公开(公告)号：US20110081846A1

公开(公告)日：2011-04-07

申请号：US12573208

申请日：2009-10-05

申请人： Tai-Her YANG

发明人： Tai-Her YANG

IPC分类号： B24B23/02 ,  B24B47/00

CPC分类号： B24B23/028 ,  B24B47/12

摘要： The present invention relates to an internal rotation type direct motor-drive portable angle grinder. By means of the direct drive, the present invention prevents the emission of noise made by angle type transmission devices; and/or an inertial body is installed on the motor rotating part to form a flywheel to improve the grinding, polishing and machining or cutting abilities of the grinding wheel; and/or a motor is established to be open or semi-hermetic for the space from the interior to a housing and/or a handle of the motor to improve the effect of heat dissipation outward.

摘要翻译： 本发明涉及内旋式直接电动驱动便携式角磨机。 通过直接驱动，本发明防止由角型传动装置产生的噪声的发射; 和/或惯性体安装在马达转动部分上以形成飞轮，以改善砂轮的研磨，抛光和加工或切削能力; 和/或电动机被建立为从室内到电机的壳体和/或手柄的空间是开放的或半封闭的，以改善向外散热的效果。

公开(公告)号：US20090305614A1

公开(公告)日：2009-12-10

申请号：US11919422

申请日：2006-03-22

申请人： Michel Nauche ,  Gael Mazoyer

发明人： Michel Nauche ,  Gael Mazoyer

IPC分类号： B24B9/14 ,  B24B1/00 ,  B24B47/00 ,  B24D5/16

CPC分类号： B24B9/146 ,  B24B13/0057 ,  B24D5/16

摘要： A method of working the periphery of an ophthalmic lens (L), the periphery of the lens possessing an edge face (C) and the method including edging the edge face of the lens by machining with a first grindwheel (31) mounted to rotate about an axis of rotation (A4). According to the invention, during the edging, in addition to being free to rotate about the axis of rotation, the first grindwheel possesses two degrees of freedom to move in tilting about two distinct pivot directions that are substantially transverse to its axis of rotation.

摘要翻译： 一种加工眼镜片（L）周边的方法，具有边缘面（C）的镜片的周边，并且包括用第一磨轮（31）进行机加工而使透镜的边缘面磨边的方法， 旋转轴（A4）。 根据本发明，在边缘期间，除了围绕旋转轴线自由旋转之外，第一研磨轮具有两个自由度，以大致横向于其旋转轴线的两个不同的枢转方向倾斜地移动。

公开(公告)号：US20090142999A1

公开(公告)日：2009-06-04

申请号：US11950379

申请日：2007-12-04

申请人： Kung-Cheng LO

发明人： Kung-Cheng LO

IPC分类号： B24B41/00 ,  B24B47/00

CPC分类号： B24B9/06 ,  B24B27/0061

摘要： A tool holder transmission structure of a stone chamfering machine which is mainly characterized in that a transmission motor is installed at downward offset position inside the frame of the stone chamfering machine, whereof the transmission gear installed on the spindle of the said motor is through the bottom cut slot of the centered convex block at side plate of the frame to engage with the bottom tool driven gear of the multi-axis tool holder, whereby through rotation of the tool holder, different tool driven gear can be changed to engage with the motor transmission gear. Therefore, it is particularly useful to select different tools for stone chamfering operation according to practical needs.

摘要翻译： 一种石材倒角机的工具架传动结构，其主要特征在于，传动马达安装在石材倒角机框架内的向下偏移位置，安装在所述马达的主轴上的传动齿轮通过底部 在框架的侧板处的中心凸块的切槽与多轴工具架的底部工具从动齿轮接合，由此通过工具架的旋转，可以改变不同的工具从动齿轮以与电机传动 齿轮。 因此，根据实际需要选择不同的石材倒角工具特别有用。

公开(公告)号：US20060135047A1

公开(公告)日：2006-06-22

申请号：US11021194

申请日：2004-12-22

申请人： Alexei Sheydayi

发明人： Alexei Sheydayi

IPC分类号： B24B7/30 ,  B24B29/00 ,  B24B47/00

CPC分类号： H01L21/67057 ,  H01L21/02101 ,  H01L21/6838

摘要： Pressure biased wafer holding of a semiconductor wafer is provided for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is applied to high pressure systems. Adverse effects of high pressure biases are prevented by a valve arrangement that reduces or limits the holding load on a wafer. Check valves and on-off valves connected to input and output lines to the chamber bias fluid applied to a wafer supporting platen to vary the backside pressure so that the excess of frontside pressure versus backside pressure on the wafer is kept within an effective clamping range without excessive force being applied to the wafer. Use of fluid-mechanical techniques is maximized in certain described embodiments to avoid disadvantages of electronic control systems.

摘要翻译： 提供半导体晶片的偏压晶片保持用于高压处理。 在加工过程中使用真空吸附夹持半导体晶片被应用于高压系统。 通过减少或限制晶片上的保持负载的阀装置来防止高压偏压的不利影响。 连接到输入和输出管线的止回阀和开关阀连接到施加到晶片支撑压板上的室偏压流体，以改变背侧压力，使得晶片上的前侧压力与背侧压力之间的过量保持在有效钳位范围内，而不需要 过大的力被施加到晶片上。 在某些描述的实施例中使用流体 - 机械技术最大化，以避免电子控制系统的缺点。

公开(公告)号：US06881136B1

公开(公告)日：2005-04-19

申请号：US10697292

申请日：2003-10-31

申请人： Po Chang Chuang

发明人： Po Chang Chuang

IPC分类号： B24B21/04 ,  B24B47/00 ,  B24B21/00

CPC分类号： B24B21/04 ,  B24B47/00

摘要： A grinding-band swaying device for a band grinding machine includes a motor pivotally connected with a machine base and driving an endless grinding band around two rollers and forming a fulcrum for swaying, a speed-reducing unit and an eccentric wheel. The speed-reducing unit is positioned under the motor, having a shaft connected with the eccentric wheel. An elastic compressing unit is provided between the speed-reducing unit or the motor and the machine base, and then the eccentric wheel is kept to elastically urge the machine base. When the motor together with the speed-reducing unit rotates the eccentric wheel, the speed-reducing unit, the motor and the roller sway regularly with the fulcrum and then the endless grinding band moves forward and also sways regularly synchronously to perform grinding against a work with grinding angles constantly altered to achieve balanced grinding result.

摘要翻译： 用于带磨床的磨带摇摆装置包括与机座枢转连接的马达，并围绕两个滚筒驱动环形研磨带，并形成摆动支点，减速单元和偏心轮。 减速单元位于马达下方，具有与偏心轮连接的轴。 在减速单元或马达与机座之间设置弹性压缩单元，然后使偏心轮弹性推动机座。 当电动机与减速单元一起旋转偏心轮时，减速单元，电动机和滚子与支点规则地摇摆，然后环形研磨带向前移动，并且同步地同步地摆动以对工作进行研磨 研磨角度不断变化，实现平衡磨削效果。

公开(公告)号：US6106379A

公开(公告)日：2000-08-22

申请号：US396541

申请日：1999-09-15

申请人： Joseph Mosca

发明人： Joseph Mosca

IPC分类号： B24B37/04 ,  B24B41/06 ,  B24B29/00 ,  B24B47/00

CPC分类号： B24B37/30

摘要： A carrier assembly includes an internal pressurized fluid circuit applying positioning forces to a ring extension. Also included is an internal diaphragm having a flexible portion providing gimbal action for the carrier assembly. The pressure between the diaphragm and a pressure plate changes the surface curvature of the pressure plate in a controlled manner. An automatic ring extension is also provided.

摘要翻译： 载体组件包括将定位力施加到环延伸部的内部加压流体回路。 还包括具有为载体组件提供万向动作的柔性部分的内隔膜。 隔膜和压板之间的压力以受控的方式改变压板的表面曲率。 还提供自动环扩展。

公开(公告)号：US06102788A

公开(公告)日：2000-08-15

申请号：US294677

申请日：1999-04-19

申请人： Mitsuyoshi Uto

发明人： Mitsuyoshi Uto

IPC分类号： B24B37/04 ,  B24B37/30 ,  H01L21/683 ,  B24B47/00

CPC分类号： B24B37/30 ,  H01L21/6838

摘要： A stage is provided with pressing holes arranged circumferentially and suctioning holes arranged circumferentially to be close to the outer peripheral edge side compared to the pressing holes. A cavity connected to these pressing holes and suctioning holes is provided within a wafer holder. In addition, first filters, which allow a gas to flow from the cavity side to the wafer holding surface side, are arranged between the pressing holes and the cavity. Second filters, which allow a gas to flow only from the wafer holding surface side to the cavity side, are arranged between the suctioning holes and the cavity.

摘要翻译： 在台阶上设有周向布置的按压孔，与按压孔相比外周边缘侧布置的吸孔。 连接到这些按压孔和抽吸孔的空腔设置在晶片保持器内。 此外，允许气体从空腔侧流动到晶片保持表面侧的第一过滤器布置在挤压孔和空腔之间。 允许气体仅从晶片保持表面侧流到空腔侧的第二过滤器布置在吸入孔和空腔之间。

公开(公告)号：US6093091A

公开(公告)日：2000-07-25

申请号：US207735

申请日：1998-12-08

申请人： Thomas Keller

发明人： Thomas Keller

IPC分类号： B24B37/32 ,  B25B11/00 ,  H01L21/304 ,  B24B47/00

CPC分类号： B24B37/32 ,  B25B11/005

摘要： A holder for flat subjects, in particular semiconductor wafers, in particular in a device for the chemical-mechanical polishing of semiconductor wafers, with a plate-like head which can be connected on the upper side to a height adjustable spindle and at the lower side comprises a holding plate which is coupled to a carrier section arranged above the holding plate via a universal joint and which comprises a number of vertical bores which extend to the lower side of the plate and can be connected to a vacuum and/or a fluid source, wherein the holding plate is height adjustably guided in the carrier section, between the carrier section and the holding plate there is arranged an annular closed membrane within which there is formed an essentially air-tightly closed inner space which can be selectively connected to atmosphere or vacuum or to a pressure source.

摘要翻译： 用于扁平主体，特别是半导体晶片的保持器，特别是用于半导体晶片的化学机械抛光的装置中，具有可以在上侧连接到高度可调主轴并且在下侧的板状头 包括保持板，该保持板通过万向接头连接到设置在保持板上方的托架部分上，托架部分包括多个垂直孔，其延伸到板的下侧，并可连接到真空和/或流体源 其特征在于，所述保持板在所述承载部中被可调节地引导，在所述承载部和所述保持板之间设置有环状的封闭膜，在所述环状的封闭膜中形成有基本上气密的内部空间，所述内部空间可选择性地连接到大气或 真空或压力源。

公开(公告)号：US5443416A

公开(公告)日：1995-08-22

申请号：US119972

申请日：1993-09-09

申请人： Konstantine Volodarsky ,  Jiro Kajiwara ,  Herbert W. Owens, Jr. ,  Jan H. King

发明人： Konstantine Volodarsky ,  Jiro Kajiwara ,  Herbert W. Owens, Jr. ,  Jan H. King

IPC分类号： B24B37/005 ,  B24B37/30 ,  B24B37/34 ,  B24B47/00

CPC分类号： B24B37/345 ,  B24B37/0053 ,  B24B37/30

摘要： Device and method are described that reduce the force needed to release a wafer from a wet polishing surface after polishing. Device comprises attachment, such as a wafer carrier, adapted to be mounted to a polishing apparatus to permit attachment surface, configured to mate with two regions of the wafer, to tilt relative to polishing surface. Means for defining adhesive force between attachment surface and one of the two wafer regions, and means for defining adhesive force between attachment surface and other of the two wafer regions which is different than that defined between attachment surface and the one wafer region so as to cause a non-parallel relationship between the one wafer face and polishing surface, are provided. Unbalanced force, such as a vacuum force communicated to a limited region of the surface of the carrier, causes a non-parallel relationship between wafer and polishing pad and facilitates separation and lifting of wafer from polishing surface. Some embodiments include a mechanical lifting force to actively tilt the wafer surface. A rotary union device for use with a polishing apparatus is described that continuously communicates a fluid between a nonrotating fluid source and a fluid chamber enclosed within a rotatable polishing head portion of the polishing apparatus. Independent pressure chambers for controlling polishing pressure and adhesion of the wafer may be provided.

摘要翻译： 描述了在抛光之后减少从湿抛光表面释放晶片所需的力的装置和方法。 设备包括诸如晶片载体的附接件，其适于安装到抛光设备以允许被配置为与晶片的两个区域配合的附接表面相对于抛光表面倾斜。 用于限定附接表面和两个晶片区域中的一个之间的粘合力的装置，以及用于限定附着表面与两个晶片区域中的其它晶片区域之间的粘合力的装置，其不同于在附接表面和一个晶片区域之间限定的粘合力，从而导致 提供了一个晶片表面和抛光表面之间的非平行关系。 不平衡力，例如传递到载体表面的有限区域的真空力，导致晶片和抛光垫之间的非平行关系，并且促进晶片从抛光表面的分离和提升。 一些实施例包括用于主动倾斜晶片表面的机械提升力。 描述了一种用于抛光装置的旋转联接装置，其将非旋转流体源和包围在抛光装置的可旋转抛光头部分内的流体室之间的流体连续地连通。 可以提供用于控制抛光压力和晶片粘附的独立压力室。

公开(公告)号：US5367836A

公开(公告)日：1994-11-29

申请号：US882947

申请日：1992-05-14

申请人： Kenneth H. Allen

发明人： Kenneth H. Allen

IPC分类号： B24B3/26 ,  B24B41/00 ,  B24B47/00

CPC分类号： B24B3/26 ,  B24B41/005

摘要： An automatic drill loader is used with a drill grinding machine to automatically present drills to the drill grinding machine workhead for being ground thereat and to carry ground drills to a storage receptacle. The automatic drill loader comprises a magazine, a timing station, and two sets of grippers. The magazine stores a quantity of drills, which may have stepped shanks. The magazine is adjustable to suit drills of different lengths and diameters. The magazine presents one drill at a time to a staging station. A load gripper grips the drill at the staging station and conveys it to the timing station, whereat the drill is linearly and angularly oriented. The load gripper then transports the drill to the drill grinding machine workhead. Simultaneously, an unload gripper carries a ground drill from the drill grinding machine workhead to the storage receptacle. After the load gripper has transported the timed drill to the drill grinding machine workhead, the load gripper returns to the staging station to grip another drill. Simultaneously, the unload gripper returns to the workhead to grip and remove the finished ground drill thereat. The cycle continues automatically until all the drills in the magazine are ground.

摘要翻译： 自动钻机装载机与钻磨机一起使用，以自动将钻头钻到钻床研磨机的工作头上，以便在地面上进行磨削，并将钻孔钻进存储容器。 自动钻机装载机包括一个仓库，一个定时站和两套夹具。 该杂志存储了一些可能有台阶的演习。 杂志可调，适合不同长度和直径的演习。 这本杂志每次都有一次演习到一个舞台。 负载夹具在分段站处握住钻头，并将其传送到定时站，钻头线性和角度定向。 然后，装载夹具将钻头运送到钻头研磨机工作头。 同时，卸载夹持器将钻孔钻机从钻头研磨机工作头运送到存储容器。 在装载夹具将定时钻头运送到钻头磨床工作头之后，负载夹具返回到分段站以夹紧另一个钻孔。 同时，卸载夹具返回到工作头，以抓住并移除其上的完成的地面钻孔。 该循环将自动继续，直到杂志中的所有钻头都被磨碎为止。