-
公开(公告)号：US20110078899A1
公开(公告)日：2011-04-07
申请号：US12964691
申请日：2010-12-09
申请人： Jeongil Lee , Myoungho Lee , Bigildis Dosdos , Charles Suico , Lee Man Fai Edwin , David Chong Sook Lim , Adriano M. Vilas-Boas
发明人： Jeongil Lee , Myoungho Lee , Bigildis Dosdos , Charles Suico , Lee Man Fai Edwin , David Chong Sook Lim , Adriano M. Vilas-Boas
IPC分类号： H05K3/10
CPC分类号： H01L23/49575 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01M10/0525 , H01M10/425 , H01M10/44 , H01M2200/00 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
摘要翻译： 适用于电池保护电路的多芯片模块。 多芯片模块包括集成电路芯片，第一功率晶体管，第二功率晶体管，将集成电路芯片电耦合到第一功率晶体管的第一连接结构，将集成电路芯片电耦合到第二功率晶体管的第二连接结构 功率晶体管，以及包括第一引线，第二引线，第三引线和第四引线的引线框结构，其中所述集成电路芯片，所述第一功率晶体管和所述第二功率晶体管安装在所述引线框结构上。 成型材料覆盖集成电路芯片，第一功率晶体管，第二功率晶体管，第一连接结构和第二连接结构的至少一部分。
-
公开(公告)号：US07868432B2
公开(公告)日：2011-01-11
申请号：US11672728
申请日：2007-02-08
申请人： Jeongil Lee , Myoungho Lee , Bigildis Dosdos , Charles Suico , Lee Man Fai Edwin , David Chong Sook Lim , Adriano M. Vilas-Boas
发明人： Jeongil Lee , Myoungho Lee , Bigildis Dosdos , Charles Suico , Lee Man Fai Edwin , David Chong Sook Lim , Adriano M. Vilas-Boas
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01M10/0525 , H01M10/425 , H01M10/44 , H01M2200/00 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
-
公开(公告)号：US08003447B2
公开(公告)日：2011-08-23
申请号：US12964691
申请日：2010-12-09
申请人： Jeongil Lee , Myoungho Lee , Bigildis Dosdos , Charles Suico , Edwin Man Fai Lee , David Chong Sook Lim , Adriano M. Vilas-Boas
发明人： Jeongil Lee , Myoungho Lee , Bigildis Dosdos , Charles Suico , Edwin Man Fai Lee , David Chong Sook Lim , Adriano M. Vilas-Boas
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01M10/0525 , H01M10/425 , H01M10/44 , H01M2200/00 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
摘要翻译： 适用于电池保护电路的多芯片模块。 多芯片模块包括集成电路芯片，第一功率晶体管，第二功率晶体管，将集成电路芯片电耦合到第一功率晶体管的第一连接结构，将集成电路芯片电耦合到第二功率晶体管的第二连接结构 功率晶体管，以及包括第一引线，第二引线，第三引线和第四引线的引线框结构，其中所述集成电路芯片，所述第一功率晶体管和所述第二功率晶体管安装在所述引线框结构上。 成型材料覆盖集成电路芯片，第一功率晶体管，第二功率晶体管，第一连接结构和第二连接结构的至少一部分。
-
公开(公告)号：US20070187807A1
公开(公告)日：2007-08-16
申请号：US11672728
申请日：2007-02-08
申请人： Jeongil Lee , Myoungho Lee , Bigildis Dosdos , Charles Suico , Lee Man Fai Edwin , David Chong Sook Lim , Adriano M. Vilas-Boas
发明人： Jeongil Lee , Myoungho Lee , Bigildis Dosdos , Charles Suico , Lee Man Fai Edwin , David Chong Sook Lim , Adriano M. Vilas-Boas
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01M10/0525 , H01M10/425 , H01M10/44 , H01M2200/00 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
摘要翻译： 适用于电池保护电路的多芯片模块。 多芯片模块包括集成电路芯片，第一功率晶体管，第二功率晶体管，将集成电路芯片电耦合到第一功率晶体管的第一连接结构，将集成电路芯片电耦合到第二功率晶体管的第二连接结构 功率晶体管，以及包括第一引线，第二引线，第三引线和第四引线的引线框结构，其中所述集成电路芯片，所述第一功率晶体管和所述第二功率晶体管安装在所述引线框结构上。 成型材料覆盖集成电路芯片，第一功率晶体管，第二功率晶体管，第一连接结构和第二连接结构的至少一部分。
-
-
-
搜索结果
4 条记录 (耗时 0.011 秒)
