公开(公告)号：US20240431035A1

公开(公告)日：2024-12-26

申请号：US18744851

申请日：2024-06-17

Applicant: HAESUNG DS CO., LTD.

Inventor： Myeong Jin HAN ,  Min Young HONG

IPC: H05K3/18 ,  H05K1/03 ,  H05K1/09

Abstract: A method of treating a surface of a printed circuit board (PCB) for a chip on board (COB) integrated circuit (IC) card includes generating a flexible copper foil laminated film by laminating copper foils on opposite sides of an insulating layer, forming a circuit pattern layer on opposite sides of the flexible copper foil laminated film, laminating nickel through electroplating on the opposite sides of the flexible copper foil laminated film having formed thereon the circuit pattern layer, and electroplating a copper-tin (CuSn) compound layer on a contact side on which the flexible copper foil laminated film having electroplated thereon nickel is exposed to outside.

公开(公告)号：US11876012B2

公开(公告)日：2024-01-16

申请号：US17018596

申请日：2020-09-11

Applicant: HAESUNG DS CO., LTD.

Inventor： Sung Il Kang ,  In Seob Bae ,  Jea Won Kim

IPC: H01L23/48 ,  H01L21/762 ,  H01L21/768 ,  H01L23/498

CPC classification number: H01L21/76224 ,  H01L21/76802 ,  H01L23/481 ,  H01L23/498

Abstract: A method of manufacturing a semiconductor package substrate includes forming a trench and a post by etching an upper surface of a base substrate including a conductive material, filling the trench with a resin, removing the resin exposed to outside of the trench such that an upper surface of the post and an upper surface of the resin are at same level, forming a conductive layer on an entire area of the upper surface of the post and the upper surface of the resin, and forming a circuit wiring including an upper circuit wiring and a lower circuit wiring by simultaneously patterning the conductive layer and a lower surface of the base substrate.

公开(公告)号：US20230102076A1

公开(公告)日：2023-03-30

申请号：US17932128

申请日：2022-09-14

Applicant: HAESUNG DS CO., LTD.

Inventor： Chonghan PARK

IPC: H05K3/00

Abstract: A reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a roller having a cylindrical shape, configured to rotate, and on which a substrate is wound; and a film body that is formed between the roller and the substrate to surround a surface of the roller and is rotatable, wherein the roller and the film body are separately rotated from each other.

公开(公告)号：US20230083630A1

公开(公告)日：2023-03-16

申请号：US17823984

申请日：2022-09-01

Applicant: HAESUNG DS CO., LTD.

Inventor： Jongwoo Park

IPC: B23Q1/64 ,  B65H18/10

Abstract: A working table for a reel-to-reel process includes: a supply reel configured to supply a workpiece; a collection reel configured to collect the workpiece after the workpiece is processed; a base on which the supply reel and the collection reel are installed; a processing workbench installed on the base to process the workpiece thereon; at least one balance adjuster installed on the base and configured to be moved according to weight variations of the supply reel and the collection reel; a balance drive unit configured to drive the at least one balance adjuster; and a controller configured to control the balance drive unit.

公开(公告)号：US11139220B2

公开(公告)日：2021-10-05

申请号：US16854679

申请日：2020-04-21

Applicant: HAESUNG DS CO., LTD.

Inventor： Jea Won Kim ,  Chong Han Park ,  Jong Woo Park

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: A flexible semiconductor package includes a semiconductor chip accommodated in a cavity formed in a substrate, a molding layer covering an entire upper surface of the substrate and the cavity, and a wiring portion including an insulating layer and a redistribution member provided under lower surfaces of the substrate and the semiconductor chip, wherein the molding layer includes a pre-preg in which a resin is impregnated with a glass fabric, and the molding layer and the insulating layer are attached to the semiconductor chip accommodated in the cavity by a roll-to-roll continuous process.

公开(公告)号：US10942070B2

公开(公告)日：2021-03-09

申请号：US16145046

申请日：2018-09-27

Applicant: HAESUNG DS CO., LTD.

Inventor： Jin Woo Lee

IPC: G01K1/14 ,  G01K7/02 ,  H05K3/40 ,  H05K1/02 ,  G01K1/16

Abstract: Provided is a temperature sensor including a carrier substrate; a sensor unit positioned on the carrier substrate and including a base layer and an electric conductive layer, the base layer having surface hygroscopicity, and the electric conductive layer being on an external surface of the base layer; a pad unit electrically connected to opposite ends of the sensor unit; and a cover unit positioned on the sensor unit and configured to cover the sensor unit.

公开(公告)号：US10910299B2

公开(公告)日：2021-02-02

申请号：US16145026

申请日：2018-09-27

Applicant: HAESUNG DS CO., LTD.

Inventor： In Seob Bae ,  Sung Il Kang ,  Dong Jin Yoon

IPC: H01L21/76 ,  H01L23/498 ,  H01L23/532 ,  H01L21/762 ,  H01L21/768

Abstract: Provided are a method of manufacturing a semiconductor package substrate, a semiconductor package substrate manufactured using the method of manufacturing a semiconductor package substrate, a method of manufacturing a semiconductor package, and a semiconductor package manufactured using the method of manufacturing a semiconductor package. The method of manufacturing a semiconductor package substrate includes forming first grooves or first trenches in a bottom surface of a base substrate having a top surface and the bottom surface and formed of a conductive material; filling the first grooves or trenches with resin; curing the resin; removing exposed portions of the resin overfilled in the first grooves or trenches; etching the top surface of the base substrate to expose at least portions of the resin filled in the first grooves or trenches; and forming a second groove or a second trench in the bottom surface of the base substrate.

公开(公告)号：US10749066B2

公开(公告)日：2020-08-18

申请号：US16183429

申请日：2018-11-07

Applicant: HAESUNG DS CO., LTD.

Inventor： Jin Woo Lee ,  Jin Kee Hong ,  Byung Moon Lee ,  Jong Woo Kim

IPC: H01L31/167 ,  H01L31/18 ,  H01L31/0224 ,  H01L31/024

Abstract: A proximity sensor includes a circuit board; a light-emitting element and a light-receiving element on the circuit board; a light barrier; molding portions; and a transparent board disposed on the molding portions and configured to form an air gap with the light-receiving element. The light-receiving element includes: a substrate having a light sensing area and a temperature sensing area; a first input electrode and a first output electrode which are aligned in the light sensing area and apart from each other with a first delay gap therebetween; a sensing film covering at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are aligned in the temperature sensing area and apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

公开(公告)号：US10739205B2

公开(公告)日：2020-08-11

申请号：US15651374

申请日：2017-07-17

Applicant: Haesung DS CO., Ltd.

Inventor： Jae Hoon Jang ,  Ho Sang Yu ,  Jin Woo Lee

IPC: G01K1/00 ,  G01K1/14 ,  G01K13/00

Abstract: Provided is a temperature sensor patch including: a base material having a lower surface that is an adhesive surface; a temperature sensor layer arranged on the base material, and including a temperature sensor at a side thereof and a connection terminal connected to the temperature sensor at the other side thereof; a cover layer configured to cover the temperature sensor layer and including a first opening exposing the connection terminal; and a module holder disposed inside the first opening, wherein a portion of the temperature sensor layer, where the connection terminal is arranged, is disposed on the module holder.

公开(公告)号：US10196367B2

公开(公告)日：2019-02-05

申请号：US14645904

申请日：2015-03-12

Applicant: HAESUNG DS CO., LTD

Inventor： Soeng Ick Kim ,  Dong-Soo Shin

IPC: C07D251/46 ,  H01L23/29 ,  A61K31/53 ,  H01L23/00

Abstract: Provided are a bleed-out preventing agent and a composition for preventing bleed-out including the same.