Abstract:
Compounds having the structure of Formula I, including pharmaceutically acceptable salts of the compounds, wherein D1, D2 and D3 are each N, CH, or substituted CH, are CETP inhibitors and are useful for raising HDL-cholesterol, reducing LDL-cholesterol, and for treating or preventing atherosclerosis.
Abstract:
A page flipping method for an electronic device is provided. An exemplary method includes the following steps: displaying an interface comprising a page preview region and a page flipping region; displaying a page on the page flipping region, and displaying an icon group comprising a plurality of icons on the page preview region; determining whether a flipping gesture is applied on the page flipping region; determining the type of the flipping gesture; determining a page flipping manner according to the determined result of the gesture and a function table, and retrieving a corresponding target page according to the determined page flipping manner; creating a new icon group according to the retrieved target page; and displaying the target page on the page flipping region, and displaying the created new icon group on the page preview region. An electronic device using the page processing method is also provided.
Abstract:
Substituted spirocyclic amines of structural formula (I) are selective antagonists of the somatostatin subtype receptor 5 (SSTR5) and are useful for the treatment, control or prevention of disorders responsive to antagonism of SSTR5, such as Type 2 diabetes, insulin resistance, lipid disorders, obesity, atherosclerosis, Metabolic Syndrome, depression, and anxiety.
Abstract:
A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.
Abstract:
A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.
Abstract translation:功率模块包括第一功率芯片和第二功率芯片,每个芯片具有至少两个电极。 功率模块被应用于功率密度高于15W / inch 3且最大效率高于92%的功率转换器,或者功率密度高于20W / inch 3的功率转换器或具有高于 93%。 功率芯片中的至少一个以高于25kHz的频率工作。
Abstract:
A 2×2 opto-mechanical switch is disclosed. A first embodiment of the present invention utilizes a transmitting compact parallel prism and four or two pieces of the 45-degree prism to increase the beam separation. The compact parallel prism keeps a much smaller load to the relay arm. This makes the current invention less sensitive to the ambient shock and vibration. A second embodiment of the present invention utilizes a similar transmitting compact parallel prism and two wedge prisms which has similar advantages. The compact prism applies a small loading force to the relay arm. Both of these embodiments also feature superior thermal and mechanical stability. An opto-mechanical switch in accordance with the present invention utilizes a transmitting design and thus is more stable to ambient thermal or mechanical change. The embodiments of the present invention also feature much better repeatability than the conventional 2×2 optical switches.
Abstract:
An Internet based system and method for accurate marketing based on sharing of data, free advertising gifts and logistics includes a cross-web software application that runs in a network of computers. The application supports a marketing platform website with an interface for marketers to define and initiate a marketing project of delivering one or more types of free advertising gift to a targeted group of consumers. The application is communicatively coupled to a number of business-to-consumer websites that enable consumers to complete purchase transactions online. A consumer who is browsing or purchasing in one of the business-to-consumer websites is prompted whether or not he/she desires to accept a free gift. The consumer, if he/she responds positively, is directed to a page for registration and gift selection. The consumer will receive his/her selected gift through a delivery channel designated by the marketing website. By the multi-layer sharing mechanism, this system integrates data sharing, advertising sharing, and logistics sharing to reduce advertising cost, reduce gifts production and distribution costs, improve precision in consumer targeting, and improve brand recognition, and thus leads to lower impact on the environment.
Abstract:
The present invention provides a compound of formula (I) for an organic electroluminescent device: wherein X1, X2, X3, Y, Ar1, Ar2, Ar3, Ar4, Ar5, Ar6, and Ar7 are as defined in the description.
Abstract:
A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.