公开(公告)号：US5297969A

公开(公告)日：1994-03-29

申请号：US69465

申请日：1993-06-01

Applicant: David A. Mantell

Inventor： David A. Mantell

IPC: H01B5/14 ,  H01L21/48 ,  H01L23/498 ,  H01R11/01 ,  H01R13/03 ,  H01R29/00 ,  H01R43/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/00

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01R13/03 ,  H05K3/105 ,  H05K3/4092 ,  H01L2924/0002 ,  H01R29/00 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2203/107 ,  H05K2203/1136 ,  H05K3/403 ,  Y10S428/901 ,  Y10T29/49144 ,  Y10T29/49162 ,  Y10T29/49224

Abstract: An electrically connectable module is manufactured from a substrate of an electrically insulating polymer matrix doped with an electrically insulating fibrous filler capable of heat conversion to an electrically conductive fibrous filler to form a fiber-doped substrate. One end of an electrical connector is embedded in the fiber-doped substrate to locate the one end adjacent the surface of the substrate while exposing an opposite end of the electrical connector. The surface of the fiber-doped substrate is locally heated preferably with a laser to form a conductive trace by the in-situ heat conversion of the electrically insulating fibrous filler, the localized heating including the one end of the electrical connector to electrically connect the electrical connector to the conductive trace. In another embodiment, a conductive material is electrodeposited on the conductive trace by applying a voltage to the opposite end of the electrical connector. The substrate is molded into a desired shape to form the module, and a plurality of electrical connectors can be embedded into the substrate in any one of several different standardized arrangements.

Abstract translation: 可电连接的模块由掺杂有能够热转化成导电纤维填料的电绝缘纤维填料的电绝缘聚合物基体的基底制成，以形成纤维掺杂的基底。 电连接器的一端嵌入在光纤掺杂衬底中，以将一端邻近衬底的表面定位，同时露出电连接器的相对端。 纤维掺杂衬底的表面优选地通过激光局部加热，以通过电绝缘纤维填料的原位热转化形成导电迹线，局部加热包括电连接器的一端以将电气 连接器到导电迹线。 在另一个实施例中，通过向电连接器的相对端施加电压，将导电材料电沉积在导电迹线上。 将基板模制成所需的形状以形成模块，并且多个电连接器可以以几种不同的标准化布置中的任何一种嵌入到基板中。

公开(公告)号：US5182230A

公开(公告)日：1993-01-26

申请号：US223487

申请日：1988-07-25

Applicant: John J. Donelon ,  James P. Doyle ,  Jerry E. Hurst, Jr. ,  Modest M. Oprysko ,  Stephen M. Rossnagel ,  Robert J. von Gutfeld

Inventor： John J. Donelon ,  James P. Doyle ,  Jerry E. Hurst, Jr. ,  Modest M. Oprysko ,  Stephen M. Rossnagel ,  Robert J. von Gutfeld

IPC: H05K3/46 ,  H01L21/48 ,  H01L21/768 ,  H05K3/10 ,  H05K3/18 ,  H05K3/22

CPC classification number: H05K3/225 ,  H01L21/4846 ,  H01L21/76894 ,  H05K2203/107 ,  H05K2203/1136 ,  H05K2203/173 ,  H05K3/182

Abstract: The present invention relates to a method of accessing and repairing electrical opens in conducting metal lines on a semiconductor chip or other substrate using laser plating techniques. What has been described is a maskless means of repairing discontinuities in a conductor disposed on the surface of a substrate wherein the surface is locally irradiated to form a reversible carbonaceous layer thereon. This reversible carbonaceous layer acts as a base for electrodeless deposition of a metal to form a bridge across the discontinuity by laser-enhanced exchange plating or other suitable methods. Further, a means of accessing and repairing a discontinuity buried by a cover layer of an insulating or passivating material is described, wherein access to the discontinuity is provided by ablating away the cover layer using a pulsed excimer laser at a first power level.

公开(公告)号：US4797530A

公开(公告)日：1989-01-10

申请号：US939969

申请日：1986-12-10

Applicant: Nobuo Iwase

Inventor： Nobuo Iwase

IPC: H01L23/12 ,  C04B41/00 ,  C04B41/53 ,  C04B41/80 ,  C04B41/91 ,  H05K3/10 ,  B23K26/00

CPC classification number: C04B41/009 ,  C04B41/0036 ,  C04B41/53 ,  C04B41/80 ,  C04B41/91 ,  H05K3/105 ,  C04B2111/00844 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49171 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49155

Abstract: A ceramic circuit substrate can be manufactured by a method comprising the steps of (i) providing an electrically insulating ceramic substrate; and (ii) irradiating a predetermined region of said ceramic substrate with an energy beam such that at least a portion of said region is rendered conductive.

Abstract translation: 陶瓷电路基板可以通过包括以下步骤的方法制造：（i）提供电绝缘陶瓷基板; 和（ii）用能量束照射所述陶瓷衬底的预定区域，使得所述区域的至少一部分变得导电。