High-efficiency water-cooled heat dissipation device

    公开(公告)号:US10816279B2

    公开(公告)日:2020-10-27

    申请号:US16177444

    申请日:2018-11-01

    Abstract: A high-efficiency water-cooled heat dissipation device includes a heat sink base, an inner cover, an impeller, a lower casing and a motor that are arranged from bottom to top. By providing the inner cover, the inner cover covers a fin portion of the heat sink base. When in use, a cold liquid flows into the inner cover from first perforations and is evenly distributed on the fin portion, and then flows out of a liquid outlet chamber from second perforations, so that the cold liquid can be effectively drained to avoid the mixing of the cold liquid and the hot liquid, thereby fully utilizing the cold liquid for heat absorption to improve the heat dissipation effect.

    RIVETING APPARATUS FOR THIN HEAT SINK FIN AND THIN COVER PLATE

    公开(公告)号:US20200206803A1

    公开(公告)日:2020-07-02

    申请号:US16698952

    申请日:2019-11-28

    Abstract: A riveting structure for a thin heat sink fin and a thin cover plate is disclosed. The riveting structure includes a plurality of thin heat sink fins and a thin cover plate. The top of each thin heat sink fin is provided with a raised portion, the thin cover plate is formed with a plurality of riveting holes, and the raised portion is riveted and fixed to a corresponding one of the riveting holes in a rolling manner by a rolling device, instead of the traditional manual welding method. This improves the assembly efficiency greatly, reduces the labor cost, and reduces the product defect rate effectively.

    Individual identity authentication systems
    5.
    发明申请
    Individual identity authentication systems 审中-公开
    个人身份认证系统

    公开(公告)号:US20070086626A1

    公开(公告)日:2007-04-19

    申请号:US10575130

    申请日:2003-10-08

    CPC classification number: G06K9/325 G06K9/00228 G07C9/00087

    Abstract: A single image from a camera (14) is captured of an individual (40) seeking entry through a door held by a door latch (24). An image processor (16) looks for and locates a tag (42) worn by the individual (40) in the image and reads an identification (ID) code from the tag (42). A comparator (20) compares this ID code with ID codes in an identification database (22) to find a match. Once a match of ID codes is found, the image processor (16) looks for and locates a face (44) of the individual (40) in the image and extracts facial features from the face (44). The comparator (20) compares the extracted facial features with facial features associated with the matched ID code, from the identification database (22), to find a match. Once there is a match of facial features, the door latch (24) is released.

    Abstract translation: 通过由门闩(24)保持的门寻求进入的单个(40)的摄像机(14)的单个图像。 图像处理器(16)查找并定位图像中由个人(40)佩戴的标签(42)并从标签(42)读取标识(ID)代码。 比较器(20)将该ID代码与识别数据库(22)中的ID代码进行比较以找到匹配。 一旦找到了ID码的匹配,则图像处理器(16)在图像中寻找并定位个体(40)的面部(44)并从面部(44)中提取面部特征。 所述比较器(20)从所述识别数据库(22)将所提取的面部特征与与所述匹配的ID码相关联的面部特征进行比较,以找到匹配。 一旦出现面部特征的匹配,门闩(24)被释放。

    Metals removal process
    7.
    发明授权
    Metals removal process 失效
    金属去除过程

    公开(公告)号:US6083413A

    公开(公告)日:2000-07-04

    申请号:US51686

    申请日:1998-10-01

    Abstract: A process for removing metallic material, for instance copper, iron, nickle and their oxides, from a surface of a substrate such as a silicon, silicon oxide or gallium arsenide substrate. The process includes the steps of: a) placing the substrate in a reaction chamber; b) providing in the reaction chamber a gas mixture, the mixture comprising a first component which is fluorine or a fluorine-containing compound, which will spontaneously dissociate upon adsorption on the substrate surface and a second component which is a halosilane compound, the halosilane, and the fluorine if present, being activated by: i) irradiation with UV; ii) heating to a temperature of about 800.degree. C. or higher; or iii) plasma generation, to thereby convert said metallic material to a volatile metal-halogen-silicon compound, and c) removing the metal-halogen-silicon compound from the substrate by volatilization. The process may be used to remove both dispersed metal and bulk metal films or islands.

    Abstract translation: PCT No.PCT / US96 / 16731 Sec。 371日期:1998年10月1日 102(e)1998年10月1日PCT PCT 1996年10月18日PCT公布。 第WO97 / 15069号公报 日期1997年04月24日从硅,氧化硅或砷化镓衬底等基板的表面除去金属材料,例如铜,铁,镍及其氧化物的方法。 该方法包括以下步骤:a)将基底放置在反应室中; b)在反应室中提供气体混合物,所述混合物包含第一组分,其为氟或含氟化合物,其将在基材表面上吸附时自发解离,第二组分为卤代硅烷化合物,卤代硅烷, 并且如果存在氟,则通过以下方式活化:i)用UV照射; ii)加热到约800℃或更高的温度; 或iii)等离子体产生,从而将所述金属材料转化为挥发性金属 - 卤素 - 硅化合物,和c)通过挥发从基材中除去金属 - 卤素 - 硅化合物。 该方法可用于除去分散的金属和体金属膜或岛。

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