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1.发明授权公开(公告)号：US08373991B2
公开(公告)日：2013-02-12
申请号：US12172171
申请日：2008-07-11
IPC分类号： H05K7/20
CPC分类号： H05K7/20481 , F28F2013/006 , Y10T428/24273 , Y10T428/24777 , Y10T428/2822
摘要： The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.
摘要翻译： 本发明提供一种金属热界面材料（TIM），其在其主体上具有通孔和/或其边界上的/或之字形或波形，其适用于从集成电路管芯到其相关联的热传导路径的热界面 封装微电子元件的散热片。 本发明还包括热模块和包括金属热界面材料的封装微电子部件。
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2.发明授权公开(公告)号：US07576428B2
公开(公告)日：2009-08-18
申请号：US11735443
申请日：2007-04-14
申请人： Yuan-Chang Fann , Jen-Dong Hwang , Cheng-Chou Wong
发明人： Yuan-Chang Fann , Jen-Dong Hwang , Cheng-Chou Wong
IPC分类号： H01L23/373
CPC分类号： C22C28/00 , C22C12/00 , C22C30/00 , F28F2013/006 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L23/4275 , H01L33/641 , H01L33/648 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011
摘要： A melting temperature adjustable metal thermal interface material (TIM) is provided. The metal TIM includes In, Bi, Sn, and Ga. A content of Ga ranges from 0.01 wt % to 3 wt %. The metal TIM has an initial melting temperature lower than 60° C. and has no element hazardous to the environment.
摘要翻译： 提供熔化温度可调的金属热界面材料（TIM）。 金属TIM包括In，Bi，Sn和Ga，Ga的含量为0.01重量％〜3重量％。 金属TIM具有低于60℃的初始熔融温度，并且没有对环境有害的元素。
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3.发明申请公开(公告)号：US20090135567A1
公开(公告)日：2009-05-28
申请号：US12172171
申请日：2008-07-11
CPC分类号： H05K7/20481 , F28F2013/006 , Y10T428/24273 , Y10T428/24777 , Y10T428/2822
摘要： The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.
摘要翻译： 本发明提供一种金属热界面材料（TIM），其在其主体上具有通孔和/或其边界上的/或之字形或波形，其适用于从集成电路管芯到其相关联的热传导路径的热界面 封装微电子元件的散热片。 本发明还包括热模块和包括金属热界面材料的封装微电子部件。
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4.发明申请MELTING TEMPERATURE ADJUSTABLE METAL THERMAL INTERFACE MATERIALS AND APPLICATION THEREOF 有权熔融温度可调式金属热界面材料及其应用公开(公告)号：US20080110609A1
公开(公告)日：2008-05-15
申请号：US11735443
申请日：2007-04-14
申请人： Yuan-Chang Fann , Jen-Dong Hwang , Cheng-Chou Wong
发明人： Yuan-Chang Fann , Jen-Dong Hwang , Cheng-Chou Wong
CPC分类号： C22C28/00 , C22C12/00 , C22C30/00 , F28F2013/006 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L23/4275 , H01L33/641 , H01L33/648 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011
摘要： A melting temperature adjustable metal thermal interface material (TIM) is provided. The metal TIM includes In, Bi, Sn, and Ga. A content of Ga ranges from 0.01 wt % to 3 wt %. The metal TIM has an initial melting temperature lower than 60° C. and has no element hazardous to the environment.
摘要翻译： 提供熔化温度可调的金属热界面材料（TIM）。 金属TIM包括In，Bi，Sn和Ga，Ga的含量为0.01重量％〜3重量％。 金属TIM具有低于60℃的初始熔融温度，并且没有对环境有害的元素。
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5.发明申请公开(公告)号：US20090236729A1
公开(公告)日：2009-09-24
申请号：US12477895
申请日：2009-06-03
CPC分类号： C22C28/00 , C22C12/00 , C22C30/00 , F28F2013/006 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L23/4275 , H01L33/641 , H01L33/648 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011
摘要： A melting temperature adjustable metal thermal interface material (TIM) and a packaged semiconductor including thereof are provided. The metal TIM includes about 20-98 wt % of In, about 0.03-4 wt % of Ga, and at least one element of Bi, Sn, Ag and Zn. The metal TIM has an initial melting temperature between about 60-144° C.
摘要翻译： 提供熔融温度可调金属热界面材料（TIM）及其包括的封装半导体。 金属TIM包括约20-98重量％的In，约0.03-4重量％的Ga和至少一种Bi，Sn，Ag和Zn的元素。 金属TIM具有约60-144℃的初始熔融温度
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6.发明授权公开(公告)号：US08785026B2
公开(公告)日：2014-07-22
申请号：US12967002
申请日：2010-12-13
申请人： Hsien-Lin Hu , Jenn-Dong Hwang , Cheng-Chou Wong , Chin-Chuan Chang , Sheng-Fa Yeh , Bing-Ming Lin , Yu-Min Peng
发明人： Hsien-Lin Hu , Jenn-Dong Hwang , Cheng-Chou Wong , Chin-Chuan Chang , Sheng-Fa Yeh , Bing-Ming Lin , Yu-Min Peng
IPC分类号： H01M10/50
CPC分类号： H01M2/1077 , H01M10/0525 , H01M10/613 , H01M10/617 , H01M10/625 , H01M10/643 , H01M10/6554 , H01M10/6555
摘要： A protection structure for preventing thermal dissipation and thermal runaway diffusion in battery system is provided. The protection structure includes a battery module casing and at least one composite heat conduction plate. There is a plurality of unit cells disposed in the battery module casing. The composite heat conduction plate is located within the battery module casing, contacted with the battery module casing, and sandwiched between at least two of the unit cells as a heat transmission medium between the cells and the casing to control heat transmission among the cells. The composite heat conduction plate is a multilayer anisotropic heat conduction structure constituted by at least one heat conduction layer and at least one heat insulation layer.
摘要翻译： 提供了一种用于防止电池系统中的散热和热失控扩散的保护结构。 保护结构包括电池模块外壳和至少一个复合导热板。 存在设置在电池模块壳体中的多个单元电池。 复合导热板位于电池模块壳体内，与电池模块壳体接触，并且夹在至少两个单电池之间，作为电池和壳体之间的传热介质，以控制电池之间的热传递。 复合导热板是由至少一个导热层和至少一个绝热层构成的多层各向异性热传导结构。
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7.发明申请Heat dissipation device and composite material with high thermal conductivity 审中-公开散热装置和具有高导热性的复合材料公开(公告)号：US20070053166A1
公开(公告)日：2007-03-08
申请号：US11453416
申请日：2006-06-14
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for an electronic device includes a first heat dissipation element contacting the electronic device, wherein the material of the first heat dissipation element includes a composite material with high thermal conductivity comprising carbon fiber or porous graphite. The material with high thermal conductivity includes a fibrous structure and a matrix.
摘要翻译： 一种用于电子设备的散热装置包括与电子设备接触的第一散热元件，其中第一散热元件的材料包括具有高导热率的复合材料，包括碳纤维或多孔石墨。 具有高导热性的材料包括纤维结构和基体。
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公开(公告)号：US20130164510A1
公开(公告)日：2013-06-27
申请号：US13467976
申请日：2012-05-09
申请人： Chien-Ming CHEN , Yao-Chu CHUNG , Fu-Ming CHIEN , Chun-Hsiung LIAO , Chih-Jen CHANG , Chin-Lang WU , Tien-Jung HUANG , Cheng-Chou WONG , Chih-Chung CHANG
发明人： Chien-Ming CHEN , Yao-Chu CHUNG , Fu-Ming CHIEN , Chun-Hsiung LIAO , Chih-Jen CHANG , Chin-Lang WU , Tien-Jung HUANG , Cheng-Chou WONG , Chih-Chung CHANG
CPC分类号： C09K5/14 , B82Y30/00 , Y10T428/24942
摘要： Disclosed is a high thermally conductive composite, including a first composite and a second composite having a co-continuous and incompatible dual-phase manner. The first composite consists of glass fiber distributed into polyphenylene sulfide, and the second composite consists of carbon material distributed into polyethylene terephthalate. The carbon material includes graphite, graphene, carbon fiber, carbon nanotube, or combinations thereof.
摘要翻译： 公开了一种高导热复合材料，包括第一复合材料和第二复合材料，其具有共连续和不相容的双相方式。 第一种复合材料由分布在聚苯硫醚中的玻璃纤维组成，第二种复合材料由分布在聚对苯二甲酸乙二醇酯中的碳材料组成。 碳材料包括石墨，石墨烯，碳纤维，碳纳米管或其组合。
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9.发明申请公开(公告)号：US20110159340A1
公开(公告)日：2011-06-30
申请号：US12967002
申请日：2010-12-13
申请人： Hsien-Lin Hu , Jenn-Dong Hwang , Cheng-Chou Wong , Chin-Chuan Chang , Sheng-Fa Yeh , Bing-Ming Lin , Yu-Min Peng
发明人： Hsien-Lin Hu , Jenn-Dong Hwang , Cheng-Chou Wong , Chin-Chuan Chang , Sheng-Fa Yeh , Bing-Ming Lin , Yu-Min Peng
IPC分类号： H01M10/50
CPC分类号： H01M2/1077 , H01M10/0525 , H01M10/613 , H01M10/617 , H01M10/625 , H01M10/643 , H01M10/6554 , H01M10/6555
摘要： A protection structure for preventing thermal dissipation and thermal runaway diffusion in battery system is provided. The protection structure includes a battery module casing and at least one composite heat conduction plate. There is a plurality of unit cells disposed in the battery module casing. The composite heat conduction plate is located within the battery module casing, contacted with the battery module casing, and sandwiched between at least two of the unit cells as a heat transmission medium between the cells and the casing to control heat transmission among the cells. The composite heat conduction plate is a multilayer anisotropic heat conduction structure constituted by at least one heat conduction layer and at least one heat insulation layer.
摘要翻译： 提供了一种用于防止电池系统中的散热和热失控扩散的保护结构。 保护结构包括电池模块外壳和至少一个复合导热板。 存在设置在电池模块壳体中的多个单元电池。 复合导热板位于电池模块壳体内，与电池模块壳体接触，并且夹在至少两个单电池之间，作为电池和壳体之间的传热介质，以控制电池之间的热传递。 复合导热板是由至少一个导热层和至少一个绝热层构成的多层各向异性热传导结构。
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10.发明授权公开(公告)号：US07952192B2
公开(公告)日：2011-05-31
申请号：US12477895
申请日：2009-06-03
IPC分类号： H01L23/373
CPC分类号： C22C28/00 , C22C12/00 , C22C30/00 , F28F2013/006 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L23/4275 , H01L33/641 , H01L33/648 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011
摘要： A melting temperature adjustable metal thermal interface material (TIM) and a packaged semiconductor including thereof are provided. The metal TIM includes about 20-98 wt % of In, about 0.03-4 wt % of Ga, and at least one element of Bi, Sn, Ag and Zn. The metal TIM has an initial melting temperature between about 60-144° C.
摘要翻译： 提供熔融温度可调金属热界面材料（TIM）及其包括的封装半导体。 金属TIM包括约20-98重量％的In，约0.03-4重量％的Ga和至少一种Bi，Sn，Ag和Zn的元素。 金属TIM具有约60-144℃的初始熔融温度
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