo Arita ,  Ichirou Ogura ,  Kunihiro Morinaga

IPC分类号： C08G65/48 ,  C08L63/00 ,  C08F283/00 ,  C08G59/14 ,  C08G65/38

CPC分类号： C08G59/3218 ,  C08G59/245 ,  C08L63/00

摘要： The invention provides an epoxy resin composition, a novel epoxy resin, a novel phenol resin and a semiconductor encapsulating material. The cured article of the epoxy resin composition has superior characteristics in flame retardancy, heat-resistant and curing. The epoxy resin composition is a preferable resin composition using in a semiconductor device or a circuit board device, and has the structure in which a naphthalene structure is bonded with an arylene group through an oxygen atom, and the total number of the aromatic nucleus in both the naphthalene structures and the arylenes group is 2-8. The epoxy resin composition essentially includes an epoxy resin (A) having the glycidoxy group as a substituent in the aromatic nucleus and a curing agent (B).

摘要翻译： 本发明提供环氧树脂组合物，新型环氧树脂，新型酚醛树脂和半导体封装材料。 环氧树脂组合物的固化物具有优异的阻燃性，耐热性和固化性。 环氧树脂组合物是在半导体装置或电路基板装置中使用的优选的树脂组合物，具有萘结构通过氧原子与亚芳基键合的结构，并且在两者中的芳香核总数 萘结构和亚芳基为2-8。 环氧树脂组合物基本上包括在芳环中具有缩水甘油氧基作为取代基的环氧树脂（A）和固化剂（B）。

公开(公告)号：US20120259039A1

公开(公告)日：2012-10-11

申请号：US13496619

申请日：2010-09-14

申请人： Atsuko Kobayashi ,  Ichirou Ogura

发明人： Atsuko Kobayashi ,  Ichirou Ogura

IPC分类号： C08L63/02 ,  C08L33/02 ,  C08L33/00 ,  B29C45/14

CPC分类号： C08F283/10 ,  C08G59/1466 ,  C08G59/50 ,  C08J5/04 ,  C08J2363/00 ,  Y10T428/24994 ,  Y10T428/2915

摘要： The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.

摘要翻译： 本发明提供一种纤维增强复合材料用树脂组合物，其在低温下具有优异的流动性，并且产生具有优异机械强度的固化产物，并且还提供其固化产物，纤维增强复合材料，纤维 - 具有优异耐热性的增强树脂模制品，以及生产率高的纤维增强树脂模制品的制造方法。 纤维增强复合材料用树脂组合物含有作为必要成分的环氧树脂（A），含酸基的自由基聚合性单体（B），自由基聚合引发剂（C）和胺系固化剂 （D），在50℃下用E型粘度计测定粘度为500mPa·s以下的粘度。 将组合物浸渍到增强纤维中并固化。

公开(公告)号：US20120095156A1

公开(公告)日：2012-04-19

申请号：US13256724

申请日：2009-08-05

申请人： Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

发明人： Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

IPC分类号： C08L61/14 ,  C08G8/32 ,  C08G8/36 ,  C07F9/6574

CPC分类号： H05K1/0326 ,  C07F9/657172 ,  C08G8/28 ,  C08G59/621 ,  C08L61/14 ,  C08L63/00 ,  H05K2201/012 ,  Y10T428/31511

摘要： Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

摘要翻译： 提供一种含磷酚类化合物的制造方法，其中在含磷化合物和苯酚的芳香核之间的反应中反应性相当优异; 在使用多元酚或酚醛树脂作为酚的情况下，作为环氧树脂固化剂的新型含磷酚类化合物，赋予固化物优异的耐热性; 含有新型含磷酚类化合物的固化性树脂组合物; 固化性树脂组合物的固化物; 印刷线路板; 和半导体密封材料。 在芳香核上具有烷氧基作为取代基的芳族醛（a1）与分子内具有P-H基或P-OH基的有机磷化合物（a2）反应。 然后使所得反应产物与苯酚（a3）反应。

公开(公告)号：US07718741B2

公开(公告)日：2010-05-18

申请号：US11908464

申请日：2006-03-16

申请人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

发明人： Ichirou Ogura ,  Kunihiro Morinaga ,  Kazuo Arita ,  Yutaka Sato

IPC分类号： C08L63/08 ,  C08G59/00

CPC分类号： C08G59/621 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The present invention relates to a composition containing as a main component, an epoxy resin which has a structure comprising a polyaryleneoxy structure such as polynaphthylene oxide as a main skeleton, (methyl)glycidyloxy group and aralkyl group being introduced on an aromatic ring of the polyaryleneoxy structure, and which has low viscosity, according to the present invention, there can be provided an epoxy resin composition which can impart remarkably excellent flame retardancy and dielectric characteristics to a cured article and a cured article thereof, an epoxy resin, a phenol resin as an intermediate of the epoxy resin, and a method for producing the epoxy resin.

摘要翻译： 本发明涉及含有作为主要骨架的聚亚芳基氧基结构，（甲基）缩水甘油氧基和芳烷基的环氧树脂作为主要成分的组合物，其导入聚亚芳基氧基的芳香环上 结构，并且具有低粘度，根据本发明，可以提供一种环氧树脂组合物，其可以赋予固化制品及其固化制品，环氧树脂，酚醛树脂以显着优异的阻燃性和介电特性 环氧树脂的中间体，以及环氧树脂的制造方法。