-
公开(公告)号：US20240040744A1
公开(公告)日：2024-02-01
申请号：US18257286
申请日：2021-12-14
申请人： ASETEK DANMARK A/S
CPC分类号： H05K7/20263 , B21D53/022 , H05K7/20172
摘要： There is a need for better cooling solutions for the ever-increasing thermal density of computing systems. This is solved by providing a radiator (100) for a liquid cooling system for cooling a computing unit, the radiator comprising: —a first manifold (101) and a second manifold (102) having among them two liquid openings (103, 104) for connecting the radiator in a liquid loop, —channels (110) extending between the first manifold (101) and the second manifold (102) and providing parallel liquid paths between the manifolds (101, 102), —fin layers (130) sandwiched between sets of neighbouring channels (110) and extending between the first manifold (101) and the second manifold (102), —fastening means (120) for attaching a fan (10) to the radiator (100) in a predetermined position, determining a ring-shaped high-pressure zone (142) corresponding to an outer area of a fan radius (122) of an attached fan, where —at least one fin layer has a low-density section placed away from the high-pressure zone, and a high-density section being located in the high-pressure zone and having a higher fin density than the low-density section, —the density of the group of fin layers thereby varies both along the channels but also transverse of each channel, resulting in two-dimensional density variations across the radiator surface, sections of fins to be positioned in front of the ring-shaped high-pressure zone has a higher density than the section of fins away from the ring-shaped high-pressure zone.
-
公开(公告)号：US20220100242A1
公开(公告)日：2022-03-31
申请号：US17425632
申请日：2020-01-23
申请人： Asetek Danmark A/S
IPC分类号： G06F1/20
摘要： With increased demand for compact computing and easy to install computer components, there is an increased demand for user-friendly cooling solutions. Therefore, there is provided a cooling unit (100) for cooling liquid in a liquid-cooled computer system (10), wherein the cooling unit (100) comprises: an airflow unit (110) for generating an airflow in a first direction (170) along an airflow path, a radiator unit (130) having a liquid inlet (126) for receiving an inflow of a cooling liquid, a liquid outlet (127) for releasing an outflow of cooling liquid, an inner liquid path (171) for conducting liquid between said liquid inlet (126) and said liquid outlet (127), an array of at least two radiator bridges (131, 132), each having a plurality of parallel channels (160), said radiator bridges (131, 132) traversing said airflow path and being spaced apart along said first direction (170), said radiator bridges (131, 132) further being thermally separated from one another by gaps (141), where a first radiator bridge (131) from among said array of at least two radiator bridges (131, 132) is arranged to receive liquid from said liquid inlet (126, 127) to pass through its channels (160), said first radiator bridge (131) being the radiator bridge that is the farthest from said airflow unit (110), where said inner liquid path (171) is conducted from said liquid inlet (126), sequentially via said radiator bridges (131, 132) by order of proximity to said first radiator bridge (131), and to said liquid outlet (127), whereby a flow of air generated by said airflow unit (110) passes through said radiator bridges (131, 132) to exchange heat between said flow of air and said radiator unit (130). Thereby, a cooling unit is provided that provides efficient cooling while fitting into hitherto inconvenient form factors.
-
公开(公告)号：US11287861B2
公开(公告)日：2022-03-29
申请号：US16796073
申请日：2020-02-20
申请人： Asetek Danmark A/S
发明人： André Sloth Eriksen
摘要： A cooling system for a computer system comprises at least one unit such as a central processing unit (CPU) generating thermal energy and a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
-
公开(公告)号：US10078355B2
公开(公告)日：2018-09-18
申请号：US15626706
申请日：2017-06-19
申请人： Asetek Danmark A/S
发明人： André Sloth Eriksen
IPC分类号： F28F7/00 , G06F1/20 , H01L23/473 , F04D15/00 , H05K7/20
CPC分类号： G06F1/206 , F04D15/0066 , G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H05K7/20263 , H05K7/20272 , H01L2924/00
摘要： The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
-
5.发明授权公开(公告)号：US10021811B2
公开(公告)日：2018-07-10
申请号：US15163122
申请日：2016-05-24
申请人： Asetek Danmark A/S
CPC分类号： H05K7/20272 , G06F1/20 , G06F2200/201 , H05K7/20254 , H05K7/20772
摘要： A cooling module row for an inline-memory module is provided. The cooling module row may include an inlet chamber and an outlet chamber positioned at a same end of the cooling module row. The cooling module row may also include a conduit in fluid communication with the inlet chamber and the outlet chamber. The conduit may be sized to fit adjacent the in-line memory module. A method of heat management for an in-line memory module is also provided. The method may include positioning a cooling module row adjacent the in-line memory module, the cooling module row having an inlet chamber and an outlet chamber positioned at the same end of the cooling module row.
-
公开(公告)号：US09155230B2
公开(公告)日：2015-10-06
申请号：US13304813
申请日：2011-11-28
申请人： André Sloth Eriksen
发明人： André Sloth Eriksen
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/1488 , H05K7/20254 , H05K7/20263 , H05K7/20272 , H05K7/20772
摘要： Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold.
摘要翻译： 本公开的实施例可以包括用于冷却包括多个服务器模块的计算机服务器的系统。 该系统可以包括被配置为从多个服务器模块移除热量的第一冷却系统，第一冷却系统包括用于使第一冷却介质循环通过第一冷却系统的第一多个导管，配置成从第一冷却系统 所述第一冷却系统，所述第二冷却系统包括用于使第二冷却介质循环通过所述第二冷却系统的第二多个管道，以及配置成联接所述第一冷却系统和所述第二冷却系统的歧管，其中所述第一多个管道是 可拆卸地连接到歧管。
-
公开(公告)号：US12133359B2
公开(公告)日：2024-10-29
申请号：US18257286
申请日：2021-12-14
申请人： ASETEK DANMARK A/S
CPC分类号： H05K7/20263 , B21D53/022 , H05K7/20172
摘要： There is a need for better cooling solutions for the ever-increasing thermal density of computing systems. This is solved by providing a radiator (100) for a liquid cooling system for cooling a computing unit, the radiator comprising:—a first manifold (101) and a second manifold (102) having among them two liquid openings (103, 104) for connecting the radiator in a liquid loop, —channels (110) extending between the first manifold (101) and the second manifold (102) and providing parallel liquid paths between the manifolds (101, 102), —fin layers (130) sandwiched between sets of neighbouring channels (110) and extending between the first manifold (101) and the second manifold (102), —fastening means (120) for attaching a fan (10) to the radiator (100) in a predetermined position, determining a ring-shaped high-pressure zone (142) corresponding to an outer area of a fan radius (122) of an attached fan, where—at least one fin layer has a low-density section placed away from the high-pressure zone, and a high-density section being located in the high-pressure zone and having a higher fin density than the low-density section, —the density of the group of fin layers thereby varies both along the channels but also transverse of each channel, resulting in two-dimensional density variations across the radiator surface, sections of fins to be positioned in front of the ring-shaped high-pressure zone has a higher density than the section of fins away from the ring-shaped high-pressure zone.
-
公开(公告)号：US20230260419A1
公开(公告)日：2023-08-17
申请号：US18298001
申请日：2023-04-10
申请人： ASETEK DANMARK A/S
IPC分类号： G09B9/042
CPC分类号： G09B9/042
摘要： A steering wheel adapter system for an automotive simulator includes a first adapter element formed in a distal end of the steering wheel and a second adapter element formed in a proximal end of a steering axle of the automotive simulator. The first adapter element comprises a first electrical contact surface and the second adapter element comprises a second electrical contact surface. The first and second adapter elements are configured to slide against each other along a plane that is substantially perpendicular to the steering axle, until a coupling position has been reached wherein a central axis of the steering wheel is aligned with a central axis of the steering axle, and the first and second electrical contact surfaces make contact with each other to establish an electrical connection. A steering wheel having a first adapter element and a steering axle having a second adapter element are also described.
-
公开(公告)号：US20230145334A1
公开(公告)日：2023-05-11
申请号：US17969334
申请日：2022-10-19
申请人： ASETEK DANMARK A/S
IPC分类号： G09B9/042
CPC分类号： G09B9/042
摘要： A steering wheel adapter system for an automotive simulator includes a first adapter element formed in a distal end of the steering wheel and a second adapter element formed in a proximal end of a steering axle of the automotive simulator. The first adapter element comprises a first electrical contact surface and the second adapter element comprises a second electrical contact surface. The first and second adapter elements are configured to slide against each other along a plane that is substantially perpendicular to the steering axle, until a coupling position has been reached wherein a central axis of the steering wheel is aligned with a central axis of the steering axle, and the first and second electrical contact surfaces make contact with each other to establish an electrical connection. A steering wheel having a first adapter element and a steering axle having a second adapter element are also described.
-
公开(公告)号：US11287862B2
公开(公告)日：2022-03-29
申请号：US16796086
申请日：2020-02-20
申请人： Asetek Danmark A/S
发明人： André Sloth Eriksen
IPC分类号： F28F7/00 , G06F1/20 , H01L23/473 , F04D15/00 , H05K7/20
摘要： The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.
-
-
-
-
-
-
-
-
-
搜索结果
52 条记录 (耗时 0.021 秒)
