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1.发明申请METHOD FOR MOUNTING ELECTRONIC COMPONENT AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT 有权用于安装电子元件的方法和用于安装电子元件的装置公开(公告)号：US20150013154A1
公开(公告)日：2015-01-15
申请号：US14388487
申请日：2013-02-27
发明人： Takuya Imoto , Tetsuji Ono , Yoshinori Okamoto
CPC分类号： H05K13/04 , B23Q17/24 , G05B19/4015 , G05B2219/50042 , H05K13/041 , H05K13/08 , H05K13/0812 , Y10T29/49131 , Y10T29/53087
摘要： A mid-operation instruction action mode is set when an operation for producing a printed circuit board starts, an offset value with respect to the center of rotation of a mounting head is determined in an interval according to the set mid-operation instruction action mode, and an instruction for saving the offset value in a memory of a control microcomputer is made. If the requisite accuracy is delivered as a result of the instructions being performed a plurality of times in continuation, the control microcomputer performs a control so that the instructions are performed over a greater interval than the interval according to the mid-operation instruction action mode. If the requisite accuracy is not delivered even if the instructions are performed over an interval greater than the interval, the control microcomputer performs a control so that the instructions are performed over an interval according to the set mid-operation instruction action mode.
摘要翻译： 当制造印刷电路板的操作开始时，设定中间操作指令动作模式，根据所设定的中间操作指令动作模式，在间隔内确定相对于安装头的旋转中心的偏移值， 并且进行用于将偏移值保存在控制微计算机的存储器中的指令。 如果作为连续执行指令的结果而传递必要的精度，则控制微计算机进行控制，使得在比根据中间操作指令动作模式的间隔更大的间隔执行指令。 如果即使在大于间隔的间隔执行指令的情况下，即使执行必要的精度，则控制微机进行控制，使得根据所设定的中间操作指令动作模式的间隔进行指令。
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2.发明申请公开(公告)号：US20140060751A1
公开(公告)日：2014-03-06
申请号：US13779934
申请日：2013-02-28
发明人： Keita YAMAMOTO , Naoki OKAMOTO
IPC分类号： H01L21/67
CPC分类号： H01L21/67121 , H01L21/67132 , H01L2221/68381 , Y10S156/932 , Y10S156/943 , Y10T156/1132 , Y10T156/1179 , Y10T156/1744 , Y10T156/1944 , Y10T156/1983
摘要： A die bonding apparatus includes a work supply/transfer portion for transferring a substrate; a bonding portion for conducting bonding of a die on the substrate; a wafer supply portion for supplying a wafer having the die thereon; and a controller portion for controlling equipment, wherein the wafer supply portion has a push-up unit for pushing up a dicing tape from a lower part, for separating the die from the dicing tape, and the push-up unit has a suction opening portion, which is configured to suck the dicing tape with vacuum, a push-up portion, which is made of an elastic body, sealing a fluid or a power therein, and is configured to push up the dicing tape, a cylinder, which is configured to apply pressure to the push-up portion, and an air supply means for supplying an air for changing the pressure within the cylinder through control of the controller portion.
摘要翻译： 芯片接合装置包括用于传送基板的工件供应/传送部分; 用于在基板上引导模具接合的接合部分; 晶片供给部，用于供给其上具有所述管芯的晶片; 以及用于控制设备的控制器部分，其中晶片供给部分具有用于从下部推动切割带的上推单元，用于将模具与切割带分离，并且上推单元具有吸入开口部分 被配置为真空吸附切割带，由弹性体制成的上推部分将流体或动力密封在其中，并且构造成将切割带向上推动，该构造被配置成 向上推部分施加压力;以及空气供给装置，用于通过控制器部分的控制提供用于改变气缸内的压力的空气。
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公开(公告)号：US20140251535A1
公开(公告)日：2014-09-11
申请号：US14104705
申请日：2013-12-12
发明人： Yoshihide ISHII , Hiroshi MAKI
CPC分类号： H01L21/67132 , H01L21/67028 , Y10T156/15
摘要： An object of the present invention is to provide a collet cleaning method and a die bonder using the same in which a collet can be cleaned without adding a new unit, and foreign substances with high adhesive power can be reliably removed without scattering the foreign substances.A die bonder includes a pickup device, a bonding head unit having a collet that absorbs dies from a wafer at the timing of lifting of the pickup device, and a control unit that controls the pickup device and the bonding head unit. The collet is moved to a position of a dicing tape at which no dies of the wafer held by a wafer ring exist to be brought into contact with the adhesive surface of the dicing tape, so that foreign substances attached to the tip end of the collet are removed.
摘要翻译： 本发明的目的在于提供一种夹头清洁方法和使用该夹头清洁方法的管芯接合器，其中可以在不添加新单元的情况下清洁夹头，并且可以可靠地除去具有高粘合力的异物，而不会分散异物。 芯片接合机包括拾取装置，具有在提取拾取装置的时间从晶片吸收模具的夹头的接合头单元以及控制拾取装置和接合头单元的控制单元。 将夹头移动到切割胶带的位置，在该位置，不存在由晶片环保持的晶片的模具与切割带的粘合表面接触，从而附着到夹头的末端的异物 被删除。
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公开(公告)号：US20140078289A1
公开(公告)日：2014-03-20
申请号：US13780065
申请日：2013-02-28
发明人： Ryo OMORI , Hideharu KOBASHI
CPC分类号： H04N7/18 , G06T7/70 , H01L21/67144 , H01L21/681 , H01L23/544 , H01L24/75 , H01L24/83 , H01L2223/5442 , H01L2223/5448 , H01L2224/32245 , H01L2224/756 , H01L2224/75702 , H01L2224/75753 , H01L2224/75901 , H01L2224/83192
摘要： A die bonder comprises a storage unit which stores the image of the wafer taken by an imaging unit, a recognition pattern included the outline of a die formed on the wafer, and a recognition program, and a monitor-processing unit which gets the position on the wafer, of the die whose map data indicates normal, in the way that the die is matched with the recognition pattern by executing the recognition program, and that the center position of the die is gotten.Thus, the die bonder can recognize the position of the die without regard to the condition of dies on the wafer.
摘要翻译： 芯片接合器包括存储单元，其存储由成像单元拍摄的晶片的图像，识别图案包括在晶片上形成的模具的轮廓，以及识别程序，以及监视器处理单元，其获取位置 晶片，其地图数据表示正常的模具，以通过执行识别程序与芯片与识别图案相匹配的方式，并且获得模具的中心位置。 因此，芯片接合器可以识别芯片的位置，而不考虑晶片上的管芯的状态。
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公开(公告)号：US09756770B2
公开(公告)日：2017-09-05
申请号：US14582881
申请日：2014-12-24
CPC分类号： H05K13/08 , H05K3/301 , H05K13/0417 , H05K13/0419 , Y10T29/4913 , Y10T29/53174
摘要： A control unit determines whether or not confirmation of a type of a tape processing unit is necessary, and performs identification processing of the type of the tape processing unit when confirmation of the type of the tape processing unit is determined as necessary. Then, this identification processing of the type is performed and the control unit determines whether or not an electronic component handleable by this tape processing unit coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component in a storage tape with an adsorption nozzle when the electronic component is determined as coinciding.
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公开(公告)号：US09325572B2
公开(公告)日：2016-04-26
申请号：US13917247
申请日：2013-06-13
发明人： Takashi Saegusa , Terunobu Funatsu , Manabu Okamoto , Ikuo Takemura , Masaharu Yoshida , Hideyuki Kamasuka
IPC分类号： G06F15/177 , H04L12/24 , H04L29/12
CPC分类号： H04L41/0803 , H04L61/2038
摘要： A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.
摘要翻译： 网络I / O系统包括具有通信端口的中央通信单元和具有上游通信端口和多个下游端口的多个终端通信单元，其中中央通信单元向终端通信单元发送路由数据 中央通信单元到终端通信单元，用于设置终端通信单元中的识别号码和终端通信单元的识别号码的数据，终端通信单元参考要发送到下游通信端口的数据并设置识别号码 在目标终端通信单元中，并且下行通信端口的通信端口号被附加到在通过终端通信单元时从终端通信单元发送到中央通信单元的路由识别数据，从而识别 网络c 配置
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7.发明申请公开(公告)号：US20150110588A1
公开(公告)日：2015-04-23
申请号：US14582892
申请日：2014-12-24
IPC分类号： H05K13/04
CPC分类号： H05K13/0417 , H05K13/0419
摘要： A feeder and a feeder control method, as well as an electronic component device, reliably engaging a supply tape in a loading operation even if there is an accumulated pitch error between sprocket holes. Third, second and first sprockets are arranged successively from an insertion port. The sprocket hole on a forward end portion of the inserted supply tape is fitted with a third tooth of the third sprocket in the loading operation. The supply tape is rotated by rotation of the third sprocket until fitting with a second tooth of the second sprocket, and the rotation of the third sprocket is stopped after the second tooth fits with the sprocket hole on the forward end portion.
摘要翻译： 馈线和馈线控制方法以及电子部件装置，即使在链轮孔之间存在累积的间距误差，也可以在加载操作中可靠地接合供带。 第三，第二和第一链轮从插入口连续布置。 插入的供给带的前端部上的链轮孔在装载操作中与第三链轮的第三齿配合。 供给带通过第三链轮的旋转而旋转，直到与第二链轮的第二齿配合，并且在第二齿与前端部上的链轮孔配合之后，第三链轮的旋转停止。
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8.发明申请DIE BONDER AND BONDING HEAD DEVICE OF THE SAME, AND ALSO COLLET POSITION ADJUSTING METHOD 审中-公开DIE BONDER和BONDING HEAD DEVICE OF THE SAME，AND THE COLLET POSITION ADJUSTING METHOD公开(公告)号：US20140265094A1
公开(公告)日：2014-09-18
申请号：US14025612
申请日：2013-09-12
CPC分类号： H01L24/75
摘要： For providing a die bonder, a bonding head device and a collet position adjusting method for enabling an automatic correction (adjustment) of errors, including height and inclination thereof, when exchanging a collet, with a simple structure thereof, in the bonding head device, having a holder 41h for guiding a vacuum for suction in an inside thereof, a shank 41s and a collet 41c, detachably attached at a tip of the holder, for adjusting the position of the collet after exchange of the collet, a reverse-side surface of that collet is photographed, before exchanging it, by a reverse-side surface photographing camera 42, which is disposed below the bonding head device, and after the exchange of the collet, the reverse-side surface of that collet exchanged, and then correction is made on positions of the collets, so that pictures photographed before/after the exchange thereof come to be coincident with.
摘要翻译： 为了提供一种管芯接合器，一种接合头装置和夹头位置调节方法，用于在接合头装置中以简单的结构更换夹头时能够自动校正（调整）错误，包括其高度和倾斜度， 具有用于引导其内部抽吸的真空的保持件41h，可拆卸地安装在保持器的末端的柄部41s和夹头41c，用于在更换夹头之后调节夹头的位置，反向侧面 在夹具之前，通过设置在接合头装置下方的反面表面拍摄照相机42拍摄该夹头，并且在更换夹头之后，将该夹头的反面进行更换，然后进行校正 是在夹头的位置上进行的，以便在交换之前/之后拍摄的照片与之相符。
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9.发明申请Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die Bonder 审中-公开水平轴驱动机构，双轴驱动机构和模具粘合机公开(公告)号：US20140074280A1
公开(公告)日：2014-03-13
申请号：US13784241
申请日：2013-03-04
IPC分类号： G05B19/18
CPC分类号： G05B19/18 , G05B2219/45033 , H02K7/06 , H02K11/21 , H02K16/00 , H02K41/031
摘要： A horizontal axis drive mechanism includes a first linear motor including a first fixed section and a first movable section fixing a load section and moving the load section in the horizontal direction, a support body supporting the first fixed section, a first linear guide arranged between the support body and the first fixed section and moving the first fixed section, a rotation conversion type counter including a rotating body rotatably supported by the support body and a converting means converting movement of the first fixed section in the horizontal direction into rotation of the rotating body, and a control section controlling the position of the first movable section in the horizontal direction.
摘要翻译： 水平轴驱动机构包括：第一线性电动机，包括第一固定部分和固定负载部分并沿着水平方向移动负载部分的第一可动部分;支撑第一固定部分的支撑体;布置在 支撑体和第一固定部分并移动第一固定部分，旋转转换型计数器包括由支撑体可旋转地支撑的旋转体，以及转换装置，其将第一固定部分在水平方向上的运动转换成旋转体的旋转 以及控制部，其控制第一可动部在水平方向上的位置。
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10.发明申请METHOD FOR MOUNTING ELECTRONIC COMPONENT AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT 有权用于安装电子元件的方法和用于安装电子元件的装置公开(公告)号：US20150143693A1
公开(公告)日：2015-05-28
申请号：US14582881
申请日：2014-12-24
CPC分类号： H05K13/08 , H05K3/301 , H05K13/0417 , H05K13/0419 , Y10T29/4913 , Y10T29/53174
摘要： A control unit determines whether or not confirmation of a type of a tape processing unit is necessary, and performs identification processing of the type of the tape processing unit when confirmation of the type of the tape processing unit is determined as necessary. Then, this identification processing of the type is performed and the control unit determines whether or not an electronic component handleable by this tape processing unit coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component in a storage tape with an adsorption nozzle when the electronic component is determined as coinciding.
摘要翻译： 控制单元确定是否需要确认一种类型的磁带处理单元，并且当需要确定磁带处理单元的类型的确认时，执行磁带处理单元的类型的识别处理。 然后，执行该类型的识别处理，并且控制单元确定由该磁带处理单元可处理的电子部件是否与馈送器基座中的部件布置编号的电子部件一致，以执行用于执行提取操作的控制 当电子部件被确定为重合时，用于具有吸附喷嘴的存储带中的电子部件。
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