摘要:
A circuit and method are provided for generating a clipping distortion detector output signal for an integrated circuit audio amplifier which is independent of operating temperature and supply voltage. The system includes an audio amplifier having a voltage gain, a first input for receiving an input voltage and an output for generating an amplified output voltage. A supply voltage is supplied to the audio amplifier and the supply voltage determines the maximum amplified output voltage. A comparison voltage is generated which is indicative of the output voltage divided by the voltage gain. A clip detector voltage comparator receives the input voltage and the comparison voltage and provides a clipping distortion detect signal when the input voltage deviates from the comparison voltage in excess of an offset voltage which is indicative of detection of excessive clipping distortion. According to one embodiment, the offset voltage is adaptively controlled as a function of the supply voltage so as to maintain a substantially constant maximum percent distortion. According to a second embodiment, the offset voltage is adjusted as a function of supply voltage to achieve an adjustable maximum percent distortion. In addition, the offset voltage is also controlled as a function of temperature to provide temperature compensation. The supply voltage and temperature compensation may be achieved by generating a current source as a function of supply voltage and temperature.
摘要:
A strain gauge for sensing strain is provided and includes a support substrate, and first and second electrodes supported on the substrate. The first and second electrodes include first and second capacitive plates, respectively. The first capacitive plates are movable relative to the second capacitive plates responsive to strain. The strain gauge further has an input electrically coupled to one of the first and second electrodes for receiving an input signal, and an output electrically coupled to the other of the first and second electrodes for providing an output signal which varies as a function of the capacitive coupling and is indicative of sensed strain.
摘要:
A balanced angular accelerometer is provided having a substrate, a fixed electrode with a plurality of fixed capacitive plates, and a rotational inertia mass with a central opening and substantially suspended over a cavity and including a plurality of movable capacitive plates arranged to provide a capacitive coupling with the first plurality of fixed capacitive plates. The accelerometer has a central member and an outer member fixed to the substrate. According to one embodiment, a plurality of inner support arms extend between the central member and the inertia mass and a plurality of outer support arms extend between the inertia mass and the outer member to support the mass over the cavity. According to another embodiment, one or more cut out apertures are formed in the inertia mass to compensate for a channel and signal line so as to balance the inertia mass about the center of the inertia mass.
摘要:
A balanced angular accelerometer is provided having a substrate, a fixed electrode with a plurality of fixed capacitive plates, and a rotational inertia mass with a central opening and substantially suspended over a cavity and including a plurality of movable capacitive plates arranged to provide a capacitive coupling with the first plurality of fixed capacitive plates. The accelerometer has a central member and an outer member fixed to the substrate. According to one embodiment, a plurality of inner support arms extend between the central member and the inertia mass and a plurality of outer support arms extend between the inertia mass and the outer member to support the mass over the cavity. According to another embodiment, one or more cut out apertures are formed in the inertia mass to compensate for a channel and signal line so as to balance the inertia mass about the center of the inertia mass.
摘要:
A circuit and method are provided for generating a clipping distortion detector output signal for an integrated circuit audio amplifier which is independent of operating temperature and supply voltage. The system includes an audio amplifier having a voltage gain, a first input for receiving input voltage and an output for generating an amplified output voltage. A supply voltage is supplied to the audio amplifier and the supply voltage determines the maximum amplified output voltage. A comparison voltage is generated which is indicative of the output voltage divided by the voltage gain. A clip detector voltage comparator receives the input voltage and the comparison voltage and provides a clipping distortion detect signal when the input voltage deviates from the comparison voltage in excess of an offset voltage which is indicative of detection of excessive clipping distortion. The output voltage is adaptively controlled as a function of the supply voltage so as to maintain a substantially constant maximum percent distortion. In addition, the offset voltage is also controlled as a function of temperature to provide temperature compensation. The supply voltage and temperature compensation may be achieved by generating a current source as a function of supply voltage and temperature.
摘要:
A method of flip-chip mounting a circuit device to a substrate in a manner that avoids damage and impairment of a fragile or otherwise sensitive element on the device facing the substrate, and a circuit assembly produced thereby. The assembly includes a substrate having at least two sets of bonding sites spaced apart from each other to define an intermediate surface region therebetween. The device is attached to the bonding sites with solder connections, with the solder connections being present on a surface of the device that faces the substrate and on which the element is present so that the element overlies the intermediate surface region of the substrate. An underfill material is present between the device and the substrate and encapsulates the solder connections. The underfill material is separated from the intermediate surface region of the substrate so that the underfill material does not contact the element.