Process for the currentless metallization of electrically non-conductive
substrates
    10.
    发明授权
    Process for the currentless metallization of electrically non-conductive substrates 失效
    用于非导电衬底无电镀金属化的工艺

    公开(公告)号:US5932300A

    公开(公告)日:1999-08-03

    申请号:US913378

    申请日:1997-09-08

    摘要: A process for the currentless metallization of electrically non-conductive substrates, includes providing a substrate which is electrically non-conductive; depositing on the substrate a positive lacquer comprising at least one polymer which is UV hardenable, at least one organo-metalllic compound, and a substance which is light-active to provide a positive lacquer coated substrate; irradiating the positive lacquer coated substrate with UV radiation to provide an irradiated coated substrate; and precipitating a metal layer onto the irradiated coated substrate by currentless metallization in a bath effective therefore.

    摘要翻译: PCT No.PCT / DE96 / 00201 Sec。 371日期:1997年9月8日 102(e)1997年9月8日PCT PCT 1996年2月9日PCT公布。 公开号WO96 / 28588 日期1996年9月19日一种用于非导电衬底的无电镀金属化的工艺,包括提供不导电的衬底; 在基底上沉积包含至少一种可UV固化的聚合物,至少一种有机 - 金属化合物和一种轻的物质以提供正性涂漆的基材的正性漆; 用UV辐射照射正漆涂布的基底以提供经辐照的涂布的基底; 并通过在浴中无电镀金属化将金属层沉积在被照射的被涂覆的基底上,因此有效。