公开(公告)号：US20080009153A1

公开(公告)日：2008-01-10

申请号：US11801274

申请日：2007-05-08

Applicant: Toniady Tan ,  Cheng-Chung Yu ,  Hung-Chi Wei ,  Chih-Hou Chang ,  Huan-Shiang Li

Inventor： Toniady Tan ,  Cheng-Chung Yu ,  Hung-Chi Wei ,  Chih-Hou Chang ,  Huan-Shiang Li

IPC: H01R12/04 ,  H01L23/04

CPC classification number: H01L23/49855 ,  H01L23/4334 ,  H01L2224/48227 ,  H01L2924/16152 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/10159 ,  H05K2201/1034 ,  H05K2201/10924

Abstract: A semiconductor package and its fabrication method are disclosed. The fabrication method has the steps of: providing at least a lead frame having a plurality of terminal leads formed with flat portions and contacting portions, providing at least a circuit board having a plurality of electrical connection pads, mounting the contacting portions on and electrically connecting to the electrical connection pads, attaching and electrically connecting electronic elements to the circuit board, forming an encapsulant for encapsulating the lead frames and the electronic elements but uncovering the flat portions of the terminal leads, and cutting around the circuit board along a cutting path that crosses through each of the terminal leads so as to allow each of the terminal leads to be electrically independent, wherein the terminal leads are employed to act as the electrical terminals of USB memory cards for storing or retrieving data.

Abstract translation: 公开了半导体封装及其制造方法。 该制造方法具有以下步骤：至少提供具有形成有平坦部分和接触部分的多个端子引线的引线框架，至少提供具有多个电连接焊盘的电路板，将接触部分安装在其上并电连接 连接到电连接焊盘，将电子元件附接并电连接到电路板，形成用于封装引线框和电子元件的密封剂，但是露出端子引线的平坦部分，并沿着切割路径切割电路板 跨越每个终端引线，以便允许每个终端引线是电气独立的，其中终端引线被用作用于存储或检索数据的USB存储卡的电端子。

公开(公告)号：US20070267732A1

公开(公告)日：2007-11-22

申请号：US11801303

申请日：2007-05-08

Applicant: Toniady Tan ,  Cheng-Chung Yu ,  Hung-Chi Wei ,  Chih-Hou Chang ,  Huan-Shiang Li

Inventor： Toniady Tan ,  Cheng-Chung Yu ,  Hung-Chi Wei ,  Chih-Hou Chang ,  Huan-Shiang Li

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L23/49855 ,  G06K19/077 ,  G06K19/07732 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/45144 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit card module and a method for fabricating the same are disclosed. The present invention includes the steps of providing a carrier having at least a first carrying region and a second carrying region that are co-planar; respectively mounting a substrate electrically connected to a first chip on the first carrying region, and a second chip electrically connected the substrate on the second carrying region, wherein the substrate is provided with at least an area of electrical connecting portion for being connected with external devices so as to reduce areas required for mounting a larger substrate or another substrate, thereby allowing a circuit card module to be fabricated with a minimized substrate.

Abstract translation: 公开了一种电路卡模块及其制造方法。 本发明包括提供具有至少第一承载区域和共面的第二承载区域的载体的步骤; 分别将与第一芯片电连接的基板安装在第一承载区域上，以及将基板电连接到第二承载区域上的第二芯片，其中基板设置有至少一个电连接部分的区域，用于与外部装置连接 以减少安装较大的基板或另一基板所需的面积，从而允许以最小化的基板制造电路卡模块。

公开(公告)号：US20050214493A1

公开(公告)日：2005-09-29

申请号：US10813512

申请日：2004-03-29

Applicant: Cheng-Chung Yu

Inventor： Cheng-Chung Yu

IPC: B32B13/14 ,  B32B1/08 ,  B32B13/00 ,  C04B18/08 ,  C04B18/14 ,  C04B18/16 ,  C04B24/24 ,  C04B28/02 ,  C09J11/04 ,  C09J201/00

CPC classification number: B32B13/14 ,  B32B1/00 ,  B32B1/08 ,  B32B5/022 ,  B32B13/00 ,  B32B2305/70 ,  B32B2419/00 ,  C04B28/02 ,  C04B2111/00612 ,  Y02W30/92 ,  Y02W30/94 ,  Y02W30/95 ,  Y10T428/1393 ,  C04B18/06 ,  C04B18/08 ,  C04B18/10 ,  C04B18/14 ,  C04B18/16 ,  C04B24/34

Abstract: A refractory building structure includes a regeneration layer, and at least one non-metallic fiber layer mounted in the regeneration layer. The regeneration layer is coated on an outside of the non-metallic fiber layer and includes cement, mineral waste and adhesive. Thus, the refractory building structure efficiently reuses the waste material, thereby recycling the natural resources, and thereby reducing the environmental pollution.

Abstract translation: 耐火建筑结构包括再生层和安装在再生层中的至少一个非金属纤维层。 再生层涂覆在非金属纤维层的外侧，包括水泥，矿物废料和粘合剂。 因此，耐火建筑结构有效地重新利用废料，从而回收自然资源，从而减少了环境污染。