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    Method of protecting wafer front pattern and method of performing double-sided process
    4.
    发明授权
    Method of protecting wafer front pattern and method of performing double-sided process 失效
    保护晶片前端图案的方法和进行双面处理的方法

    公开(公告)号：US07235185B2

    公开(公告)日：2007-06-26

    申请号：US11163989

    申请日：2005-11-07

    Applicant: I-Ju Chen

    Inventor： I-Ju Chen

    IPC: B44C1/22 ,  H01L21/301

    CPC classification number: B81C1/00896 ,  B81C2201/053 ,  Y10S438/928

    Abstract: A wafer comprising a front surface and a back surface is provided. The wafer further includes a front pattern on the front surface, the front pattern having a plurality of holes. A low-viscosity fluid is formed on the front surface and filled into the holes. Following that, a high-viscosity fluid is formed and filled into the holes by diffusion.

    Abstract translation: 提供了包括前表面和后表面的晶片。 晶片还包括前表面上的前图案，前图案具有多个孔。 在前表面上形成低粘度流体并填充到孔中。 之后，形成高粘度流体并通过扩散填充到孔中。

    METHOD OF PROTECTING WAFER FRONT PATTERN AND METHOD OF PERFORMING DOUBLE-SIDED PROCESS
    5.
    发明申请
    METHOD OF PROTECTING WAFER FRONT PATTERN AND METHOD OF PERFORMING DOUBLE-SIDED PROCESS 失效
    保护正面图案的方法及执行双面工艺的方法

    公开(公告)号：US20070026674A1

    公开(公告)日：2007-02-01

    申请号：US11163989

    申请日：2005-11-07

    Applicant: I-Ju Chen

    Inventor： I-Ju Chen

    IPC: H01L21/302

    CPC classification number: B81C1/00896 ,  B81C2201/053 ,  Y10S438/928

    Abstract: A wafer comprising a front surface and a back surface is provided. The wafer further includes a front pattern on the front surface, the front pattern having a plurality of holes. A low-viscosity fluid is formed on the front surface and filled into the holes. Following that, a high-viscosity fluid is formed and filled into the holes by diffusion.

    Abstract translation: 提供了包括前表面和后表面的晶片。 晶片还包括前表面上的前图案，前图案具有多个孔。 在前表面上形成低粘度流体并填充到孔中。 之后，形成高粘度流体并通过扩散填充到孔中。

    BRAKE DISC
    6.
    发明申请
    BRAKE DISC 有权

    公开(公告)号：US20250052291A1

    公开(公告)日：2025-02-13

    申请号：US18522659

    申请日：2023-11-29

    Applicant: I-JU CHEN

    Inventor： I-JU CHEN

    IPC: F16D65/12

    Abstract: A brake disc is provided, wherein the brake disc includes: a main body including an inner disc and an outer disc disposed around the inner disc; connection mechanisms arranged on the main body each including a projection and an assembling portion which are assemblable with each other and respectively disposed on the inner and outer discs, the assembling portion including an assembling hole and a polygonal counterbore, the projection being inserted in the assembling hole; and blocking assemblies arranged on the main body each including first and second blocking units, the first and second blocking units blocking the projection in the axial direction, the first blocking unit being partially received in the polygonal counterbore.

    Array-type modularized light-emitting diode structure and a method for packaging the structure
    7.
    发明授权
    Array-type modularized light-emitting diode structure and a method for packaging the structure 失效
    阵列式模块化发光二极管结构及封装结构的方法

    公开(公告)号：US07329942B2

    公开(公告)日：2008-02-12

    申请号：US11131395

    申请日：2005-05-18

    Applicant: Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

    Inventor： Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

    IPC: H01L31/00 ,  H01L27/15 ,  H01L33/00 ,  H01L23/58

    CPC classification number: H01L33/641 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/00

    Abstract: An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate and an upper substrate fixed on the lower substrate. A material with high heat conductivity is selected as the material of the upper substrate. The upper substrate is formed with multiple arrayed dents and through holes on the bottom of each dent. A material with high heat conductivity is selected as the material of the lower substrate. The surface of the lower substrate is formed with a predetermined circuit layout card. The bottom face of the upper substrate is placed on the upper face of the lower substrate with the through holes of the dents respectively corresponding to the contact electrodes of the circuit layout card of the lower substrate. Multiple light-emitting diode crystallites are respectively fixed on the bottoms of the dents. Via the through holes, the electrodes of the light-emitting diode crystallites are electrically connected with the contact electrodes. Then the dents of the upper substrate are sealed to prevent the light-emitting diode crystallites from being oxidized.

    Abstract translation: 阵列式模块化发光二极管结构及封装结构的方法。 阵列型模块化发光二极管结构包括下基板和固定在下基板上的上基板。 选择具有高导热性的材料作为上基板的材料。 上基板在每个凹陷的底部形成多个排列的凹槽和通孔。 选择具有高导热性的材料作为下基板的材料。 下基板的表面形成有预定的电路布局卡。 上基板的底面被放置在下基板的上表面上，凹部的通孔分别对应于下基板的电路布局卡的接触电极。 多个发光二极管晶体分别固定在凹陷的底部。 通过通孔，发光二极管晶体的电极与接触电极电连接。 然后将上基板的凹痕密封，以防止发光二极管晶体被氧化。

    Array-type modularized light-emitting diode structure and a method for packaging the structure
    8.
    发明申请
    Array-type modularized light-emitting diode structure and a method for packaging the structure 失效
    阵列式模块化发光二极管结构及封装结构的方法

    公开(公告)号：US20060261357A1

    公开(公告)日：2006-11-23

    申请号：US11131395

    申请日：2005-05-18

    Applicant: Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

    Inventor： Ching-Fu Tsou ,  I-Ju Chen ,  Yeh-Chin Chao

    IPC: H01L29/06

    CPC classification number: H01L33/641 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/00

    Abstract: An array-type modularized light-emitting diode structure and a method for packaging the structure. The array-type modularized light-emitting diode structure includes a lower substrate and an upper substrate fixed on the lower substrate. A material with high heat conductivity is selected as the material of the upper substrate. The upper substrate is formed with multiple arrayed dents and through holes on the bottom of each dent. A material with high heat conductivity is selected as the material of the lower substrate. The surface of the lower substrate is formed with a predetermined circuit layout card. The bottom face of the upper substrate is placed on the upper face of the lower substrate with the through holes of the dents respectively corresponding to the contact electrodes of the circuit layout card of the lower substrate. Multiple light-emitting diode crystallites are respectively fixed on the bottoms of the dents. Via the through holes, the electrodes of the light-emitting diode crystallites are electrically connected with the contact electrodes. Then the dents of the upper substrate are sealed to prevent the light-emitting diode crystallites from being oxidized.

    Abstract translation: 阵列式模块化发光二极管结构及封装结构的方法。 阵列型模块化发光二极管结构包括下基板和固定在下基板上的上基板。 选择具有高导热性的材料作为上基板的材料。 上基板在每个凹陷的底部形成多个排列的凹槽和通孔。 选择具有高导热性的材料作为下基板材料。 下基板的表面形成有预定的电路布局卡。 上基板的底面被放置在下基板的上表面上，凹部的通孔分别对应于下基板的电路布局卡的接触电极。 多个发光二极管晶体分别固定在凹陷的底部。 通过通孔，发光二极管晶体的电极与接触电极电连接。 然后将上基板的凹痕密封，以防止发光二极管晶体被氧化。

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