Method of fabricating an image sensor
    1.
    发明授权
    Method of fabricating an image sensor 有权
    制作图像传感器的方法

    公开(公告)号:US06617189B1

    公开(公告)日:2003-09-09

    申请号:US10063949

    申请日:2002-05-28

    IPC分类号: H01L2100

    摘要: A method of fabricating an image sensor on a semiconductor substrate including a sensor array region is introduced. First, an R/G/B color filter array (CFA) is formed on portions of the semiconductor substrate corresponding to the sensor array region. Then, a spacer layer is formed on the R/G/B CFA, and a plurality of U-lens is formed on the spacer layer corresponding to the R/G/B CFA. Afterwards, a buffer layer is coated to fill a space between the U-lens, and a low-temperature passivation layer is deposited on the buffer layer and the U-lens at a temperature of about 300° C. or less to prevent the R/G/B CFA from damage.

    摘要翻译: 引入了在包括传感器阵列区域的半导体衬底上制造图像传感器的方法。 首先,在对应于传感器阵列区域的半导体衬底的部分上形成R / G / B滤色器阵列(CFA)。 然后,在R / G / B CFA上形成间隔层,在对应于R / G / B CFA的间隔层上形成多个U型透镜。 然后,涂覆缓冲层以填充U型透镜之间的空间,并且在约300℃或更低的温度下在缓冲层和U型透镜上沉积低温钝化层以防止R / G / B CFA从损坏。

    Method for making an active pixel sensor
    2.
    发明授权
    Method for making an active pixel sensor 有权
    制作有源像素传感器的方法

    公开(公告)号:US06541329B1

    公开(公告)日:2003-04-01

    申请号:US09682477

    申请日:2001-09-07

    IPC分类号: H01L218234

    摘要: A plurality of active pixel sensors are formed on the surface of a semiconductor wafer. The semiconductor wafer comprises a P-type substrate, an active pixel sensor region and a periphery circuit region. A first active pixel sensor block mask (APSB mask) is formed to cover the active pixel sensor region, then at least one N-well on the surface of the semiconductor wafer not covered by the first APSB mask is formed. A second APSB mask and at least one N-well mask are formed to cover the active pixel sensor region and the region outside the P-well region. At least one P-well on the surface of the semiconductor wafer not covered by the second APSB mask and the N-well mask is formed. Finally, at least one photodiode and at least one complementary metal-oxide semiconductor (CMOS) transistor are formed on the surface of the active pixel sensor region.

    摘要翻译: 在半导体晶片的表面上形成多个有源像素传感器。 半导体晶片包括P型衬底,有源像素传感器区域和外围电路区域。 形成第一有源像素传感器块掩模(APSB掩模)以覆盖有源像素传感器区域,然后形成未被第一APSB掩模覆盖的半导体晶片的表面上的至少一个N阱。 形成第二APSB掩模和至少一个N阱掩模以覆盖有源像素传感器区域和P阱区域外的区域。 形成未被第二APSB掩模和N阱掩模覆盖的半导体晶片的表面上的至少一个P阱。 最后,在有源像素传感器区域的表面上形成至少一个光电二极管和至少一个互补金属氧化物半导体(CMOS)晶体管。

    Method of manufacturing metallic interconnect
    3.
    发明授权
    Method of manufacturing metallic interconnect 失效
    制造金属互连的方法

    公开(公告)号:US06376359B1

    公开(公告)日:2002-04-23

    申请号:US09080082

    申请日:1998-05-15

    IPC分类号: H01L214763

    摘要: A method of manufacturing metallic interconnects capable of reducing internal stress inside the metallic layer. The method comprises the steps of forming a silicon-rich oxide layer both before and after the formation of a metallic layer. Therefore, the metallic layer is fully enclosed by silicon-rich oxide layers and any direct contact between the metallic layer and any silicon dioxide layer is avoided. Since the quantity of silicon in the silicon-rich oxide layer is much higher than in a silicon dioxide layer, bonds formed between a silicon atom and an oxygen atom in the silicon-rich oxide layer are much stronger. Consequently, the chance for an aluminum atom in the metallic layer to react with an oxygen atom in the silicon-rich oxide layer is greatly reduced. Hence, lattice vacancies/voids that can lead to conventional stress migration and thermal induced migration problems are prevented.

    摘要翻译: 一种能够减少金属层内的内部应力的金属互连的制造方法。 该方法包括在形成金属层之前和之后形成富硅氧化物层的步骤。 因此,金属层被富硅氧化物层完全封闭,并且避免了金属层和任何二氧化硅层之间的任何直接接触。 由于富硅氧化物层中的硅量远高于二氧化硅层,所以富硅氧化物层中的硅原子和氧原子之间形成的键更强。 因此,金属层中的铝原子与富氧氧化物层中的氧原子反应的可能性大大降低。 因此,可以防止可能导致常规应力迁移和热诱导迁移问题的晶格空位/空隙。

    Structure of a CMOS image sensor
    4.
    发明授权
    Structure of a CMOS image sensor 有权
    CMOS图像传感器的结构

    公开(公告)号:US06906364B2

    公开(公告)日:2005-06-14

    申请号:US09892419

    申请日:2001-06-26

    CPC分类号: H01L27/14643 H01L27/14609

    摘要: A structure of a CMOS image sensory device is described. A photodiode sensory region and a transistor device region are isolated from each other by an isolation layer formed in the substrate. A gate structure is located on the transistor device region, and a source/drain region is in the transistor device region beside the side of the gate structure. A doped region is in the photodiode sensory region. A self-aligned block is located on the photodiode sensory region and a protective layer is formed on the entire substrate.

    摘要翻译: 描述CMOS图像感测装置的结构。 光电二极管感应区域和晶体管器件区域通过形成在衬底中的隔离层彼此隔离。 栅极结构位于晶体管器件区域上,源极/漏极区域位于栅极结构侧面旁边的晶体管器件区域中。 掺杂区域在光电二极管的感觉区域中。 自对准块位于光电二极管感应区上,在整个基板上形成保护层。

    Method for integrating anti-reflection layer and salicide block
    5.
    发明授权
    Method for integrating anti-reflection layer and salicide block 有权
    防反射层和自对准硅化物块的整合方法

    公开(公告)号:US06303406B1

    公开(公告)日:2001-10-16

    申请号:US09590722

    申请日:2000-06-08

    IPC分类号: H01L2100

    摘要: The present invention is a method for integrating an anti-reflection layer and a salicide block. The method comprises following steps: provide a substrate that is divided into at least a sensor area and a transistor area, wherein the sensor area comprises a doped region and the transistor area comprises a transistor that includes a gate, a source and a drain; forms a composite layer on the substrate, herein the composite layer at least also covers both sensor area and transistor area, and the composite layer increases refractive index of light that propagate from the doped region into the composite layer; performs an etching process and a photolithography process to remove part of the composite layer and to let top of the gate, the source and the drain are not covered by the composite layer; and performs a salicide process to let top of the gate, the source and the drain are covered by a silicate. One main characteristic of the invention is that the composite layer can be used as an anti-reflection layer of the sensor area and a salicide block of the transistor region. The composite layer is made of several basic layers and refractive index of any basic layer is different to refractive indexes of adjacent basic layers.

    摘要翻译: 本发明是一种用于整合抗反射层和自对准硅化物块的方法。 该方法包括以下步骤:提供被分成至少传感器区域和晶体管区域的衬底,其中传感器区域包括掺杂区域,并且晶体管区域包括包括栅极,源极和漏极的晶体管; 在衬底上形成复合层,这里复合层至少还覆盖传感器面积和晶体管面积,并且复合层增加了从掺杂区域传播到复合层中的光的折射率; 进行蚀刻处理和光刻处理以去除复合层的一部分,并使栅极顶部,源极和漏极不被复合层覆盖; 并执行自对准处理以使顶部的栅极,源极和漏极被硅酸盐覆盖。 本发明的一个主要特征是复合层可以用作传感器区域的防反射层和晶体管区域的自对准硅化物块。 复合层由几层基本层组成,任何基层的折射率与相邻基层的折射率不同。

    Method for fabricating a CMOS image sensor

    公开(公告)号:US06607951B2

    公开(公告)日:2003-08-19

    申请号:US09893140

    申请日:2001-06-26

    IPC分类号: H01L2100

    CPC分类号: H01L27/14643 H01L27/14687

    摘要: A fabrication method for a CMOS image sensory device is described. An isolation layer is formed in the substrate to isolate a photodiode sensory region and a transistor device region. A gate structure is further formed on the transistor device region, followed by forming concurrently a source/drain region in the transistor device region beside the side of the gate structure and a doped region in the photodiode sensory region. Thereafter, a self-aligned block is formed on the photodiode sensory region, followed by forming a protective layer on the substrate.

    Structure of a CMOS image sensor and method for fabricating the same
    9.
    发明授权
    Structure of a CMOS image sensor and method for fabricating the same 有权
    CMOS图像传感器的结构及其制造方法

    公开(公告)号:US06506619B2

    公开(公告)日:2003-01-14

    申请号:US10104707

    申请日:2002-03-25

    IPC分类号: H01L2100

    CPC分类号: H01L27/14689 H01L27/14609

    摘要: A method of fabricating CMOS image sensor. On a substrate, an isolation layer is formed to partition the substrate into a photodiode sensing region and a transistor element region. Next, on the transistor element region, a gate electrode structure is formed and then, a source/drain region is formed at the transistor element region of the two lateral sides of the gate electrode structure. At the same time, a doping region is formed on the photodiode sensing region. After that, a self-aligned barrier layer is formed on the photodiode sensing region and a protective layer is formed on the substrate. Then, a dielectric layer and a metallic conductive wire are successively formed on the protective layer. Again, a protective layer is formed on the dielectric layer and the metallic conductive wire, wherein the numbers of the dielectric layers and the metallic conductive wire depend on the fabrication process. A protective layer is formed between every dielectric layer.

    摘要翻译: 一种制造CMOS图像传感器的方法。 在衬底上形成隔离层以将衬底分隔成光电二极管感测区域和晶体管元件区域。 接着,在晶体管元件区域上形成栅电极结构,然后在栅电极结构的两个侧面的晶体管元件区域形成源/漏区。 同时,在光电二极管感测区域上形成掺杂区域。 之后,在光电二极管感测区域上形成自对准势垒层,在衬底上形成保护层。 然后,在保护层上依次形成电介质层和金属导电线。 再次,在电介质层和金属导线上形成保护层,其中介电层和金属导线的数量取决于制造工艺。 在每个介电层之间形成保护层。

    Method of manufacturing a mask ROM bit line
    10.
    发明授权
    Method of manufacturing a mask ROM bit line 有权
    掩模ROM位线的制造方法

    公开(公告)号:US06355530B1

    公开(公告)日:2002-03-12

    申请号:US09630867

    申请日:2000-08-02

    IPC分类号: H01L218236

    CPC分类号: H01L27/1126 H01L27/112

    摘要: A method of manufacturing a mask ROM. A sacrificial silicon oxide layer is formed on the active region upon the substrate. Patterning the sacrificial silicon oxide layer in order to form a plurality of parallel openings, thereby exposing a portion of the active region. A polysilicon layer is formed on the openings and openings are formed thereon. An ion implantation process is performed on the polysilicon layer. Using a thermal flow process, the ions within the polysilicon layer are driven through the openings into the lower portion of the substrate, thereby forming an ion doping region. The polysilicon layer is etchbacked until the sacrificial silicon oxide layer is exposed. The sacrificial silicon oxide layer is removed.

    摘要翻译: 一种制造掩模ROM的方法。 在衬底上的有源区上形成牺牲氧化硅层。 对牺牲氧化硅层进行成形以便形成多个平行的开口,从而暴露一部分有源区。 在开口上形成多晶硅层,在其上形成开口。 在多晶硅层上进行离子注入工艺。 使用热流程,多晶硅层内的离子通过开口被驱动到衬底的下部,从而形成离子掺杂区域。 蚀刻多晶硅层直到牺牲氧化硅层露出。 去除牺牲氧化硅层。