公开(公告)号：US20090195464A1

公开(公告)日：2009-08-06

申请号：US12422664

申请日：2009-04-13

Applicant: Brian P Gaucher ,  Duixian Liu ,  Ullrich R. Pfeiffer ,  Thomas M. Zwick

Inventor： Brian P Gaucher ,  Duixian Liu ,  Ullrich R. Pfeiffer ,  Thomas M. Zwick

IPC: H01Q1/24

CPC classification number: H01Q9/16 ,  H01L23/49555 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/3011 ,  H01Q23/00 ,  Y10T29/49018 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Abstract translation: 提供了用于将半导体IC（集成电路）芯片与具有一个或多个辐射元件和调谐元件整体封装的装置和方法，所述辐射元件和调谐元件由适于成形并布置成形成毫米波应用的天线结构的封装引线形成。

公开(公告)号：US07187331B2

公开(公告)日：2007-03-06

申请号：US10967408

申请日：2004-10-18

Applicant: Zhi Ning Chen ,  Brian P. Gaucher ,  Duixian Liu

Inventor： Zhi Ning Chen ,  Brian P. Gaucher ,  Duixian Liu

IPC: H01Q1/24

CPC classification number: H01Q9/40 ,  H01Q1/243 ,  H01Q9/36

Abstract: A compact sized embedded, multiband, multi-standard, interoperable antenna for portable devices used in wireless applications is provided. The antenna design includes an asymmetrical structure provided on a double-sided printed circuit board. The asymmetrical structure covers both the ultra-wideband and the wireless local area network band. The asymmetrical structure provided on the front side of the printed circuit board is a primary radiator with a supplement strip radiator, whereby the bottom of the primary radiator is close to the vertical ground plane and fed by a probe extended from a coaxial line. The asymmetrical structure on the front side provides a well-matched bandwidth covering the ultra-wideband band of 3.1 GHz to 10.6 GHz. A second supplement strip is provided on the backside of the printed circuit board which provides the second resonance at the 2.4 GHz wireless local area network band.

Abstract translation: 提供了一种用于无线应用的便携式设备的紧凑型嵌入式多频带多标准互操作天线。 天线设计包括设置在双面印刷电路板上的非对称结构。 非对称结构涵盖超宽带和无线局域网带。 设置在印刷电路板的前侧的不对称结构是具有补充条辐射器的初级辐射器，由此主辐射器的底部靠近垂直接地平面并由同轴线延伸的探针馈送。 前端的不对称结构提供了覆盖3.1 GHz至10.6 GHz超宽带频段的良好匹配带宽。 在印刷电路板的背面提供第二补充条，其在2.4GHz无线局域网带上提供第二共振。

公开(公告)号：US06686886B2

公开(公告)日：2004-02-03

申请号：US09866974

申请日：2001-05-29

Applicant: Ephraim B. Flint ,  Brian P. Gaucher ,  Duixian Liu

Inventor： Ephraim B. Flint ,  Brian P. Gaucher ,  Duixian Liu

IPC: H01Q124

CPC classification number: H01Q1/2275 ,  H01Q1/22 ,  H01Q1/2266 ,  H01Q1/44 ,  H01Q5/378 ,  H01Q9/0421 ,  H01Q9/42

Abstract: An antenna for integration into a portable processing device, comprises an electronic display metal support frame, a first and a second radiating element extending from the support frame and a conductor for conducting a signal comprising a first component for carrying a signal to the second radiating element and a second component for grounding the conductor to the support frame.

Abstract translation: 一种用于集成到便携式处理装置中的天线，包括电子显示金属支撑框架，从支撑框架延伸的第一和第二辐射元件以及用于传导信号的导体，该信号包括用于将信号传送到第二辐射元件的第一部件 以及用于将导体接地到支撑框架的第二部件。

公开(公告)号：US08294620B2

公开(公告)日：2012-10-23

申请号：US10370976

申请日：2003-02-20

Applicant: Ephraim B. Flint ,  Brian P. Gaucher ,  Duixian Liu

Inventor： Ephraim B. Flint ,  Brian P. Gaucher ,  Duixian Liu

IPC: H01Q1/24 ,  H01Q21/30

CPC classification number: H01Q1/2275 ,  H01Q1/22 ,  H01Q1/2266 ,  H01Q1/44 ,  H01Q5/378 ,  H01Q9/0421 ,  H01Q9/42

Abstract: Dual-band antennas that are embedded within portable devices such as laptop computers. In one aspect, a dual-band antenna for a portable device (e.g., laptop computer) includes a first element having a resonant frequency in a first frequency band and a second element having a resonant frequency in a second frequency band, wherein the first element is connected to a signal feed, wherein the second element is grounded, and wherein the first and second elements are integrated within a portable device.

Abstract translation: 嵌入便携式设备（如笔记本电脑）中的双频天线。 一方面，用于便携式设备（例如，膝上型计算机）的双频天线包括在第一频带具有谐振频率的第一元件和在第二频带中具有谐振频率的第二元件，其中第一元件 连接到信号馈送，其中第二元件接地，并且其中第一和第二元件被集成在便携式设备内。

公开(公告)号：US20120176281A1

公开(公告)日：2012-07-12

申请号：US13423772

申请日：2012-03-19

Applicant: Brian P. Gaucher ,  Duixian Liu ,  Ullrich R. Pfeiffer ,  Thomas M. Zwick

Inventor： Brian P. Gaucher ,  Duixian Liu ,  Ullrich R. Pfeiffer ,  Thomas M. Zwick

IPC: H01Q1/24 ,  H05K13/00

CPC classification number: H01Q9/16 ,  H01L23/49555 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/3011 ,  H01Q23/00 ,  Y10T29/49018 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Abstract translation: 提供了用于将半导体IC（集成电路）芯片与具有一个或多个辐射元件和调谐元件整体封装的装置和方法，所述辐射元件和调谐元件由适于成形并布置成形成毫米波应用的天线结构的封装引线形成。

公开(公告)号：US07372408B2

公开(公告)日：2008-05-13

申请号：US11332737

申请日：2006-01-13

Applicant: Brian P. Gaucher ,  Janusz Grzyb ,  Duixian Liu ,  Ullrich R. Pfeiffer

Inventor： Brian P. Gaucher ,  Janusz Grzyb ,  Duixian Liu ,  Ullrich R. Pfeiffer

IPC: H01Q1/38

CPC classification number: H01Q1/38 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/40 ,  H01Q7/00 ,  H01Q23/00 ,  H01L2924/00014

Abstract: Apparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.

Abstract translation: 提供了用于将IC芯片与集成的天线模块一起封装的设备和方法，所述集成天线模块旨在为天线辐射器提供封闭的EM（电磁）环境，从而允许天线被独立于封装技术设计。

公开(公告)号：US07342299B2

公开(公告)日：2008-03-11

申请号：US11231919

申请日：2005-09-21

Applicant: Brian P. Gaucher ,  Duixian Liu ,  Ullrich R. Pfeiffer ,  Thomas M. Zwick

Inventor： Brian P. Gaucher ,  Duixian Liu ,  Ullrich R. Pfeiffer ,  Thomas M. Zwick

IPC: H01L23/02

CPC classification number: H01L23/5227 ,  H01L23/4334 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q3/26 ,  H01Q9/16 ,  H01Q19/30 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.

Abstract translation: 提供了用于将天线与半导体IC（集成电路）芯片整体封装在一起以提供用于毫米波应用的高集成度和高​​性能无线电/无线通信系统的装置和方法，包括例如语音通信，数据通信和雷达应用。 例如，无线通信模块由具有接收器/发射器/收发器集成电路的IC芯片和由IC芯片的BEOL（后端）金属化结构一体构成的平面天线构成。

公开(公告)号：US07230571B2

公开(公告)日：2007-06-12

申请号：US10967407

申请日：2004-10-18

Applicant: Brian P. Gaucher ,  Duixian Liu

Inventor： Brian P. Gaucher ,  Duixian Liu

IPC: H01Q1/38

CPC classification number: G06F1/1698 ,  G06F1/1616 ,  H01Q1/243 ,  H01Q5/385 ,  H01Q9/0407

Abstract: A compact sized integrated quadband antenna for portable devices used in wireless applications is provided to provide wireless wide area network quadband coverage for world wide applications. The antenna design includes a combination of F-shaped and variations of L-shaped metal pieces. The F-shaped and variations of L-shaped metal pieces are provided on a double-sided printed circuit board. The F-shaped metal piece covers 800 MHz and 900 MHz bands. Two variations of L-shaped metal pieces are provided, whereby the two variations produce two resonants in the 1800 MHz and 1900 MHz bands. The two variations of L-shaped metal pieces are provided inside the F-shaped metal piece. The laptop display frame or the metal display supporters are used as part of the antenna, the display frame or the metal display supporters providing the ground plane to the antenna design.

Abstract translation: 提供用于无线应用中的便携式设备的紧凑型集成四频天线，用于为世界范围的应用提供无线广域网四频带覆盖。 天线设计包括F形和L形金属片的变化的组合。 L形金属片的F形和变型设置在双面印刷电路板上。 F形金属片覆盖800 MHz和900 MHz频带。 提供了L形金属片的两种变型，由此两种变化在1800MHz和1900MHz频带中产生两个谐振器。 L形金属片的两个变型设置在F形金属片的内部。 笔记本电脑显示框架或金属显示器支架用作天线，显示框架或金属显示器支架的一部分，为天线设计提供接地平面。

公开(公告)号：US06307513B1

公开(公告)日：2001-10-23

申请号：US09551352

申请日：2000-04-18

Applicant: Brian P. Gaucher ,  Modest M. Oprysko

Inventor： Brian P. Gaucher ,  Modest M. Oprysko

IPC: H01Q124

CPC classification number: H01Q1/088 ,  H01Q1/242

Abstract: A connector for a portable device, includes a jack portion integral to the portable device, and a plug portion attached to an input/output device for being inserted into the jack portion. The connector is preferably a low cost microwave connector for transmitting multiple signal types and provides dual functionability.

Abstract translation: 用于便携式设备的连接器包括与便携式设备一体的插座部分，以及附接到输入/输出设备以插入插座部分的插头部分。 连接器优选是用于传输多种信号类型并提供双重功能性的低成本微波连接器。

公开(公告)号：US08629540B2

公开(公告)日：2014-01-14

申请号：US13423772

申请日：2012-03-19

Applicant: Brian P. Gaucher ,  Duixian Liu ,  Ullrich R. Pfeiffer ,  Thomas M. Zwick

Inventor： Brian P. Gaucher ,  Duixian Liu ,  Ullrich R. Pfeiffer ,  Thomas M. Zwick

IPC: H01L23/495

CPC classification number: H01Q9/16 ,  H01L23/49555 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/3011 ,  H01Q23/00 ,  Y10T29/49018 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.

Abstract translation: 提供了用于将半导体IC（集成电路）芯片与具有一个或多个辐射元件和调谐元件整体封装的装置和方法，所述辐射元件和调谐元件由适于成形并布置成形成毫米波应用的天线结构的封装引线形成。