公开(公告)号：US07429788B2

公开(公告)日：2008-09-30

申请号：US11715091

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01L23/02

CPC classification number: H05K1/189 ,  H01L23/473 ,  H01L23/5387 ,  H01L25/50 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0064 ,  H05K2201/0191 ,  H05K2201/056 ,  H05K2201/09118 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.

Abstract translation: 薄多芯片模块包括：可折叠框架，其包括两个刚性的基本平坦的构件，其能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路在其各自表面的每一个的至少一部分上结合到所述平面构件中的至少一个; 并且模块上的电极被配置为在框架关闭之后可以被外部插座访问。 一种制造薄多芯片模块的方法包括以下步骤：a。 将集成电路芯片附接到柔性电路; b。 将柔性电路接合到可折叠框架，该可折叠框架包括两个刚性的基本平坦的构件，能够围绕选定的折叠轴线折叠在一起以形成基本封闭的结构; 和，c。 将框架围绕折叠轴线折叠约180°。

公开(公告)号：US07796399B2

公开(公告)日：2010-09-14

申请号：US12317892

申请日：2008-12-30

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/18 ,  H05K7/20 ,  H01R12/24 ,  H01R43/02 ,  H04L12/50 ,  H01L23/34

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 导电图案包括与衬底的一个边缘相邻的一系列电接触。 衬底被粘合到两个刚性框架上，每个相对表面上一个。 每个衬底在一个边缘上具有一系列在优选通过焊接的衬底上对准并电连接到衬底上的相应接触件的蓖耳。 当模块与低轮廓的针阵列接触时，这些哨座可以用作自对准机构，并且模块可以通过插座中的导轨固定在主板上的位置，该插座与垂直于雉鸡的边缘接合 模块的边缘。 模块还可以设置有保护性散热罩。

公开(公告)号：US07724530B2

公开(公告)日：2010-05-25

申请号：US12317890

申请日：2008-12-30

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。

公开(公告)号：US07394149B2

公开(公告)日：2008-07-01

申请号：US11715303

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01L23/02

CPC classification number: H05K1/189 ,  G06F1/183 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/2018

Abstract: A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins. Alternatively, a low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; a socket configured to matably engage the module; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.

Abstract translation: 低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。 或者，低插入力多芯片在线模块包括：基本刚性的框架; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路具有至少部分地沿着所述框架的一个边缘露出的触点; 被配置成与所述模块配合地配合的插座; 以及设置在暴露的柔性电路和刚性框架之间的柔性层，由此柔性层的受控变形增强了触头和对应的外部电引脚之间的电连续性。

公开(公告)号：US08559181B2

公开(公告)日：2013-10-15

申请号：US12930971

申请日：2011-01-21

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.

公开(公告)号：USRE42252E1

公开(公告)日：2011-03-29

申请号：US12804381

申请日：2010-07-20

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。

公开(公告)号：US07393226B2

公开(公告)日：2008-07-01

申请号：US11715141

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01R4/60

CPC classification number: H01L23/473 ,  H01L23/5387 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01R12/7011 ,  H01R12/721 ,  H01R12/79 ,  H01R25/006 ,  H01R27/02 ,  H01R35/00 ,  H01L2924/00

Abstract: A socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, at least two fluid connections configured to matably engage corresponding fluid connections on the in-line module, whereby fluid may be circulated into and out of the module while maintaining electrical continuity between the pins and the contacts. Alternatively, a socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, a fluid connection configured to matably engage a corresponding fluid connection on the in-line module, whereby fluid may be introduced into the module through the socket and vented elsewhere while maintaining electrical continuity between the pins and the contacts.

Abstract translation: 用于在线电路模块的插座包括：至少一排电引脚，其被配置成可嵌入地嵌入在线模块中的相应触点; 以及至少两个流体连接件，其配置成可以嵌合在一起的在线模块中的相应的流体连接，由此流体可以循环进入模块并从模块中流出，同时保持销和触头之间的电连续性。 或者，用于在线电路模块的插座包括：至少一排电引脚，其被配置为与所述在线模块中的相应接触件配合地接合; 以及流体连接，其配置成可以嵌合在一起的在线模块中的对应的流体连接，由此可以通过插座将流体引入到模块中，并在其它位置排放，同时保持销和触头之间的电连续性。

公开(公告)号：US09746879B2

公开(公告)日：2017-08-29

申请号：US14544875

申请日：2015-02-27

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00 ,  G06F1/16 ,  G06F1/18 ,  H05K1/14 ,  H05K3/36 ,  H01R12/62 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: G06F1/16 ,  G06F1/184 ,  G06F1/185 ,  H01R12/62 ,  H05K1/028 ,  H05K1/118 ,  H05K1/147 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10545

Abstract: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

公开(公告)号：US08899994B2

公开(公告)日：2014-12-02

申请号：US13573970

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H01R12/77

CPC classification number: H01R12/77 ,  H01R13/627

Abstract: An electrical interconnect system comprises: a clamping collar having a slot for receiving a bifurcated flexible circuit; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the bifurcated flexible circuit when the legs of the bifurcated area are spread apart; and, a compression latch member to engage the clamping collar and compress the pads against their respective contacts on the contact strip.

Abstract translation: 电互连系统包括：夹紧环，其具有用于接收分叉的柔性电路的槽; 接触条，当分叉区域的腿分开时，包括与分叉的柔性回路上的各个垫对准的多个电触点; 以及压缩闩锁构件，以接合夹紧套环并且将垫抵压在接触片上的它们各自的触点上。

公开(公告)号：US08817458B2

公开(公告)日：2014-08-26

申请号：US13573971

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K1/18 ,  G06F1/18

CPC classification number: H05K1/181 ,  G06F1/16 ,  G06F1/184 ,  G06F1/185 ,  H01R12/79 ,  H05K1/118 ,  H05K1/147 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10545

Abstract: An electrical interconnection system comprises a bifurcated, multilayer flex circuit having electrode pads on the inner surfaces of the bifurcation. Electronic components are mounted on one or both sides of the flex circuit by conventional means. When the bifurcation is spread apart, the electrode pads are alignable with respective contacts on a printed circuit board. After bonding the pads to the contacts by soldering, conductive adhesive, or other means, a secure electrical connection is maintained while still allowing the flex circuit to bend somewhat from side to side, creating additional design options not available with rigidly mounted components and modules.

Abstract translation: 电互连系统包括在分叉的内表面上具有电极焊盘的分叉的多层柔性电路。 电子部件通过常规方式安装在柔性电路的一侧或两侧。 当分叉分开时，电极焊盘可与印刷电路板上的各个触点对准。 在通过焊接，导电粘合剂或其他方式将焊盘接合到触点之后，保持牢固的电连接，同时仍然允许柔性电路从一侧到另一侧弯曲一些，从而产生不具有刚性安装的部件和模块的附加设计选项。