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公开(公告)号：US12108130B2
公开(公告)日：2024-10-01
申请号：US18113129
申请日：2023-02-23
发明人： Chih-Hao Liao , Meng-Hsin Kuo
摘要： An image sensor lens assembly and a sensing module having an externally sealed configuration are provided. The sensing module includes an image sensor chip, a filtering sheet, a supporting layer sandwiched between the image sensor chip and the filtering sheet, a circuit board having a thru-hole, a first adhering layer, and a second adhering layer. The supporting layer is not enclosed and has a communication opening. The image sensor chip is fixed onto the circuit board, and the filtering sheet is partially arranged in the thru-hole so as to jointly form a ring-shaped gap there-between that is in spatial communication with the communication opening. The first adhering layer having a shape of an enclosed loop is formed in the ring-shaped gap. The second adhering layer is connected to and seals the image sensor chip and the circuit board.
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2.发明公开公开(公告)号：US20240113036A1
公开(公告)日：2024-04-04
申请号：US17988844
申请日：2022-11-17
发明人： CHIH-HAO LIAO , SHU-HAN WU , HSIN-YEH HUANG
IPC分类号： H01L23/552 , H01L21/56 , H01L23/31
CPC分类号： H01L23/552 , H01L21/563 , H01L23/3121
摘要： An electromagnetic interference (EMI) shielding package structure, a manufacturing method thereof, and an electronic assembly are provided. The EMI shielding package structure includes a carrier, at least one chip mounted on a first board surface of the carrier, an encapsulant formed on the carrier and packaging the at least one chip, an EMI shielding layer formed on an outer surface of the encapsulant, and an insulating layer. The insulating layer includes a spraying portion and a capillary permeating portion. The spraying portion is formed at least part of an outer surface of the EMI shielding layer. The capillary permeating portion is formed by extending from a bottom end of the spraying portion toward a second board surface of the carrier through capillarity, and the capillary permeating portion covers a bottom edge of the EMI shielding layer.
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公开(公告)号：US10818829B2
公开(公告)日：2020-10-27
申请号：US16285902
申请日：2019-02-26
发明人： Chuan Jin
IPC分类号： H01L33/62 , H01L33/48 , H01L33/58 , H01L33/64 , H01L25/075
摘要： A flip-chip light-emitting module includes a main circuit board, a heat dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the heat dissipation substrate and a lens unit disposed in the frame. The frame includes a first conductive path and at least two second conductive paths separated from each other, and the first conductive path and the second conductive paths are electrically connected to the main circuit board. The light-emitting chip is disposed on a heat dissipation substrate including a top conductive contact and a light-emitting surface on the same side of the light-emitting chip. The top conductive contact is electrically connected to the first conductive path through a conductor. The lens unit is provided with at least one light-transmitting conductive layer electrically connected to the at least two second conductive paths.
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公开(公告)号：US20200185447A1
公开(公告)日：2020-06-11
申请号：US16285739
申请日：2019-02-26
发明人： CHUAN JIN
IPC分类号： H01L27/146 , H04N5/225
摘要： The present invention provides an image capturing module and a portable electronic device, including a circuit substrate, an image sensing chip, a filter element, and a lens assembly. The upper surface of the circuit substrate includes a chip placing area, a first solder area, and a second solder area. The upper surface of the image sensing chip includes an image sensing area, a carrier area, a first conductive area, and a second conductive area, and the carrier area surrounds the image sensing area. The lower surface of the filter element has a light transmitting area and a connecting area surrounding the light transmitting area. The first conductive area and the second conductive area of the image sensing chip are electrically and respectively connected to the first solder area and the second solder area of the circuit substrate.
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5.发明授权公开(公告)号：US10388685B2
公开(公告)日：2019-08-20
申请号：US15709756
申请日：2017-09-20
发明人： Tseng-Chieh Lee , Kung-An Lin
IPC分类号： H01L31/0232 , H01L27/146
摘要： The present invention provides a portable electronic device and an image-capturing module thereof, and an image-sensing assembly thereof. The image-sensing assembly includes an image-sensing chip, a spacer structure, and a filter element. The image-sensing chip has an image sensing area and a non-image sensing area surrounding the image sensing area. The spacer structure is disposed on the non-image sensing area. The filter element is disposed on the spacer structure so as to separate the filter element from the image-sensing chip by a predetermined distance. The image-sensing assembly can be applied to the image-capturing module, and the image-capturing module can be applied to the portable electronic device.
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公开(公告)号：US20150241496A1
公开(公告)日：2015-08-27
申请号：US14192561
申请日：2014-02-27
发明人： HUANG-CHAN CHIEN
IPC分类号： G01R31/02
CPC分类号： H04W24/02 , G01R1/067 , G01R1/06772 , G01R1/073 , G01R31/2601 , G01R31/2886
摘要： An inter-stage test structure for a wireless communication apparatus is provided. The wireless communication apparatus has a unit under test (UUT) and a next-stage component connected to the UUT through a signal wire. The inter-stage test structure is disposed on the signal wire and electrically connects the UUT to the next-stage unit component. The inter-stage test structure includes an upper board, a lower board, and an intermediate layer. The intermediate layer is disposed between the upper board and the lower board. The intermediate layer includes a first region and a second region defined thereon. The first region has an air cavity for generating an air impedance. The second region has an impedance adjusting cavity for generating an adjustable impedance. Accordingly, the inter-stage test structure can detect the condition of the UUT of the wireless communication apparatus based on the air impedance and the adjustable impedance.
摘要翻译： 提供了一种用于无线通信装置的阶段间测试结构。 无线通信装置具有被测单元（UUT）和通过信号线连接到UUT的下一级分量。 级间测试结构设置在信号线上，并将UUT电连接到下一级单元组件。 阶段间测试结构包括上板，下板和中间层。 中间层设置在上板和下板之间。 中间层包括限定在其上的第一区域和第二区域。 第一区域具有用于产生空气阻抗的空气腔。 第二区域具有用于产生可调阻抗的阻抗调节腔。 因此，级间测试结构可以基于空气阻抗和可调阻抗来检测无线通信设备的UUT的状况。
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公开(公告)号：US20150029694A1
公开(公告)日：2015-01-29
申请号：US13952403
申请日：2013-07-26
发明人： YU-TING CHENG , CHEE-ONN CHING
IPC分类号： F21V23/06
CPC分类号： F21V23/06 , F21K9/232 , F21V33/0052 , F21V33/0076 , F21Y2103/33 , H01R31/06 , H01R33/94 , H01R35/04
摘要： The bulb socket comprises a main body, a lighting module, and an adapter cover. The main body has a head portion and a carrying portion arranged on two opposite end portions thereof. The lighting module is fixed on the carrying portion of the main body and electrically connecting to the head portion. The adapter cover module has a translucent cover and a power supply. The translucent cover is disposed on the carrying portion of the main body for allowing light generated from the lighting module to go through the translucent cover. The translucent cover has a receiving compartment. The power supply unit is disposed on the receiving compartment and electrically connecting to the head portion. Thus, the bulb socket of the instant disclosure can be used for being inserted by an electronic device.
摘要翻译： 灯泡插座包括主体，照明模块和适配器盖。 主体具有设置在其两个相对端部上的头部和承载部分。 照明模块固定在主体的承载部分上并电连接到头部。 适配器盖模块具有半透明盖和电源。 半透明盖设置在主体的承载部分上，用于允许从照明模块产生的光穿过半透明盖。 半透明盖具有接收隔间。 电源单元设置在接收室上并电连接到头部。 因此，本公开的灯泡插座可以用于由电子设备插入。
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公开(公告)号：US12132977B2
公开(公告)日：2024-10-29
申请号：US18113700
申请日：2023-02-24
发明人： Chih-Hao Liao , Meng-Hsin Kuo
IPC分类号： H04N23/55
CPC分类号： H04N23/55
摘要： An image sensor lens assembly and a sensing module having an open configuration are provided. The sensing module includes an image sensor chip, a filtering sheet, a supporting layer sandwiched between the image sensor chip and the filtering sheet, a circuit board having a thru-hole, and an adhering layer. The supporting layer is not enclosed and has an internal communication opening. The image sensor chip is fixed onto the circuit board, and the filtering sheet is partially arranged in the thru-hole so as to jointly form a ring-shaped gap there-between that is in spatial communication with the internal communication opening. The adhering layer is formed in a part of the ring-shaped gap so as to adhere the filtering sheet onto the circuit board and has an external communication opening. The internal communication opening, the ring-shaped gap, and the external communication opening are jointly formed as a dust-proof channel.
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公开(公告)号：US20240214661A1
公开(公告)日：2024-06-27
申请号：US18113700
申请日：2023-02-24
发明人： CHIH-HAO LIAO , MENG-HSIN KUO
IPC分类号： H04N23/55
CPC分类号： H04N23/55
摘要： An image sensor lens assembly and a sensing module having an open configuration are provided. The sensing module includes an image sensor chip, a filtering sheet, a supporting layer sandwiched between the image sensor chip and the filtering sheet, a circuit board having a thru-hole, and an adhering layer. The supporting layer is not enclosed and has an internal communication opening. The image sensor chip is fixed onto the circuit board, and the filtering sheet is partially arranged in the thru-hole so as to jointly form a ring-shaped gap there-between that is in spatial communication with the internal communication opening. The adhering layer is formed in a part of the ring-shaped gap so as to adhere the filtering sheet onto the circuit board and has an external communication opening. The internal communication opening, the ring-shaped gap, and the external communication opening are jointly formed as a dust-proof channel.
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公开(公告)号：US20240047369A1
公开(公告)日：2024-02-08
申请号：US17967378
申请日：2022-10-17
发明人： CHIH-HAO LIAO , HSIN-YEH HUANG , SHU-HAN WU
IPC分类号： H01L23/544 , H01L25/16 , H01L23/31
CPC分类号： H01L23/544 , H01L25/165 , H01L23/315 , H01L23/3135 , H01L2223/54413 , H01L2223/54433
摘要： A chip package structure and a package module thereof are provided. The package module includes an encapsulant and a recognition contrast layer. The encapsulant has a patterned trench that is recessed in a top surface thereof and that corresponds in shape to a predetermined two-dimensional (2D) code pattern. The recognition contrast layer is filled in the patterned trench. The recognition contrast layer and the top surface of the encapsulant respectively have different colors that conform to grade A or grade B in the ISO/IEC 15415 standard. The recognition contrast layer is coplanar with the top surface of the encapsulant so as to jointly form the predetermined 2D code pattern having a planar shape.
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