Process for forming a phosphor
    1.
    发明授权
    Process for forming a phosphor 失效
    磷光体的制造方法

    公开(公告)号:US5460980A

    公开(公告)日:1995-10-24

    申请号:US323801

    申请日:1994-10-17

    摘要: The growth of a phosphor layer deposited on a patterned substrate containing a multiplicity of recessed ridges of triangular cross section can be controlled by tailoring the geometry of the recessed ridge structures. During the deposition process, little or no phosphor deposition occurs on the recessed ridge structures, and cracks are formed which separate the otherwise uniformly growing phosphor which is present in other regions of the patterned substrate where more substantial phosphor deposition occurs.

    摘要翻译: 沉积在包含多个具有三角形横截面的凹入脊的图案化衬底上的荧光体层的生长可以通过调整凹脊结构的几何形状来控制。 在沉积过程中,凹陷脊结构上发生很少或没有磷光体沉积,并且形成裂纹,其分离存在于图案化衬底的其他区域中的其它均匀生长的荧光体,其中发生更大量的磷光体沉积。

    LAPPING CARRIER AND METHOD
    2.
    发明申请
    LAPPING CARRIER AND METHOD 有权
    LAPPING载体和方法

    公开(公告)号:US20120135669A1

    公开(公告)日:2012-05-31

    申请号:US13367424

    申请日:2012-02-07

    CPC分类号: B24B37/28

    摘要: Provided is a lapping carrier including a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece. The aperture extends from the first major surface through the base carrier to the second major surface. The base carrier includes a first metal or a polymer. At least a portion of the first major surface or at least a portion of each of the first and the second major surfaces includes a polymeric region. In at least a portion of the polymeric region, at least one adhesion promoting layer is interposed between the polymeric region and the base carrier. The adhesion promoting layer includes an inorganic coating.

    摘要翻译: 提供了一种研磨载体,其包括具有第一主表面,第二主表面和用于保持工件的至少一个孔的基底载体。 孔从第一主表面延伸穿过基底载体到第二主表面。 基底载体包括第一金属或聚合物。 第一主表面的至少一部分或第一和第二主表面中的每一个的至少一部分包括聚合物区域。 在聚合物区域的至少一部分中,在聚合物区域和基底载体之间插入至少一个粘附促进层。 粘合促进层包括无机涂层。

    Lapping Carrier and Method
    3.
    发明申请
    Lapping Carrier and Method 有权
    研磨载体和方法

    公开(公告)号:US20100048105A1

    公开(公告)日:2010-02-25

    申请号:US12513705

    申请日:2007-11-19

    CPC分类号: B24B37/28

    摘要: Provided is a double-sided lapping carrier comprising a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece, said aperture extending from the first major surface through the base carrier to the second major surface, wherein the base carrier comprises a first metal, the circumference of said aperture is defined by a third surface of the base carrier consisting of the first metal and, at least a portion of the first major surface or at least a portion of each of the first and the second major surfaces comprises a polymeric region, said polymeric region comprising a polymer having a work to failure of at least 10 Joules. Also provide are methods of lapping.

    摘要翻译: 提供了一种双面研磨载体,其包括具有第一主表面,第二主表面和用于保持工件的至少一个孔的基底载体,所述孔从第一主表面延伸穿过基底载体到第二主表面, 其中所述基底载体包括第一金属,所述孔的圆周由所述基底载体的第三表面限定,所述第三表面由所述第一金属和所述第一主表面的至少一部分或所述第一金属的每一个的至少一部分组成 并且第二主表面包括聚合物区域,所述聚合物区域包含聚合物,其具有至少10焦耳的失效作用。 还提供研磨的方法。

    Lapping carrier and method
    5.
    发明授权
    Lapping carrier and method 有权
    研磨载体和方法

    公开(公告)号:US08795033B2

    公开(公告)日:2014-08-05

    申请号:US13367424

    申请日:2012-02-07

    IPC分类号: B24B1/00 B24B37/04 B24B37/28

    CPC分类号: B24B37/28

    摘要: Provided is a lapping carrier including a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece. The aperture extends from the first major surface through the base carrier to the second major surface. The base carrier includes a first metal or a polymer. At least a portion of the first major surface or at least a portion of each of the first and the second major surfaces includes a polymeric region. In at least a portion of the polymeric region, at least one adhesion promoting layer is interposed between the polymeric region and the base carrier. The adhesion promoting layer includes an inorganic coating.

    摘要翻译: 提供了一种研磨载体,其包括具有第一主表面,第二主表面和用于保持工件的至少一个孔的基底载体。 孔从第一主表面延伸穿过基底载体到第二主表面。 基底载体包括第一金属或聚合物。 第一主表面的至少一部分或第一和第二主表面中的每一个的至少一部分包括聚合物区域。 在聚合物区域的至少一部分中,在聚合物区域和基底载体之间插入至少一个粘附促进层。 粘合促进层包括无机涂层。

    Method of cleaning glass
    6.
    发明授权
    Method of cleaning glass 有权
    玻璃清洗方法

    公开(公告)号:US06638144B2

    公开(公告)日:2003-10-28

    申请号:US09817850

    申请日:2001-03-26

    IPC分类号: B24B100

    摘要: A method of polishing and cleaning a glass surface with a single abrasive article. The abrasive article includes ceria abrasive particles dispersed in binder, the abrasive article having a textured, three-dimensional abrasive coating. The method includes contacting the glass surface with the abrasive article at a desired pressure and in the presence of water, and moving the abrasive article and glass in relation to each other under pressure. The water is believed to mediate a chemical reaction involving the ceria and the glass, thereby leaving a haze on the glass surface. With continued motion of the abrasive article in relation to the glass workpiece, without the addition of additional water, the haze is removed.

    摘要翻译: 用单一磨料制品抛光和清洁玻璃表面的方法。 研磨制品包括分散在粘合剂中的二氧化铈磨料颗粒,磨料制品具有织构化的三维磨料涂层。 该方法包括在所需压力和水的存在下使玻璃表面与磨料制品接触,并且在压力下相对于彼此移动磨料制品和玻璃。 认为水介导涉及二氧化铈和玻璃的化学反应,从而在玻璃表面上留下雾度。 随着研磨制品相对于玻璃工件的持续运动,不加入额外的水,除去了雾度。

    Low temperature electron beam polymerization
    7.
    发明授权
    Low temperature electron beam polymerization 失效
    低温电子束聚合

    公开(公告)号:US06232365B1

    公开(公告)日:2001-05-15

    申请号:US09118392

    申请日:1998-07-17

    IPC分类号: C08F246

    CPC分类号: C08F20/18 C09J4/00 C08F220/18

    摘要: A method for polymerizing a free-radical initiated adhesive syrup of an C8-13 alkyl acrylate monomer, optionally including one or more comonomers, by irradiating the adhesive syrup with about 20 to 100 kGy of accelerated electrons over a residence time of greater than 1 second at a temperature below 20° C. The method produces a pressure-sensitive adhesive with balanced peel adhesion, shear strength and conversion.

    摘要翻译: 一种通过在大于1秒的停留时间内用约20至100kGy的加速电子照射粘合剂糖浆来聚合任选包含一种或多种共聚单体的C 8-13烷基丙烯酸酯单体的自由基引发的粘合剂浆料的方法 在低于20℃的温度下,该方法产生具有平衡的剥离粘合力,剪切强度和转化率的压敏粘合剂。