POLISHING HEAD ZONE BOUNDARY SMOOTHING
    2.
    发明申请
    POLISHING HEAD ZONE BOUNDARY SMOOTHING 有权
    抛光头带边界平滑

    公开(公告)号:US20130252518A1

    公开(公告)日:2013-09-26

    申请号:US13893030

    申请日:2013-05-13

    IPC分类号: B24B37/30

    CPC分类号: B24B37/30 B24B41/06

    摘要: A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. in one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly haying a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.

    摘要翻译: 提供了一种用于化学机械抛光的方法和装置,更具体地涉及一种用于化学机械抛光的载体的方法和装置。 在一个实施例中,承载头组件包括用于向衬底提供支撑的基座组件,安装在基座组件上的柔性膜,该基座组件具有大致圆形的中心部分,下表面提供衬底安装表面,以及多个可独立加压的腔室 形成在基部组件和柔性膜之间,包括环形外室和非圆形内腔。