公开(公告)号：US11731212B2

公开(公告)日：2023-08-22

申请号：US17787294

申请日：2020-12-22

申请人： Bystronic Laser AG

发明人： Simon Scheidiger ,  Martin Mumenthaler ,  Andreas Luedi

IPC分类号： B23K26/06 ,  B23K26/36

CPC分类号： B23K26/0648 ,  B23K26/36

摘要： An optical unit fora laser beam for laser machining of a workpiece is disclosed. With particular application to a laser beam, the optical unit may be applied to a high-power laser beam and comprise an optical element for the optical imaging of the laser beam, and two protective glasses that are transparent for the laser beam, the outer edges of which protective glasses being enclosed in an airtight manner by a holder in such a way that they form an interior space with the holder, the optical element also being arranged in the interior space. A laser machining device is also disclosed.

公开(公告)号：US12023755B2

公开(公告)日：2024-07-02

申请号：US17617051

申请日：2020-06-05

申请人： Bystronic Laser AG

发明人： Simon Scheidiger ,  Andreas Luedi ,  Michael Berger ,  Martin Mumenthaler

IPC分类号： B23K26/06 ,  B23K26/38

CPC分类号： B23K26/0648 ,  B23K26/0643 ,  B23K26/38

摘要： A machining apparatus for laser machining a workpiece in a machining zone is provided, having an interface for a machining laser source for generating a machining laser beam with a direction of propagation; an outlet opening for the machining laser beam; and an optical system between the interface and the outlet opening, wherein the optical system has: at least one optical unit that adjusts the focal length of the optical system, and at least one stationary laser beam guiding device with at least one movable surface, wherein the at least one movable surface can be adjusted such that it modifies the focal length of the optical system and/or the beam parameter product of the machining laser beam integrated over time in at least one operating mode. Further provided is a method for laser machining a workpiece.

公开(公告)号：US11478879B2

公开(公告)日：2022-10-25

申请号：US17594992

申请日：2020-06-05

申请人： BYSTRONIC LASER AG

发明人： Simon Scheidiger ,  Andreas Luedi ,  Martin Mumenthaler ,  Markus Steinlin

IPC分类号： B23K26/38 ,  B23K26/082

摘要： According to the present application, a machining apparatus (10) for the laser machining of a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), a second interface (16) for a detector device (for detecting radiation (17) emitted by the machining zone (13); an outlet opening (18) for the machining laser beam (14); and first and second laser beam guiding devices (20, 22), wherein the first laser beam guiding device (20), 20a, 20b) is arranged and designed such that it guides the machining laser beam (14) to the second laser beam guiding device (22) and dynamically moves the machining laser beam (14), and the second laser beam guiding device (22) is arranged and designed such that it guides the dynamically moved machining laser beam (14) through the outlet opening (18) and at least partially guides the radiation (17) emitted by the machining zone (13) through the outlet opening to the second interface (16). Further provided is a method for the laser machining of a workpiece (12).

公开(公告)号：US11471979B2

公开(公告)日：2022-10-18

申请号：US17310982

申请日：2020-08-14

申请人： BYSTRONIC LASER AG

发明人： Simon Scheidiger ,  Andreas Luedi ,  Roland Zollinger ,  Martin Mumenthaler

IPC分类号： B23K26/38 ,  B23K26/064 ,  B23K26/082 ,  B23K26/70 ,  B23K26/046 ,  B23K26/06 ,  B23K37/00 ,  G02B26/08 ,  G02B26/10

摘要： A machining apparatus for laser machining a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), an outlet opening (18) for the machining laser beam (15), In an optical system between the first interface (14) and the outlet opening (18), which has at least one laser beam guiding device (22) having at least one movable surface (24) and at least one actuator (26), with which the movable surface (24) is dynamically adjustable, and a cooling device (28) for cooling the at least one actuator (26), wherein the cooling device (28) has at least one primary circuit (30) through which a first cooling fluid can flow without contact with the actuator (26). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece (12) and a method of laser machining a workpiece (12) using such machining apparatus are also provided.