公开(公告)号：US09165968B2

公开(公告)日：2015-10-20

申请号：US13616850

申请日：2012-09-14

Applicant: Calvin Yi-Ping Chao ,  Kuo-Yu Chou ,  Fu-Lung Hsueh

Inventor： Calvin Yi-Ping Chao ,  Kuo-Yu Chou ,  Fu-Lung Hsueh

IPC: H01L27/146 ,  H04N5/374

CPC classification number: H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H04N5/374

Abstract: A stacked image sensor and method for making the same are provided. The stacked image sensor includes an upper chip with a pixel array thereon. The second chip includes a plurality of column circuits and row circuits associated with the columns and rows of the pixel array and disposed in respective column circuit and row circuit regions that are arranged in multiple groups. Inter-chip bonding pads are formed on each of the chips. The inter-chip bonding pads on the second chip are arranged linearly and are contained within the column circuit regions and row circuit regions in one embodiment. In other embodiments, the inter-chip bonding pads are staggered with respect to each other. In some embodiments, the rows and columns of the pixel array include multiple signal lines and the corresponding column circuit regions and row circuit regions also include multiple inter-chip bonding pads.

Abstract translation: 提供一种堆叠式图像传感器及其制造方法。 堆叠图像传感器包括其上具有像素阵列的上部芯片。 第二芯片包括与像素阵列的列和行相关联的多个列电路和行电路，并且被布置在多个组中的各个列电路和行电路区域中。 在每个芯片上形成芯片间接合焊盘。 在一个实施例中，第二芯片上的芯片间接合焊盘被线性布置并且被包含在列电路区域和行电路区域内。 在其他实施例中，芯片间接合焊盘相对于彼此交错。 在一些实施例中，像素阵列的行和列包括多个信号线，并且相应的列电路区域和行电路区域还包括多个芯片间接合焊盘。

公开(公告)号：US20140077057A1

公开(公告)日：2014-03-20

申请号：US13616850

申请日：2012-09-14

Applicant: Calvin Yi-Ping CHAO ,  Kuo-Yu CHOU ,  Fu-Lung HSUEH

Inventor： Calvin Yi-Ping CHAO ,  Kuo-Yu CHOU ,  Fu-Lung HSUEH

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H04N5/374

Abstract: A stacked image sensor and method for making the same are provided. The stacked image sensor includes an upper chip with a pixel array thereon. The second chip includes a plurality of column circuits and row circuits associated with the columns and rows of the pixel array and disposed in respective column circuit and row circuit regions that are arranged in multiple groups. Inter-chip bonding pads are formed on each of the chips. The inter-chip bonding pads on the second chip are arranged linearly and are contained within the column circuit regions and row circuit regions in one embodiment. In other embodiments, the inter-chip bonding pads are staggered with respect to each other. In some embodiments, the rows and columns of the pixel array include multiple signal lines and the corresponding column circuit regions and row circuit regions also include multiple inter-chip bonding pads.

Abstract translation: 提供一种堆叠式图像传感器及其制造方法。 堆叠图像传感器包括其上具有像素阵列的上部芯片。 第二芯片包括与像素阵列的列和行相关联的多个列电路和行电路，并且被布置在多个组中的各个列电路和行电路区域中。 在每个芯片上形成芯片间接合焊盘。 在一个实施例中，第二芯片上的芯片间接合焊盘被线性布置并且被包含在列电路区域和行电路区域内。 在其他实施例中，芯片间接合焊盘相对于彼此交错。 在一些实施例中，像素阵列的行和列包括多个信号线，并且相应的列电路区域和行电路区域还包括多个芯片间接合焊盘。

公开(公告)号：US08587081B2

公开(公告)日：2013-11-19

申请号：US12769380

申请日：2010-04-28

Applicant: Calvin Yi-Ping Chao

Inventor： Calvin Yi-Ping Chao

IPC: H01L31/0232

CPC classification number: H01L27/1464 ,  H01L27/14603 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14683

Abstract: Provided is an image sensor device. The image sensor device includes a substrate having a front side and a back side. The image sensor also includes an isolation feature disposed in the substrate. The image sensor further includes a radiation-sensing region disposed in the substrate and adjacent to the isolation feature. The radiation-sensing region is operable to sense radiation projected toward the radiation-sensing region from the back side. The image sensor also includes a transparent conductive layer disposed over the back side of the substrate.

Abstract translation: 提供了一种图像传感器装置。 图像传感器装置包括具有正面和背面的基板。 图像传感器还包括设置在基板中的隔离特征。 图像传感器还包括设置在基板中并与隔离特征相邻的辐射感测区域。 辐射感测区域可操作以感测从背面向辐射感测区域投射的辐射。 图像传感器还包括设置在基板的背面上方的透明导电层。

公开(公告)号：US20130284885A1

公开(公告)日：2013-10-31

申请号：US13457637

申请日：2012-04-27

Applicant: Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

Inventor： Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

IPC: H01L27/146

CPC classification number: H01L27/1469 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.

Abstract translation: 公开了用于封装具有专用集成电路（ASIC）的背面照明（BSI）图像传感器或传感器装置的方法和装置。 根据实施例，传感器设备可以与ASIC面对面地结合在一起，而不使用载体晶片，其中传感器的相应接合焊盘与ASIC的接合焊盘对准并且结合在一起，以一对一 一个时尚。 传感器的像素列可以共享由共享的金属间线路连接不良的键。 接合焊盘可以具有不同的尺寸并且被配置成不同的行以彼此不相交。 可以添加附加的虚拟焊盘以增加传感器和ASIC之间的接合。

公开(公告)号：US09412725B2

公开(公告)日：2016-08-09

申请号：US13457637

申请日：2012-04-27

Applicant: Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

Inventor： Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

IPC: H01L27/00 ,  H01L25/16 ,  H01L27/146

CPC classification number: H01L27/1469 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.

Abstract translation: 公开了用于封装具有专用集成电路（ASIC）的背面照明（BSI）图像传感器或传感器装置的方法和装置。 根据实施例，传感器装置可以与ASIC面对面地结合在一起，而不使用载体晶片，其中传感器的相应接合焊盘与ASIC的接合焊盘对准并且结合在一起，以一对一 一个时尚。 传感器的像素列可以共享由共享的金属间线路连接不良的键。 接合焊盘可以具有不同的尺寸并且被配置成不同的行以彼此不相交。 可以添加附加的虚拟焊盘以增加传感器和ASIC之间的接合。

公开(公告)号：US20110266645A1

公开(公告)日：2011-11-03

申请号：US12769380

申请日：2010-04-28

Applicant: Calvin Yi-Ping Chao

Inventor： Calvin Yi-Ping Chao

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/1464 ,  H01L27/14603 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14683

Abstract: Provided is an image sensor device. The image sensor device includes a substrate having a front side and a back side. The image sensor also includes an isolation feature disposed in the substrate. The image sensor further includes a radiation-sensing region disposed in the substrate and adjacent to the isolation feature. The radiation-sensing region is operable to sense radiation projected toward the radiation-sensing region from the back side. The image sensor also includes a transparent conductive layer disposed over the back side of the substrate.

Abstract translation: 提供了一种图像传感器装置。 图像传感器装置包括具有正面和背面的基板。 图像传感器还包括设置在基板中的隔离特征。 图像传感器还包括设置在基板中并与隔离特征相邻的辐射感测区域。 辐射感测区域可操作以感测从背面向辐射感测区域投射的辐射。 图像传感器还包括设置在基板的背面上方的透明导电层。

公开(公告)号：US09379093B2

公开(公告)日：2016-06-28

申请号：US13457637

申请日：2012-04-27

Applicant: Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

Inventor： Szu-Ying Chen ,  Ping-Yin Liu ,  Calvin Yi-Ping Chao ,  Tzu-Jui Wang ,  Jen-Cheng Liu ,  Dun-Nian Yaung ,  Lan-Lin Chao

IPC: H01L27/00 ,  H01L25/16 ,  H01L27/146

Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.

公开(公告)号：US08830361B2

公开(公告)日：2014-09-09

申请号：US13445350

申请日：2012-04-12

Applicant: Po-Sheng Chou ,  Calvin Yi-Ping Chao ,  Kuo-Yu Chou ,  Honyih Tu ,  Yi-Che Chen

Inventor： Po-Sheng Chou ,  Calvin Yi-Ping Chao ,  Kuo-Yu Chou ,  Honyih Tu ,  Yi-Che Chen

IPC: H04N5/217 ,  H04N3/14 ,  H04N5/335 ,  H03M1/00

CPC classification number: H04N5/378 ,  G01J1/46 ,  H04N5/3658 ,  H04N5/37457 ,  H04N17/002

Abstract: A method of reducing column fixed pattern noise including calibrating a readout circuit, wherein the readout circuit is electrically connected to at least one programmable gain amplifier and an analog-to-digital converter. Calibrating the readout circuit includes electrically disconnecting the readout circuit from a pixel output and electrically connecting a pixel reset input of the readout circuit to a pixel output signal input of the readout circuit. Calibrating the readout circuit further includes comparing a measured output of the readout circuit to a predetermined value and storing the comparison result in a non-transitory computer readable medium. The method further includes operating the readout circuit, the operating the readout circuit includes receiving a pixel sample signal and outputting a calibrated output based on an operating output and the stored comparison result.

Abstract translation: 一种降低列固定模式噪声的方法，包括校准读出电路，其中读出电路电连接至至少一个可编程增益放大器和模 - 数转换器。 校准读出电路包括将读出电路与像素输出电断开并将读出电路的像素复位输入电连接到读出电路的像素输出信号输入端。 校准读出电路还包括将读出电路的测量输出与预定值进行比较，并将比较结果存储在非暂时的计算机可读介质中。 所述方法还包括操作所述读出电路，所述读出电路的操作包括接收像素采样信号并基于操作输出和所存储的比较结果输出校准输出。

公开(公告)号：US08599292B2

公开(公告)日：2013-12-03

申请号：US12858514

申请日：2010-08-18

Applicant: Kuo-Yu Chou ,  Calvin Yi-Ping Chao

Inventor： Kuo-Yu Chou ,  Calvin Yi-Ping Chao

IPC: H04N5/335 ,  H01L27/00 ,  H01L31/062

CPC classification number: H01L27/14643 ,  H04N5/3577 ,  H04N5/374 ,  H04N5/376

Abstract: A CMOS image sensor includes a pixel array including a plurality of unit pixels with individual rows of unit pixels being coupled to respective row control signal lines, and a buffer including plural row control signal drivers. Each driver is coupled to a respective one of the row control signal lines and is configured to provide a row control signal pulse to a respective row control signal line in response to an input pulse when the row control signal line is in an active state and to bias the row control signal line at a ground voltage when the respective row control signal line is in an inactive state. Each driver has a first drive capability when the row control signal line is in the active state and a second drive capability greater than the first drive capability when the row control signal line is in an inactive state.

公开(公告)号：US20120098975A1

公开(公告)日：2012-04-26

申请号：US12909154

申请日：2010-10-21

Applicant: Calvin Yi-Ping Chao ,  Honyih Tu ,  Kuo-Yu Chou ,  Po-Sheng Chou

Inventor： Calvin Yi-Ping Chao ,  Honyih Tu ,  Kuo-Yu Chou ,  Po-Sheng Chou

IPC: H04N17/02

CPC classification number: H04N9/646 ,  H04N5/3572 ,  H04N9/735 ,  H04N17/002

Abstract: An integrated circuit comprises a semiconductor substrate and a color image sensor array on the substrate. The color image sensor array has a first configuration of color pixels for collecting color image data, and at least one crosstalk test pattern on the substrate proximate the color image sensor array. The crosstalk test pattern includes a plurality of color sensing pixels arranged for making color crosstalk measurements. The test pattern configuration is different from the first configuration.

Abstract translation: 集成电路包括在衬底上的半导体衬底和彩色图像传感器阵列。 彩色图像传感器阵列具有用于收集彩色图像数据的彩色像素的第一配置以及靠近彩色图像传感器阵列的基板上的至少一个串扰测试图案。 串扰测试图案包括布置成进行颜色串扰测量的多个颜色感测像素。 测试模式配置与第一种配置不同。