-
1.
公开(公告)号:US20240335904A1
公开(公告)日:2024-10-10
申请号:US18701001
申请日:2022-10-24
申请人: BYSTRONIC LASER AG
发明人: Michael BERGER , Titus HAAS , Simon SCHEIDIGER
IPC分类号: B23K26/073 , B23K26/38
CPC分类号: B23K26/073 , B23K26/38
摘要: A control unit for providing control instructions for controlling a laser cutting machine by determining transition phases for transforming different dynamic laser beam shapes for the laser cutting machine, for dynamically varying the shape of the laser beam is disclosed. The control unit includes a cutting plan interface for receiving a cutting plan for cutting out parts of a workpiece that are each defined by a cutting segments ordered in a queue, an allocation tool configured to allocate a specific dynamic laser beam shape to each cutting segment, a transition tool for determining transition phases between each two consecutive specific dynamic laser beam shape, and a processor configured for determining a specific dynamic laser beam shape for each cutting segment and for determining all transition phases between each two consecutive specific dynamic laser beam shapes and for providing controlling the laser cutting machine for executing the received cutting plan.
-
公开(公告)号:US20240326160A1
公开(公告)日:2024-10-03
申请号:US18701048
申请日:2022-10-24
申请人: BYSTRONIC LASER AG
发明人: Michael BERGER , Titus HAAS , Simon SCHEIDIGER
CPC分类号: B23K26/0604 , B23K26/38 , B23K31/006 , B23K31/10
摘要: A control unit for determining a dynamic laser beam shape for controlling a laser cutting machine, which is provided with a dynamic beam shaping module for varying the shape of the laser beam. The control unit includes a cutting plan interface, which is configured for receiving a cutting plan, an interface to a shape storage with a stored set of dynamic laser beam shapes, in particular more than two, and a processor which is configured for automatically calculating for each of the cutting segments an allocation to a dynamic laser beam shape of the set of dynamic laser beam shapes, wherein calculating the allocation is based on the property indicator of the workpiece and is specific for the respective cutting segment. The processor is further configured for providing control instructions for controlling the laser cutting machine by applying the determined dynamic laser beams shapes for each cutting segment specifically.
-
公开(公告)号:US11975402B2
公开(公告)日:2024-05-07
申请号:US18249193
申请日:2021-10-15
申请人: BYSTRONIC LASER AG
发明人: Christoph Fahrni , Stefan Kaltenbach , Titus Haas , Andreas Luedi
IPC分类号: B23K26/042 , B23K10/00
CPC分类号: B23K26/042 , B23K10/006
摘要: A beam machining head (10; 100; 200) for beam cutting of a workpiece is provided, having an interface (12) for an energy beam source (14; 14, 201) for generating a focused machining energy beam (15; 206) selected from a particle beam source, a fuel fluid beam source, a plasma beam source and/or a source for electromagnetic radiation; an exit opening (16) for the machining energy beam bounded by an opening edge (18); an optical detector unit (19) for recording at least one image of an electromagnetic radiation (17) emitted from the workpiece (11) through the exit opening into the beam machining head (10; 100; 200) and induced in the workpiece by the machining energy beam; and a monitoring unit (30) connected in a data-transmitting manner to the optical detector unit for monitoring a positional relationship between a centre of the emitted electromagnetic radiation and the exit opening, wherein the monitoring unit (30) has: a first determination module for determining at least one position (180; 182) of the exit opening in the at least one image; a second determination module for determining at least one position (170) of the centre of the emitted electromagnetic radiation in the at least one image; and a third determination module for determining the positional relationship between the at least one position (170) of the centre of the emitted electromagnetic radiation and the at least one position (180; 182) of the exit opening (16). A beam machining device and a method for beam cutting are further disclosed.
-
公开(公告)号:US20230305511A1
公开(公告)日:2023-09-28
申请号:US18035529
申请日:2021-11-04
申请人: BYSTRONIC LASER AG
IPC分类号: G05B19/18 , G05B19/406 , G05B19/409
CPC分类号: G05B19/188 , G05B19/406 , G05B19/409 , G05B2219/36203
摘要: A control device for at least one technical installation is described herein. The control device includes at least one mobile control unit for controlling the at least one technical installation as well as at least one supply unit, which can be assigned in a fixed manner to the technical installation and be connected thereto in an energy- and signal-transmitting manner for supplying the at least one mobile control unit with energy. The at least one mobile control unit and the at least one supply unit have a device for wireless energy transmission with a transmission frequency within a predetermined distance between the supply unit and the mobile control unit and for wireless transmission of a safety protocol in the course of the energy transmission. Furthermore, a technical installation and a method for controlling a technical installation are specified.
-
公开(公告)号:US11731212B2
公开(公告)日:2023-08-22
申请号:US17787294
申请日:2020-12-22
申请人: Bystronic Laser AG
CPC分类号: B23K26/0648 , B23K26/36
摘要: An optical unit fora laser beam for laser machining of a workpiece is disclosed. With particular application to a laser beam, the optical unit may be applied to a high-power laser beam and comprise an optical element for the optical imaging of the laser beam, and two protective glasses that are transparent for the laser beam, the outer edges of which protective glasses being enclosed in an airtight manner by a holder in such a way that they form an interior space with the holder, the optical element also being arranged in the interior space. A laser machining device is also disclosed.
-
公开(公告)号:US20230118061A1
公开(公告)日:2023-04-20
申请号:US17906801
申请日:2021-03-03
申请人: BYSTRONIC LASER AG
发明人: Andreas LUEDI , Roland BADER , Matthias SCHRANZ , Joël BAERTSCHI
摘要: The present invention relates, in one aspect, to a method for process monitoring of a laser machining process for estimating a machining quality, having the following steps, which are carried out in real time during the machining process: —providing (S2) at least one captured first signal sequence with a first feature from the machining zone; —providing (S3) at least one captured second signal sequence with a second feature from the machining zone; —accessing (S4) a trained neural network with at least the recorded first and second signal sequence in order to calculate (S5) a result for estimating the machining quality.
-
公开(公告)号:US20230044332A1
公开(公告)日:2023-02-09
申请号:US17759076
申请日:2021-01-22
申请人: BYSTRONIC LASER AG
发明人: Andreas LÜDI , Titus HAAS , Roland BADER
IPC分类号: B23K26/03 , B23K26/046 , B23K26/38 , B23K26/06 , B23K26/70
摘要: A method of laser machining a workpiece is provided, with a) generation of a machining laser beam and imaging of the machining laser beam on the workpiece with at least one optical element; b) machining of the workpiece with the imaged machining laser beam and generation of a cutting gap in the workpiece; c) monitoring of at least one geometric parameter of the cutting gap during step b); and d) regulating the monitored geometric parameter of the cutting gap during step c) for harmonisation with a target value of the geometric parameter of the cutting gap. Further provided is an apparatus for laser machining a workpiece.
-
8.
公开(公告)号:US20220266383A1
公开(公告)日:2022-08-25
申请号:US17617051
申请日:2020-06-05
申请人: Bystronic Laser AG
摘要: A machining apparatus for laser machining a workpiece in a machining zone is provided, having an interface for a machining laser source for generating a machining laser beam with a direction of propagation; an outlet opening for the machining laser beam; and an optical system between the interface and the outlet opening, wherein the optical system has: at least one optical unit that adjusts the focal length of the optical system, and at least one stationary laser beam guiding device with at least one movable surface, wherein the at least one movable surface can be adjusted such that it modifies the focal length of the optical system and/or the beam parameter product of the machining laser beam integrated over time in at least one operating mode. Further provided is a method for laser machining a workpiece.
-
公开(公告)号:US11364574B2
公开(公告)日:2022-06-21
申请号:US16620843
申请日:2018-08-09
申请人: BYSTRONIC LASER AG
发明人: Roland Bader
IPC分类号: B23K26/70 , B23K26/38 , G05B19/4061
摘要: Controlling a beam cutting device having a cutting tool is disclosed. A workpiece part can be cut out of a workpiece along a cutting contour. A cutting plan for the workpiece having a cutting contour for a workpiece part to be cut out of the workpiece is specified. Subsequently, the relative position of the workpiece and/or of the cutting plan and/or of the workpiece part to be cut out is determined. The relative position of the at least one support point of the workpiece support is determined. Subsequently, at least one risk region on the cutting contour of the workpiece part to be cut out is determined, followed by the defining of at least one starting-cut point and/or one cut-away point for the cutting tool on the cutting contour of the workpiece part to be cut out. A computer-implemented method and a beam cutting device is also disclosed.
-
公开(公告)号:US20210308732A1
公开(公告)日:2021-10-07
申请号:US17291220
申请日:2019-11-28
申请人: Bystronic Laser AG
发明人: Friedemann SEIBERT
IPC分类号: B21D5/00 , G05B19/404
摘要: The invention relates to a bending machine (100) configured to bend a metallic workpiece (200), having a controller (130) configured to control a bending operation, wherein the controller (130) has at least one interface (340) configured to obtain information about a time-dependent springback of the workpiece (200) to be bent and to obtain a time indication of a subsequent further machining of the workpiece (200) to be bent, wherein the controller (130) is configured to calculate an adapted bending angle (α) based on the springback and the time indication, and wherein the bending machine (100) is configured to bend the bending operation beyond a bending angle (β) to be bent up to the adapted bending angle (α). Due to the adapted bending angle, the workpiece (300) has the correct bending angle (β) to be bent at the time of subsequent further machining.
-
-
-
-
-
-
-
-
-