公开(公告)号：US12132977B2

公开(公告)日：2024-10-29

申请号：US18113700

申请日：2023-02-24

申请人： AZUREWAVE TECHNOLOGIES, INC.

发明人： Chih-Hao Liao ,  Meng-Hsin Kuo

IPC分类号： H04N23/55

CPC分类号： H04N23/55

摘要： An image sensor lens assembly and a sensing module having an open configuration are provided. The sensing module includes an image sensor chip, a filtering sheet, a supporting layer sandwiched between the image sensor chip and the filtering sheet, a circuit board having a thru-hole, and an adhering layer. The supporting layer is not enclosed and has an internal communication opening. The image sensor chip is fixed onto the circuit board, and the filtering sheet is partially arranged in the thru-hole so as to jointly form a ring-shaped gap there-between that is in spatial communication with the internal communication opening. The adhering layer is formed in a part of the ring-shaped gap so as to adhere the filtering sheet onto the circuit board and has an external communication opening. The internal communication opening, the ring-shaped gap, and the external communication opening are jointly formed as a dust-proof channel.

公开(公告)号：US20240214661A1

公开(公告)日：2024-06-27

申请号：US18113700

申请日：2023-02-24

申请人： AZUREWAVE TECHNOLOGIES, INC.

发明人： CHIH-HAO LIAO ,  MENG-HSIN KUO

IPC分类号： H04N23/55

CPC分类号： H04N23/55

摘要： An image sensor lens assembly and a sensing module having an open configuration are provided. The sensing module includes an image sensor chip, a filtering sheet, a supporting layer sandwiched between the image sensor chip and the filtering sheet, a circuit board having a thru-hole, and an adhering layer. The supporting layer is not enclosed and has an internal communication opening. The image sensor chip is fixed onto the circuit board, and the filtering sheet is partially arranged in the thru-hole so as to jointly form a ring-shaped gap there-between that is in spatial communication with the internal communication opening. The adhering layer is formed in a part of the ring-shaped gap so as to adhere the filtering sheet onto the circuit board and has an external communication opening. The internal communication opening, the ring-shaped gap, and the external communication opening are jointly formed as a dust-proof channel.

公开(公告)号：US20240047369A1

公开(公告)日：2024-02-08

申请号：US17967378

申请日：2022-10-17

申请人： AZUREWAVE TECHNOLOGIES, INC.

发明人： CHIH-HAO LIAO ,  HSIN-YEH HUANG ,  SHU-HAN WU

IPC分类号： H01L23/544 ,  H01L25/16 ,  H01L23/31

CPC分类号： H01L23/544 ,  H01L25/165 ,  H01L23/315 ,  H01L23/3135 ,  H01L2223/54413 ,  H01L2223/54433

摘要： A chip package structure and a package module thereof are provided. The package module includes an encapsulant and a recognition contrast layer. The encapsulant has a patterned trench that is recessed in a top surface thereof and that corresponds in shape to a predetermined two-dimensional (2D) code pattern. The recognition contrast layer is filled in the patterned trench. The recognition contrast layer and the top surface of the encapsulant respectively have different colors that conform to grade A or grade B in the ISO/IEC 15415 standard. The recognition contrast layer is coplanar with the top surface of the encapsulant so as to jointly form the predetermined 2D code pattern having a planar shape.

公开(公告)号：US20220026963A1

公开(公告)日：2022-01-27

申请号：US17031861

申请日：2020-09-24

申请人： AZUREWAVE TECHNOLOGIES, INC.

发明人： TSENG-CHIEH LEE ,  KUNG-AN LIN

IPC分类号： G06F1/16 ,  H01L27/146

摘要： A portable electronic device and an image-capturing module thereof are provided. The image-capturing module includes a circuit substrate, an image-capturing chip, a plurality of first conductive materials, a filter component, a plurality of second conductive materials, and a lens assembly. The circuit substrate includes a plurality of substrate bond pads. The image-capturing chip includes a plurality of chip bond pads. The first conductive materials are respectively disposed on the chip bond pads. The filter component is disposed on the first conductive materials, and the filter component includes a light-transmitting body and a plurality of conductive structures disposed on the light-transmitting body and respectively electrically connected to the first conductive materials. Each of the second conductive materials is electrically connected between the corresponding conductive structure and the corresponding substrate bond pads. The lens assembly is disposed on the circuit substrate so as to correspond to the image-capturing chip.

公开(公告)号：US09485671B2

公开(公告)日：2016-11-01

申请号：US14192561

申请日：2014-02-27

申请人： AZUREWAVE TECHNOLOGIES, INC.

发明人： Huang-Chan Chien

IPC分类号： H04W24/02 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28

CPC分类号： H04W24/02 ,  G01R1/067 ,  G01R1/06772 ,  G01R1/073 ,  G01R31/2601 ,  G01R31/2886

摘要： An inter-stage test structure for a wireless communication apparatus is provided. The wireless communication apparatus has a unit under test (UUT) and a next-stage component connected to the UUT through a signal wire. The inter-stage test structure is disposed on the signal wire and electrically connects the UUT to the next-stage unit component. The inter-stage test structure includes an upper board, a lower board, and an intermediate layer. The intermediate layer is disposed between the upper board and the lower board. The intermediate layer includes a first region and a second region defined thereon. The first region has an air cavity for generating an air impedance. The second region has an impedance adjusting cavity for generating an adjustable impedance. Accordingly, the inter-stage test structure can detect the condition of the UUT of the wireless communication apparatus based on the air impedance and the adjustable impedance.

摘要翻译： 提供了一种用于无线通信装置的阶段间测试结构。 无线通信装置具有被测单元（UUT）和通过信号线连接到UUT的下一级分量。 级间测试结构设置在信号线上，并将UUT电连接到下一级单元组件。 阶段间测试结构包括上板，下板和中间层。 中间层设置在上板和下板之间。 中间层包括限定在其上的第一区域和第二区域。 第一区域具有用于产生空气阻抗的空气腔。 第二区域具有用于产生可调阻抗的阻抗调节腔。 因此，级间测试结构可以基于空气阻抗和可调阻抗来检测无线通信设备的UUT的状况。

公开(公告)号：US09007419B2

公开(公告)日：2015-04-14

申请号：US13739924

申请日：2013-01-11

申请人： Azurewave Technologies, Inc.

发明人： Chi-Hsing Hsu ,  Ming-Shun Chen

IPC分类号： H04N7/14 ,  G09G3/20 ,  H04M9/08

CPC分类号： H04N7/148 ,  G09G3/2096 ,  G09G5/006 ,  G09G2370/14 ,  H04M9/08

摘要： The present disclosure relates to an audiovisual apparatus, which includes an audiovisual capturing unit, an audiovisual broadcast unit, and a transmission cable module. The two ends of the transmission cable module are respectively connected to the audiovisual capturing unit and the audiovisual broadcast unit. The transmission cable module has a video cable group for transmitting video signals and an audio cable group for transmitting audio signals suitable for reducing echo. The audio cable group includes a cable for providing a digital clock for the audio signal, a cable for providing a clock for the left right channel switching audio signal, a cable for inputting serial audio signal, and a cable for outputting serial audio signal. With this arrangement, the audio signals captured by the audiovisual capturing unit and transmitted by the transmission cable module to the audiovisual broadcast unit can be effectively removed of echo.

摘要翻译： 本公开涉及一种包括视听拍摄单元，视听广播单元和传输电缆模块的视听设备。 传输电缆模块的两端分别连接到视听拍摄单元和视听广播单元。 传输电缆模块具有用于传输视频信号的视频电缆组和用于传输适于减少回声的音频信号的音频电缆组。 音频电缆组包括用于为音频信号提供数字时钟的电缆，用于为左右声道切换音频信号提供时钟的电缆，用于输入串行音频信号的电缆以及用于输出串行音频信号的电缆。 通过这种布置，可以有效地消除由图像声音捕获单元捕获并由传输电缆模块传输到视听广播单元的音频信号。

公开(公告)号：US20150048386A1

公开(公告)日：2015-02-19

申请号：US14055956

申请日：2013-10-17

申请人： AZUREWAVE TECHNOLOGIES, INC.

发明人： CHI-HSING HSU

IPC分类号： H01L31/12 ,  H01L31/18

CPC分类号： H01L31/12 ,  H01L31/18 ,  H04N5/2254 ,  H04N5/2257

摘要： An image sensing module includes an image sensing unit, a light transmitting unit, a substrate unit and lens unit. The image sensing unit includes an image sensing element having an image sensing area on the top side of the image sensing element. The light transmitting unit includes a light transmitting element supported above the image sensing element by a plurality of support members. The substrate unit includes a flexible substrate disposed on the image sensing element and electrically connected to the image sensing element through a plurality of electrical conductors, and the flexible substrate has at least one through opening for receiving the light transmitting element. The lens unit includes an opaque holder disposed on the flexible substrate to cover the light transmitting element and a lens assembly connected to the opaque holder and disposed above the light transmitting element.

摘要翻译： 图像感测模块包括图像感测单元，光发射单元，基板单元和透镜单元。 图像感测单元包括在图像感测元件的顶侧具有图像感测区域的图像感测元件。 光发射单元包括通过多个支撑构件支撑在图像感测元件上方的光发射元件。 基板单元包括设置在图像感测元件上并通过多个电导体电连接到图像感测元件的柔性基板，并且柔性基板具有用于接收光发射元件的至少一个通孔。 透镜单元包括设置在柔性基板上以覆盖光透射元件的不透明保持器和连接到不透明保持器并设置在透光元件上方的透镜组件。

公开(公告)号：US20130161491A1

公开(公告)日：2013-06-27

申请号：US13353412

申请日：2012-01-19

申请人： CHUN-YU LU ,  CHI-HSING HSU

发明人： CHUN-YU LU ,  CHI-HSING HSU

IPC分类号： G01J1/42

CPC分类号： G06F3/0423

摘要： An optical touch control module for providing at least one sensing area includes: a light-reflecting unit, a first light-sensing unit and a second light-sensing unit. The light-reflecting unit includes a light-reflecting element for partially surrounding the sensing area. The first light-sensing unit is disposed beside one edge of the at least one sensing area and adjacent to one end of the light-reflecting element. The first light-sensing unit includes at least one first light-emitting element, at least one first light-detecting element, and at least one first oscillating reflecting element oscillating depending on time. The second light-sensing unit is disposed beside another edge of the at least one sensing area and adjacent to another end of the light-reflecting element. The second light-sensing unit includes at least one second light-emitting element, at least one second light-detecting element, and at least one second oscillating reflecting element oscillating depending on time.

摘要翻译： 一种用于提供至少一个感测区域的光学触摸控制模块包括：光反射单元，第一光感测单元和第二光感测单元。 光反射单元包括用于部分地围绕感测区域的光反射元件。 第一感光单元设置在至少一个感测区域的一个边缘旁边并且邻近光反射元件的一端。 第一感光单元包括至少一个第一发光元件，至少一个第一光检测元件和至少一个根据时间振荡的第一振荡反射元件。 第二感光单元设置在至少一个感测区域的另一边缘附近并且与光反射元件的另一端相邻。 第二感光单元包括至少一个第二发光元件，至少一个第二光检测元件和至少一个根据时间振荡的第二振荡反射元件。

公开(公告)号：US08320960B2

公开(公告)日：2012-11-27

申请号：US12506757

申请日：2009-07-21

申请人： Hung-Lin Shih

发明人： Hung-Lin Shih

IPC分类号： H04B1/38

CPC分类号： G06F1/1633 ,  G06F1/1632

摘要： A docking station includes a casing, a socket and a plurality of peripheral interface devices. The casing includes a base and a cover, wherein the cover is pivotingly disposed on the base, openably and coverably, to form an appearance of a notebook computer. The socket is formed in a surface of the base for receiving a mobile communication device, and a high speed transmission interface is formed in a bottom of the socket. The plurality of peripheral interface devices is disposed on the casing and electrically connected with the high speed transmission interface. When the mobile communication device is placed in the socket, the mobile communication device is electrically connected with the high speed transmission interface and transmits signals with the plurality of peripheral interface devices. Basing on the structure, the present invention can ensure that mobile communication devices are convenient for operation.

摘要翻译： 对接站包括壳体，插座和多个外围接口装置。 壳体包括基座和盖，其中盖可枢转地设置在基座上，可开启和可覆盖地形成笔记本计算机的外观。 插座形成在用于接收移动通信装置的基座的表面中，并且高速传输接口形成在插座的底部。 多个外围接口装置设置在壳体上并与高速传输接口电连接。 当移动通信设备被放置在插座中时，移动通信设备与高速传输接口电连接并且与多个外围接口设备发送信号。 基于该结构，本发明可以确保移动通信设备的操作方便。

公开(公告)号：US08059425B2

公开(公告)日：2011-11-15

申请号：US12153907

申请日：2008-05-28

申请人： Chung-Er Huang ,  Chien-Yu Huang

发明人： Chung-Er Huang ,  Chien-Yu Huang

IPC分类号： H03B1/00

CPC分类号： H05K9/0022 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0243 ,  H05K3/284 ,  H05K2201/062 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2203/1316

摘要： An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.

摘要翻译： 一种应用于电子设备的温度补偿晶体振荡器（TCXO）的集成电路模块包括：具有一个顶表面的一个基板; 一个温度补偿晶体振荡器（TCXO）设置在顶表面上; 至少一个芯片设置在顶表面上; 一个封装件形成在顶表面上，用于覆盖TCXO和芯片。 由于上述结构，TCXO由于温度差而不能进行热交换，所以TCXO的稳定性提高。