Method of manufacturing a thin film transistor substrate
    1.
    发明授权
    Method of manufacturing a thin film transistor substrate 有权
    制造薄膜晶体管基板的方法

    公开(公告)号:US07803673B2

    公开(公告)日:2010-09-28

    申请号:US11871457

    申请日:2007-10-12

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a thin film transistor (“TFT”) substrate includes forming a gate insulating film and an active layer on a substrate, forming a data metal layer including a first, second, and third metal layers on the active layer, forming a first photoresist pattern on the data metal layer, dry-etching the third metal layer by using the first photoresist pattern, simultaneously dry-etching the second and first metal layers by using the first photoresist pattern, dry-etching the active layer by using the first photoresist pattern, etching the first photoresist pattern to form a second photoresist pattern by which the channel region is removed and forming a source electrode and a drain electrode by dry-etching the channel region of the data metal layer by using the second photoresist pattern.

    摘要翻译: 一种制造薄膜晶体管(“TFT”)基板的方法包括在基板上形成栅绝缘膜和有源层,在有源层上形成包括第一,第二和第三金属层的数据金属层,形成 在数据金属层上的第一光致抗蚀剂图案,通过使用第一光致抗蚀剂图案对第三金属层进行干蚀刻,同时使用第一光致抗蚀剂图案对第二和第一金属层进行干蚀刻,使用第一光致抗蚀剂图案 蚀刻第一光致抗蚀剂图案以形成除去沟道区的第二光致抗蚀剂图案,并通过使用第二光致抗蚀剂图案干蚀刻数据金属层的沟道区,形成源电极和漏电极。

    METHOD OF MANUFACTURING A THIN FILM TRANSISTOR SUBSTRATE
    3.
    发明申请
    METHOD OF MANUFACTURING A THIN FILM TRANSISTOR SUBSTRATE 有权
    制造薄膜晶体管基板的方法

    公开(公告)号:US20080090342A1

    公开(公告)日:2008-04-17

    申请号:US11871457

    申请日:2007-10-12

    IPC分类号: H01L21/336

    摘要: A method of manufacturing a thin film transistor (“TFT”) substrate includes forming a gate insulating film and an active layer on a substrate, forming a data metal layer including a first, second, and third metal layers on the active layer, forming a first photoresist pattern on the data metal layer, dry-etching the third metal layer by using the first photoresist pattern, simultaneously dry-etching the second and first metal layers by using the first photoresist pattern, dry-etching the active layer by using the first photoresist pattern, etching the first photoresist pattern to form a second photoresist pattern by which the channel region is removed and forming a source electrode and a drain electrode by dry-etching the channel region of the data metal layer by using the second photoresist pattern.

    摘要翻译: 一种制造薄膜晶体管(“TFT”)基板的方法包括在基板上形成栅绝缘膜和有源层,在有源层上形成包括第一,第二和第三金属层的数据金属层,形成 在数据金属层上的第一光致抗蚀剂图案,通过使用第一光致抗蚀剂图案对第三金属层进行干蚀刻,同时使用第一光致抗蚀剂图案对第二和第一金属层进行干蚀刻,使用第一光致抗蚀剂图案 蚀刻第一光致抗蚀剂图案以形成除去沟道区的第二光致抗蚀剂图案,并通过使用第二光致抗蚀剂图案干蚀刻数据金属层的沟道区,形成源电极和漏电极。