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1.发明申请Method for the preparation of nanometer scale particle arrays and the particle arrays prepared thereby 审中-公开用于制备纳米级粒子阵列的方法和由其制备的粒子阵列公开(公告)号：US20050201176A1
公开(公告)日：2005-09-15
申请号：US11055600
申请日：2005-02-11
Applicant: Giovanni Zangari , Ming Sun , Robert Metzger
Inventor： Giovanni Zangari , Ming Sun , Robert Metzger
CPC classification number: B82Y25/00 , C25D5/18 , C25D11/20 , G11B5/74 , G11B5/855 , G11B2005/0005 , H01F1/0063 , H01F1/0081 , Y10T428/12056
Abstract: A method is provided for the preparation of nanoscale particle arrays having highly uniform crystals of metal, semiconductor or insulator materials grown in nanopores in the surface of a substrate, wherein the method uses pulse-reverse electrodeposition of metals with a rectangular or square waveform in order to generate high homogeneity of crystals and high in-plane or out-of-plane anisotropy in a controlled manner, enabling the creation of a variety of devices, including but not limited to high density storage media.
Abstract translation: 提供了一种制备纳米级粒子阵列的方法，所述纳米级粒子阵列具有在衬底表面中生长在纳米孔中的金属，半导体或绝缘体材料的高度均匀晶体，其中该方法按顺序使用具有矩形或正方形波形的金属的脉冲反向电沉积 以受控的方式产生晶体的高均匀性和高的面内或面外各向异性，从而能够创建各种装置，包括但不限于高密度存储介质。
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Patent Agency Ranking
公开(公告)号：US20080143324A1
公开(公告)日：2008-06-19
申请号：US11953070
申请日：2007-12-09
Applicant: Thomas P. Low , C. Bruce Clark , Ronald E. Pelrine , Joseph S. Eckerle , Chris Smith , Giovanni Zangari
Inventor： Thomas P. Low , C. Bruce Clark , Ronald E. Pelrine , Joseph S. Eckerle , Chris Smith , Giovanni Zangari
IPC: G01B7/14
CPC classification number: F15B15/2861 , F15B15/2846 , F16F9/3221 , F16F9/3292 , G01D5/145 , G11B5/656 , G11B5/667 , G11B5/7325 , H01F10/16
Abstract: Described is a piston rod position-sensing system having a cylinder and piston rod arranged in the cylinder for movement with respect thereto. A magnetically hard layer is formed on the piston rod to provide a recording medium. The magnetically hard layer is made of a cobalt-phosphorous (Co—P)-based alloy. A magnetic pattern is recorded in the magnetically hard layer. A magnetic field sensor located in the cylinder senses the recorded magnetic pattern while the piston rod is moving with respect to the cylinder. Signals are generated in response to the sensed magnetic pattern for determining a position of the piston rod
Abstract translation: 描述了一种活塞杆位置感测系统，其具有设置在气缸中的气缸和活塞杆，用于相对于其移动。 在活塞杆上形成磁性硬层以提供记录介质。 磁性硬质层由钴 - 磷（Co-P）基合金制成。 磁性图案被记录在磁性硬层中。 位于气缸中的磁场传感器在活塞杆相对于气缸移动时感测记录的磁图。 响应于感测的磁图形而产生信号以确定活塞杆的位置
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公开(公告)号：US6048629A
公开(公告)日：2000-04-11
申请号：US118482
申请日：1998-07-17
Applicant: Pietro Luigi Cavalloti , Vittorio Sirtori , Giovanni Zangari
Inventor： Pietro Luigi Cavalloti , Vittorio Sirtori , Giovanni Zangari
CPC classification number: C25D3/60 , H05K3/3473 , Y10T29/49144 , Y10T428/12715
Abstract: An electronic device has a layer of high wettability tin-bismuth solder alloy on component leads and substrate pads. The solder is electrodeposited onto copper with an electrodeposition bath containing a zinc salt, although no zinc is co-deposited on the copper. The tin-bismuth layer has a low quantity of oxygen thereby increasing the wettability and decreasing the oxidation at the surface after reflowing.
Abstract translation: 电子器件在组件引线和衬底焊盘上具有高润湿性锡 - 铋焊料合金层。 使用含有锌盐的电沉积电池将焊料电沉积到铜上，尽管在铜上没有共沉积锌。 锡 - 铋层具有低的氧量，从而增加了润湿性，并且在回流之后减少了表面处的氧化。
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公开(公告)号：US5783059A
公开(公告)日：1998-07-21
申请号：US837860
申请日：1997-04-22
Applicant: Pietro Luigi Cavallotti , Vittorio Sirtori , Giovanni Zangari
Inventor： Pietro Luigi Cavallotti , Vittorio Sirtori , Giovanni Zangari
CPC classification number: C25D3/60 , H05K3/3473 , Y10T29/49144 , Y10T428/12715
Abstract: An electrodeposition bath for depositing a Sn alloy onto a Cu substrate containing a Zn salt. This bath is particularly useful for Pb free alloy, such as a Sn--Bi alloy. The presence of Zn in the elctrodeposition bath greatly influence the bath behaviour and the characteristics of the deposited alloy, even if no Zn is codeposited on the Cu substrate.
Abstract translation: 一种用于将Sn合金沉积到含有Zn盐的Cu基底上的电沉积浴。 这种浴对于诸如Sn-Bi合金的无铅合金是特别有用的。 即使没有Zn共沉积在Cu基底上，在电镀沉淀浴中存在的Zn很大程度上影响了镀液的性能和沉积合金的特性。
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公开(公告)号：US07737685B2
公开(公告)日：2010-06-15
申请号：US11953070
申请日：2007-12-09
Applicant: Thomas P. Low , C. Bruce Clark , Ronald E. Pelrine , Joseph S. Eckerle , Chris Smith , Giovanni Zangari
Inventor： Thomas P. Low , C. Bruce Clark , Ronald E. Pelrine , Joseph S. Eckerle , Chris Smith , Giovanni Zangari
IPC: G01B7/30
CPC classification number: F15B15/2861 , F15B15/2846 , F16F9/3221 , F16F9/3292 , G01D5/145 , G11B5/656 , G11B5/667 , G11B5/7325 , H01F10/16
Abstract: Described is a piston rod position-sensing system having a cylinder and piston rod arranged in the cylinder for movement with respect thereto. A magnetically hard layer is formed on the piston rod to provide a recording medium. The magnetically hard layer is made of a cobalt-phosphorous (Co—P)-based alloy. A magnetic pattern is recorded in the magnetically hard layer. A magnetic field sensor located in the cylinder senses the recorded magnetic pattern while the piston rod is moving with respect to the cylinder. Signals are generated in response to the sensed magnetic pattern for determining a position of the piston rod
Abstract translation: 描述了一种活塞杆位置感测系统，其具有设置在气缸中的气缸和活塞杆，用于相对于其移动。 在活塞杆上形成磁性硬层以提供记录介质。 磁性硬质层由钴 - 磷（Co-P）基合金制成。 磁性图案被记录在磁性硬层中。 位于气缸中的磁场传感器在活塞杆相对于气缸移动时感测记录的磁图。 响应于感测的磁图形而产生信号以确定活塞杆的位置
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公开(公告)号：US5759379A
公开(公告)日：1998-06-02
申请号：US811495
申请日：1997-03-05
Applicant: Pietro Luigi Cavallotti , Adelio Monzani , Vittorio Sirtori , Giovanni Zangari
Inventor： Pietro Luigi Cavallotti , Adelio Monzani , Vittorio Sirtori , Giovanni Zangari
CPC classification number: H05K3/244 , B23K35/007 , H05K3/3473 , B23K35/262 , H05K3/3463
Abstract: A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method comprises in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhances the mechanical and electrical properties of the solder alloy, allowing the use of lead (Pb) free alloys such as tin-bismuth (Sn--Bi).
Abstract translation: 使用锡（Sn）焊料合金将电子部件焊接到铜（Cu）基板上的焊接方法。 该方法包括在沉积Sn焊料合金之前，通过沉积锌（Zn）薄层来对Cu衬底进行预处理。 这种方法大大提高了焊料合金的机械和电气性能，允许使用无铅（Pb）合金，如锡 - 铋（Sn-Bi）。
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