Abstract:
The present disclosure provides a semiconductor device. The semiconductor device includes an electrical-free dummy gate formed over a substrate. The dummy gate has an elongate shape and is oriented along a first direction. The semiconductor device includes a first functional gate formed over the substrate. The first functional gate has an elongate shape and is oriented along the first direction. The first functional gate is separated from the dummy gate in a second direction perpendicular to the first direction. A first conductive contact is formed on the first functional gate. The semiconductor device includes a second functional gate formed over the substrate. The second functional gate has an elongate shape and is oriented along the first direction. The second functional gate is aligned with and physically separated from the dummy gate in the first direction. A second conductive contact is formed on the second functional gate.
Abstract:
The present disclosure involves a method of fabricating a semiconductor device. The method includes providing a substrate having a material layer formed thereon; depositing a photoresist layer on the material layer, the photoresist layer having a vertical dimension; exposing a region of the photoresist layer to radiation, the exposed region having a horizontal dimension, wherein a first ratio of the vertical dimension to the horizontal dimension exceeds a predetermined ratio; and developing the photoresist layer to remove the exposed region at least in part through applying a developer solution containing a first chemical and a second chemical, wherein: the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction; the second chemical is configured to enhance flow of the first chemical that comes into contact with the photoresist layer; and an optimized second ratio exists between the first chemical and the second chemical.
Abstract:
An overlay mark suitable for use in manufacturing nonplanar circuit devices and a method for forming the overlay mark are disclosed. An exemplary embodiment includes receiving a substrate having an active device region and an overlay region. One or more dielectric layers and a hard mask are formed on the substrate. The hard mask is patterned to form a hard mask layer feature configured to define an overlay mark fin. Spacers are formed on the patterned hard mask layer. The spacers further define the overlay mark fin and an active device fin. The overlay mark fin is cut to form a fin line-end used to define a reference location for overlay metrology. The dielectric layers and the substrate are etched to further define the overlay mark fin.
Abstract:
A method for fabricating a device is disclosed. An exemplary method includes providing a substrate and forming a plurality of fins over the substrate. The method further includes forming a first opening in the substrate in a first longitudinal direction. The method further includes forming a second opening in the substrate in a second longitudinal direction. The first and second longitudinal directions are different. The method further includes depositing a filling material in the first and second openings.
Abstract:
A method of planar imaging on semiconductor chips using focused ion beam includes the initial step of disposing at least a positioning symbol to designate a testing area. A metal membrane is positioned on the testing area. The testing chip is trimmed to form a first testing chip. A blind opening is cut proximate to the testing area on the first testing chip forms a second testing chip. The second testing chip is mounted on an inclinable platform. The mounted second testing chip is rotated with the inclinable platform. Ion beams are emitted into the opening at an angle of inclination. Ion beams are emitted in the direction of the incident ray to form planar images of different depths parallel to the metal membrane on the testing area.
Abstract:
The present disclosure provides one embodiment of an integrated circuit (IC) design method. The method includes receiving an IC design layout having a plurality of IC features. The method includes identifying, from the IC design layout, simple features as a first layout wherein the first layout does not violate design rules; and complex features as a second layout wherein the second layout violates the design rules. The method further includes generating a third layout and a fourth layout from the second layout wherein the third layout includes the complex features and connecting features to meet the design rules and the fourth layout includes trimming features.
Abstract:
A selectable backup power supply device for providing power to a real time clock (RTC) and a memory unit is disclosed. The device includes a backup battery, a first power outputting unit and a second power outputting unit, wherein the backup battery outputs a backup voltage, the first power outputting unit is connected to the backup battery and the RTC for receiving the backup voltage and outputting a first supply voltage to the RTC, and the second power outputting unit is connected to the backup battery and the memory unit, for receiving the backup voltage and, in accordance with a selection signal, outputting a second supply voltage to the memory unit or stopping the output of the second supply voltage.
Abstract:
A selectable backup power supply device for providing power to a real time clock (RTC) and a memory unit is disclosed. The device includes a backup battery, a first power outputting unit and a second power outputting unit, wherein the backup battery outputs a backup voltage, the first power outputting unit is connected to the backup battery and the RTC for receiving the backup voltage and outputting a first supply voltage to the RTC, and the second power outputting unit is connected to the backup battery and the memory unit, for receiving the backup voltage and, in accordance with a selection signal, outputting a second supply voltage to the memory unit or stopping the output of the second supply voltage.
Abstract:
A workpiece feeding device used in a saw machine is disclosed to include a carrier having a base frame movably mounted on the machine base of the saw machine and an angle scale fastened to the base frame, a fence unit having a rip fence pivotally mounted on the base frame of the carrier and biasable relative to the angle scale, a magnetic plate assembly mounted on the base frame of the carrier and carrying a magnetic strip, and a magnetic sensor mounted in the fence unit and movable with the fence unit to measure the biasing angle of the fence unit relative to the angle scale subject to change of magnetic induction between the magnetic sensor and the magnetic strip.