Cross-talk reduction through deep pixel well implant for image sensors
    2.
    发明授权
    Cross-talk reduction through deep pixel well implant for image sensors 有权
    通过图像传感器的深像素阱植入进行串扰减少

    公开(公告)号:US07388187B1

    公开(公告)日:2008-06-17

    申请号:US11682428

    申请日:2007-03-06

    CPC classification number: H01L27/14654 H01L27/1463

    Abstract: An image sensor device includes a semiconductor substrate having a first type of conductivity, a semiconductor layer having the first type of conductivity formed on the semiconductor substrate, and pixels formed in the semiconductor layer. The semiconductor layer includes a first deep well having the first type of conductivity and substantially underlying the plurality of pixels, and a second deep well having a second type of conductivity different from the first type of conductivity and substantially underlying the first deep well.

    Abstract translation: 图像传感器装置包括具有第一导电类型的半导体衬底,在半导体衬底上形成具有第一类型导电性的半导体层和形成在半导体层中的像素。 半导体层包括具有第一类型导电性并且基本上位于多个像素下面的第一深阱,以及具有不同于第一类型导电性的第二类型导电性并且基本上位于第一深阱的第二深阱。

    One-time programmable devices and methods of forming the same
    4.
    发明授权
    One-time programmable devices and methods of forming the same 有权
    一次性可编程器件及其形成方法

    公开(公告)号:US08653623B2

    公开(公告)日:2014-02-18

    申请号:US13107409

    申请日:2011-05-13

    Abstract: A one-time programmable (OTP) device includes at least one transistor that is electrically coupled with a fuse. The fuse includes a silicon-containing line continuously extending between a first node and a second node of the fuse. A first silicide-containing portion is disposed over the silicon-containing line. A second silicide-containing portion is disposed over the silicon-containing line. The second silicide-containing portion is separated from the first silicide-containing portion by a predetermined distance. The predetermined distance is substantially equal to or less than a length of the silicon-containing line.

    Abstract translation: 一次性可编程(OTP)器件包括至少一个与保险丝电耦合的晶体管。 保险丝包括在熔丝的第一节点和第二节点之间连续延伸的含硅线。 第一硅化物部分设置在含硅线上。 第二硅化物部分设置在含硅线上。 第二硅化物含有部分与第一硅化物含有部分分开预定距离。 预定距离基本上等于或小于含硅线的长度。

    Method and device to reduce dark current in image sensors
    5.
    发明授权
    Method and device to reduce dark current in image sensors 有权
    降低图像传感器暗电流的方法和装置

    公开(公告)号:US08368130B2

    公开(公告)日:2013-02-05

    申请号:US12968047

    申请日:2010-12-14

    CPC classification number: H01L27/14689 H01L27/14609

    Abstract: A method to fabricate an image sensor includes providing a semiconductor substrate having a pixel area and a logic area, forming a light sensing element in the pixel area, and forming a first transistor in the pixel area and a second transistor in the logic area. The step of forming the first transistor in the pixel area and the second transistor in the logic area includes performing a first implant process in the pixel area and the logic area, performing a second implant process in the pixel area and the logic area, and performing a third implant process only in the logic area.

    Abstract translation: 制造图像传感器的方法包括提供具有像素区域和逻辑区域的半导体衬底,在像素区域中形成光感测元件,以及在像素区域中形成第一晶体管和在逻辑区域中形成第二晶体管。 在逻辑区域中的像素区域和第二晶体管中形成第一晶体管的步骤包括在像素区域和逻辑区域中执行第一注入处理,在像素区域和逻辑区域中执行第二注入处理,以及执行 仅在逻辑区域中进行第三次植入过程。

    METHOD AND DEVICE TO REDUCE DARK CURRENT IN IMAGE SENSORS
    7.
    发明申请
    METHOD AND DEVICE TO REDUCE DARK CURRENT IN IMAGE SENSORS 有权
    减少图像传感器中的暗电流的方法和装置

    公开(公告)号:US20110133260A1

    公开(公告)日:2011-06-09

    申请号:US12968047

    申请日:2010-12-14

    CPC classification number: H01L27/14689 H01L27/14609

    Abstract: A method to fabricate an image sensor includes providing a semiconductor substrate having a pixel area and a logic area, forming a light sensing element in the pixel area, and forming a first transistor in the pixel area and a second transistor in the logic area. The step of forming the first transistor in the pixel area and the second transistor in the logic area includes performing a first implant process in the pixel area and the logic area, performing a second implant process in the pixel area and the logic area, and performing a third implant process only in the logic area.

    Abstract translation: 制造图像传感器的方法包括提供具有像素区域和逻辑区域的半导体衬底,在像素区域中形成光感测元件,以及在像素区域中形成第一晶体管和在逻辑区域中形成第二晶体管。 在逻辑区域中的像素区域和第二晶体管中形成第一晶体管的步骤包括在像素区域和逻辑区域中执行第一注入处理,在像素区域和逻辑区域中执行第二注入处理,以及执行 仅在逻辑区域中进行第三次植入过程。

    Method and device to reduce dark current in image sensors
    9.
    发明授权
    Method and device to reduce dark current in image sensors 有权
    降低图像传感器暗电流的方法和装置

    公开(公告)号:US07879639B2

    公开(公告)日:2011-02-01

    申请号:US11735226

    申请日:2007-04-13

    CPC classification number: H01L27/14689 H01L27/14609

    Abstract: A method to fabricate an image sensor includes providing a semiconductor substrate having a pixel area and a logic area, forming a light sensing element in the pixel area, and forming a first transistor in the pixel area and a second transistor in the logic area. The step of forming the first transistor in the pixel area and the second transistor in the logic area includes performing a first implant process in the pixel area and the logic area, performing a second implant process in the pixel area and the logic area, and performing a third implant process only in the logic area.

    Abstract translation: 制造图像传感器的方法包括提供具有像素区域和逻辑区域的半导体衬底,在像素区域中形成光感测元件,以及在像素区域中形成第一晶体管和在逻辑区域中形成第二晶体管。 在逻辑区域中的像素区域和第二晶体管中形成第一晶体管的步骤包括在像素区域和逻辑区域中执行第一注入处理,在像素区域和逻辑区域中执行第二注入处理,以及执行 仅在逻辑区域中进行第三次植入过程。

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