公开(公告)号：US09019704B2

公开(公告)日：2015-04-28

申请号：US13386138

申请日：2009-08-27

Applicant: Brandon Rubenstein ,  Roy Zeighami

Inventor： Brandon Rubenstein ,  Roy Zeighami

IPC: H05K7/20 ,  H01L23/427 ,  F28D15/00 ,  F28D20/02 ,  F28F3/12 ,  H01L23/473

CPC classification number: H01L23/4275 ,  F28D15/00 ,  F28D20/02 ,  F28F3/12 ,  F28F2265/10 ,  H01L23/473 ,  H01L2924/0002 ,  Y02E60/145 ,  H01L2924/00

Abstract: Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Abstract translation: 提供了通过热存储排除热量的方法和手段。 散热器包括含有相变材料的内部空腔。 来自热负荷的热量在正常工作温度下流动流体冷却剂而被排除。 流体冷却剂系统的故障导致相变材料内的热量储存温度略高于正常工作温度。 流体冷却剂系统的恢复导致储存的热量排出并返回到正常工作温度。 可以在努力恢复流体冷却剂系统的同时进行热负荷的正常操作。

公开(公告)号：US08542488B2

公开(公告)日：2013-09-24

申请号：US13146884

申请日：2009-01-29

Applicant: Eric C. Peterson ,  Brandon Rubenstein

Inventor： Eric C. Peterson ,  Brandon Rubenstein

IPC: G06F1/20 ,  H05K13/00 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.

Abstract translation: 公开了一种冷却装置。 该冷却装置包括印刷电路板（PC），其具有安装在PC板的顶侧上的集成电路（IC）插座。 大体上为板状的安装框架，其中穿过板的中心的第一开口安装在PC板的顶侧，IC插座位于第一开口的内部。 冷板连接到安装框架上，冷板具有穿过冷板的开口。 冷板中的开口尺寸设计成允许IC通过开口插入到IC插座中。 在冷板内形成流体通道。 流体入口和流体出口分别安装在冷板上并分别连接到流体通道的第一端和第二端。 散热器可移除地附接到冷板的顶侧，其中当IC安装在IC插座中时，散热器的底侧被配置为接触IC的顶侧。

公开(公告)号：US20130208410A1

公开(公告)日：2013-08-15

申请号：US13822702

申请日：2010-10-28

Applicant: Brandon Rubenstein ,  Roger Nattkemper ,  Eric R. Daniel

Inventor： Brandon Rubenstein ,  Roger Nattkemper ,  Eric R. Daniel

IPC: H05K7/10 ,  G06F1/16

CPC classification number: H05K7/10 ,  G06F1/16 ,  H05K7/1069

Abstract: A land grid array socket assembly comprises a plurality of cells, with each cell comprising an insulative body having a top surface, and contact conductor that has a first portion that extends from a board contact point up to and beyond the top surface to a contact bend, and a second portion that extends from the contact bend to terminate below the top surface and within the insulative body.

Abstract translation: 一种焊盘格阵列插座组件包括多个单元，每个单元包括具有顶表面的绝缘体，以及具有第一部分的接触导体，该第一部分从板接触点延伸到顶表面并超出顶表面至接触弯曲部 以及第二部分，其从接触弯曲部延伸以终止在顶表面下方并且在绝缘体内。

公开(公告)号：US20120325013A1

公开(公告)日：2012-12-27

申请号：US13387068

申请日：2010-02-26

Applicant: Brandon Rubenstein ,  Roy Zeighami

Inventor： Brandon Rubenstein ,  Roy Zeighami

IPC: G01F1/68 ,  G01F1/64

CPC classification number: H05K7/20836 ,  G06F1/20 ,  G06F1/206 ,  G06F1/3203 ,  H05K7/20727

Abstract: Flow measurement systems and methods are provided. A flow measurement system can include at least one heat-producing computing device (160) having at least one fluid inlet (120) and one fluid outlet (130). The system can further include at least one inlet fluid inlet temperature sensor (140) and at least one outlet fluid temperature sensor (150). At least one current sensor (160) measuring the current supplied to at least a portion of the at least one heat-producing computing device (110) can also be included with the system (100). The system can also include at least one calculating device (180) adapted to calculate the inlet fluid flow rate based at least in part upon the sensed inlet fluid temperature, the sensed outlet fluid temperature, and the sensed current flow.

Abstract translation: 提供流量测量系统和方法。 流量测量系统可以包括至少一个具有至少一个流体入口（120）和一个流体出口（130）的发热计算装置（160）。 该系统还可包括至少一个入口流体入口温度传感器（140）和至少一个出口流体温度传感器（150）。 测量提供给至少一个发热计算装置（110）的至少一部分的电流的至少一个电流传感器（160）也可以包括在系统（100）中。 该系统还可以包括至少一个计算装置（180），该计算装置适于至少部分地基于感测到的入口流体温度，感测的出口流体温度和感测的电流来计算入口流体流速。

公开(公告)号：US20120039036A1

公开(公告)日：2012-02-16

申请号：US13259019

申请日：2009-10-30

Applicant: Michael R. Krause ,  Brandon Rubenstein ,  Roy Zeighami ,  Fred B. Worley

Inventor： Michael R. Krause ,  Brandon Rubenstein ,  Roy Zeighami ,  Fred B. Worley

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  F28D15/00

Abstract: A cooling system for a blade enclosure is disclosed. The cooling system comprises a thermal bus bar (TBB) 1220 positioned in the middle of the blade enclosure. The TBB 122 has a front face and a back face. When blades are inserted into the blade enclosure, a heat transfer plate 584 on the blade makes thermal contact with either the front or back face of the TBB 122. The TBB 122 is cooled, thereby cooling the blades.

Abstract translation: 公开了一种用于叶片外壳的冷却系统。 冷却系统包括位于叶片外壳中间的热母线（TBB）1220。 TBB 122具有正面和背面。 当叶片插入叶片外壳中时，叶片上的传热板584与TBB 122的前表面或后表面热接触.BBB 122被冷却，从而冷却叶片。

公开(公告)号：US20110304979A1

公开(公告)日：2011-12-15

申请号：US13146884

申请日：2009-01-29

Applicant: Eric C. Peterson ,  Brandon Rubenstein

Inventor： Eric C. Peterson ,  Brandon Rubenstein

IPC: G06F1/20 ,  H05K13/00 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.

Abstract translation: 公开了一种冷却装置。 该冷却装置包括印刷电路板（PC），其具有安装在PC板的顶侧上的集成电路（IC）插座。 大体上为板状的安装框架，其中穿过板的中心的第一开口安装在PC板的顶侧，IC插座位于第一开口的内部。 冷板连接到安装框架上，冷板具有穿过冷板的开口。 冷板中的开口尺寸设计成允许IC通过开口插入到IC插座中。 在冷板内形成流体通道。 流体入口和流体出口分别安装在冷板上并分别连接到流体通道的第一端和第二端。 散热器可移除地附接到冷板的顶侧，其中当IC安装在IC插座中时，散热器的底侧被配置为接触IC的顶侧。

公开(公告)号：US07385824B2

公开(公告)日：2008-06-10

申请号：US11192736

申请日：2005-07-29

Applicant: Stephan K. Barsun ,  Brent Allen Boudreaux ,  Brandon Rubenstein ,  Stephen Daniel Cromwell ,  Eric C. Peterson

Inventor： Stephan K. Barsun ,  Brent Allen Boudreaux ,  Brandon Rubenstein ,  Stephen Daniel Cromwell ,  Eric C. Peterson

IPC: H05K7/20

CPC classification number: H05K7/1092

Abstract: A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the processor and the voltage regulator are rigidly coupled to each other to provide rigidity to the module and thus maintain the desired compression of the voltage regulator contacts.

Abstract translation: 处理器模块包括处理器和安装在载体上的电压调节器。 电压调节器的触点安装在压缩下，以确保与载体上的焊盘良好的电接触。 分别安装在处理器上的散热片和电压调节器彼此刚性地耦合，以向模块提供刚性，从而保持电压调节器触点的期望的压缩。

公开(公告)号：US20080068813A1

公开(公告)日：2008-03-20

申请号：US11532312

申请日：2006-09-15

Applicant: Brandon Rubenstein

Inventor： Brandon Rubenstein

IPC: H05K5/00

CPC classification number: H05K7/1461 ,  G06F1/183

Abstract: An apparatus and method for installing an electrical support structure, such as a printed circuit board or card within a computerized device, are disclosed. In at least some embodiments, the apparatus includes a first structure, a second structure supported by the first structure and capable of movement with respect to the first structure along a first direction, and a third structure slidingly supported by the second structure. Sliding motion of the third structure with respect to the second structure results in movement of the third structure relative to the first structure that is along a second direction different from the first direction.

Abstract translation: 公开了一种在计算机化设备内安装诸如印刷电路板或卡之类的电气支撑结构的装置和方法。 在至少一些实施例中，该装置包括第一结构，由第一结构支撑并能够沿着第一方向相对于第一结构运动的第二结构，以及由第二结构滑动地支撑的第三结构。 第三结构相对于第二结构的滑动运动导致第三结构相对于沿着与第一方向不同的第二方向的第一结构的运动。

公开(公告)号：US20060072291A1

公开(公告)日：2006-04-06

申请号：US10960160

申请日：2004-10-06

Applicant: Glenn Simon ,  Derek Schumacher ,  Brandon Rubenstein

Inventor： Glenn Simon ,  Derek Schumacher ,  Brandon Rubenstein

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/0298 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/09309 ,  H05K2201/09781

Abstract: A heat sink surface mounts to a printed circuit board in direct separation, thermal and physical, from components on the board. The heat sink cools the components by conducting heat from the components through the printed circuit board to the heat sink.

Abstract translation: 散热片表面从印刷电路板上的组件直接分离，散热和物理。 散热器通过将部件通过印刷电路板传导到散热器来冷却部件。

公开(公告)号：US06583357B2

公开(公告)日：2003-06-24

申请号：US09911603

申请日：2001-07-24

Applicant: Brandon Rubenstein ,  Bradley E Clements

Inventor： Brandon Rubenstein ,  Bradley E Clements

IPC: H02G318

CPC classification number: H02G3/22 ,  H02G3/0666 ,  Y10T16/05

Abstract: A cable retention device includes a conduit that is joined to an end plate forming a continuous passage through the conduit. Cable shielding is clamped to the conduit to establish a pathway to ground. The end plate presents a shoulder face that is inserted into a guide rail clamp. The shoulder face includes a pair of arches that function as fulcrums to flex the guide rail bracket, which secures the cable retention device to a chassis under compressive force.

Abstract translation: 电缆保持装置包括连接到形成连续通过导管的通道的端板的导管。 电缆屏蔽被夹紧到导管上，以建立一条通向地面的通道。 端板呈现插入导轨夹的肩面。 肩部表面包括一对拱形，其作为支点弯曲导轨支架，其在压缩力下将电缆保持装置固定在底盘上。