Abstract:
A method of continuously sequentially coating polyamide filaments with copper and silver which utilizes as a key step in the process the use of a wetter solution containing alcohol, a detergent and an ethylene oxide and propylene oxide copolymer surfactant. The filaments are in the form of multi-filament tows, roving, woven tape or fabric and the steps involve immersing the filaments in a sodium hydroxide trisodium phosphate cleaning solution, followed by a water rinse and then immersion in the wetter solution, followed by water rinse and then followed by a conventional commercial pre-activator, then a commercial palladium chloride/stannous chloride catalytic activator, followed by commercial autocatalytic copper plating as a first copper plating step, followed by a subsequent copper plating step from a copper cyanide bath, followed by a conventional silver plating step, with appropriate water rinses after each of the plating steps, and finally with an alcohol rinse and drying.
Abstract:
This invention relates to an instant silvering solution that does not require the use of applied electrical current for plating the surfaces of copper and copper-based metal electrical connections and contacts. It is particularly designed for the application to these copper and copper-based metal surfaces for the purposes of reducing electrical resistance and the resulting heating created, caused by the build-up of copper oxide on these surfaces.
Abstract:
A plating bath for plating gold on zirconium or titanium metal by the chemical displacement method comprising a soluble gold salt, a salt for attacking the metal oxide dioxide and a stabilizing agent. A cleaning bath containing fluorides and a method of use of both cleaning bath and plating bath are described. The plated articles are suitable for use as storage battery grids.
Abstract:
THE INVENTION IS DIRECTED TO A METHOD OF BONDING GOLD TO A MOLYBDENUM SUBSTRATE BBY MEANS OF AN INTERMEDIATE LAYER OF MOLYBDENUM OXIDE. THE INTERMIDIATE LAYER IS FORMED DURING THE PLATING OF THE GOLD AND MAY BE SUBSEQUENTLY REDUCED TO PURE MOLYBDENUM TO FORM A DISTRICT BOND.
Abstract:
ELECTROLESS PLATING SOLUTIONS CONTAINING SILVER CATIONS, WHICH HERETOFORE HAVE BEEN PLAGUED BY LIMITED POT LIFE AND BY THE PRECIPITATION OF DARK PRECIPITATES DURING USE, ARE STABILIZED BY THE INCLUSION THEREIN OF A PERSULFATE, PARTICULARLY AMMONIUM PERSULFATE.