-
公开(公告)号:US11834554B2
公开(公告)日:2023-12-05
申请号:US17048335
申请日:2019-04-24
申请人: THREEBOND CO., LTD.
发明人: Satoru Endo , Hitoshi Mafune , Takashi Suzuki
IPC分类号: C08G77/12 , C08G77/08 , C08G77/20 , C08G77/00 , C08K3/08 , C08K5/541 , C08K7/18 , C08L83/04 , H01B1/22
CPC分类号: C08G77/12 , C08G77/08 , C08G77/20 , C08G77/70 , C08K3/08 , C08K5/541 , C08K7/18 , C08L83/04 , H01B1/22 , C08K2003/0806 , C08K2201/001
摘要: An object of the present invention is to provide a conductive silicone composition that is cured at a low temperature in a short time and from which a cured product having excellent conductivity can be obtained.
A conductive silicone composition containing (A) to (E) components described below and containing greater than or equal to 10 parts by mass and less than 100 parts by mass of the (D) component with respect to 100 parts by mass of the (A) component:
(A) component: a polyorganosiloxane having one or more alkenyl groups in a molecule
(B) component: a compound having a hydrosilyl group
(C) component: a hydrosilylation catalyst
(D) component: a silane compound having an epoxy group and an alkoxysilyl group
(E) component: a conductive powder.-
公开(公告)号:US20230331904A1
公开(公告)日:2023-10-19
申请号:US18245597
申请日:2021-08-31
申请人: THREEBOND CO., LTD.
发明人: Jyunya IWASAWA
CPC分类号: C08G59/38 , C08G59/4064 , C08G59/5006 , C08K7/18 , C08L63/00 , C08G2170/00 , C08G2190/00
摘要: An epoxy resin has excellent adhesiveness to different materials. An epoxy resin composition includes the following (A) to (E): (A) a compound with an epoxy equivalent of less than 210 g/eq. that is liquid at 25° C. and has two or more epoxy groups in one molecule, (B) (B-1) a compound with an epoxy equivalent of 210 g/eq. or more that is liquid at 25° C. and has two or more epoxy groups in one molecule and/or (B-2) a compound that is solid at 25° C. and has two or more epoxy groups in one molecule, (C) a thiol curing agent, (D) a latent curing agent, and (E) a reactive diluent.
-
公开(公告)号:US20230279218A1
公开(公告)日:2023-09-07
申请号:US18016562
申请日:2021-08-10
申请人: THREEBOND CO., LTD.
发明人: Kana YASUNAGA , Tatsuya MORITOKI , Eiji SHIMOKAWA
IPC分类号: C08L63/00 , C08K7/20 , C08J3/28 , C09J163/00
CPC分类号: C08L63/00 , C08K7/20 , C08J3/28 , C09J163/00 , C08L2205/03 , C08J2363/00
摘要: Provided is an epoxy resin composition that, although it can be cured even at a low temperature, can form a cured product having excellent impact resistance and has excellent adhesive strength. Specifically, provided is an epoxy resin composition containing: (A) an epoxy resin which is liquid at 25° C.; (B) an epoxy resin which is solid at 25° C.; (C) a rubber-modified epoxy resin (excluding the (A) and the (B)); (D) a blocked urethane resin; (E) a spherical inorganic filler having an average particle size of 0.1 μm to 150 μm; (F) an organic filler; and (G) a latent curing agent.
-
84.
公开(公告)号:US20230270659A1
公开(公告)日:2023-08-31
申请号:US18005585
申请日:2021-07-05
申请人: THREEBOND CO., LTD.
发明人: Yumi MORIKAWA , Takanori WACHI
IPC分类号: A61K8/87 , C08F290/06 , C09D151/08 , A61K8/81 , A61K8/86 , A61Q3/02
CPC分类号: A61K8/87 , C08F290/067 , C09D151/08 , A61K8/8147 , A61K8/86 , A61Q3/02 , A61K2800/95
摘要: A photocurable resin composition for a nail or an artificial nail can form a cured product that has excellent transparency and gloss while having hardness required for coating a nail or an artificial nail. The photocurable resin composition for a nail or an artificial nail contains components (A) to (D): component (A): a urethane (meth)acrylate oligomer, component (B): a compound having three or more (meth)acryloyl functional groups (excluding the component (A)), component (C): a compound having a molecular weight of 200 or less and having a hydroxyl group and a methacryloyl group (excluding the components (A) and (B)), and component (D): a photoinitiator.
-
公开(公告)号:US20230040887A1
公开(公告)日:2023-02-09
申请号:US17758996
申请日:2021-01-27
申请人: THREEBOND CO., LTD.
发明人: Shogo HASHIMOTO , Hiroaki ITO , Manabu KIRINO
摘要: A detergent composition has high detergency and reduced erosivity with respect to resins. The detergent composition contains the following component (A) and component (B) A mass ratio of the component (A) to the component (B) is expressed as component (A): component (B)=40:60 to 55:45:
component (A): 1-chloro-3,3,3-trifluoropropene
component (B): a hydrofluoroolefin of the following general formula: CnF2n−1—O—CmH2m+1. n is an integer of 5 to 10, and m is an integer of 1 to 5.-
公开(公告)号:US11512206B2
公开(公告)日:2022-11-29
申请号:US16764610
申请日:2018-12-04
申请人: Threebond Co., Ltd.
发明人: Erika Washino
IPC分类号: C09D5/02 , C09D125/14 , F16B33/00 , C08K7/02 , C08L77/06 , C09D133/08 , C09D133/10
摘要: A sealant for screwing members contains: (a) a self-cross-linking aqueous emulsion; (b) a nanofiberized aramid fiber substance; and (c) a film-forming aid containing a mixture. The mixture contains a compound represented by formula 1: CH3O—(CH2CH2O)n—H. In formula 1, n is 4 or more. An equilibrium reflux boiling point of the overall mixture is 280° C. or higher.
-
公开(公告)号:US20220372292A1
公开(公告)日:2022-11-24
申请号:US17754414
申请日:2020-08-21
申请人: THREEBOND CO., LTD.
发明人: Satoru ENDO , Mirei MOTOMATSU
摘要: A conductive resin composition has low-temperature curability and is excellent in resistance stability during stretching. A conductive resin composition contains: (A) a polyorganosiloxane having an alkenyl group, (B) a polyorganosiloxane having a specific structure, (C) a conductive particle, (D) a compound having a hydrosilyl group, and (E) a hydrosilylation catalyst. The content of the component (B) is 6 to 50 parts by mass based on 100 parts by mass of the component (A).
-
公开(公告)号:US20220323985A1
公开(公告)日:2022-10-13
申请号:US17754197
申请日:2020-09-18
申请人: THREEBOND CO., LTD.
发明人: Naoya SAITO , Takuma KADO
摘要: A dispensing apparatus includes: a storage unit including a first flow path, a second flow path, and a third flow path; and a movable member including a first part, and a second part. The first part and the second part are formed in a long shape, and the second part is formed such that a cross-section crossing the longitudinal direction is smaller than that of the first part.
-
公开(公告)号:US11446696B2
公开(公告)日:2022-09-20
申请号:US16964412
申请日:2018-12-14
申请人: THREEBOND CO., LTD.
发明人: Ryota Suzuki , Naoya Saito
摘要: Technical Problem Provide is a discharge device capable of easily controlling an operation of a plunger at the time of supplying a viscous material to a cylinder and a liquid supply method capable of forming a desired overlap portion.
Solution to Problem The discharge device 10 includes the supply valve 40 which controls the supply of the viscous material M to the cylinder 30, the plunger 50 which applies a pressure to the viscous material supplied to the cylinder, the ball screw 60 which is movable in the same direction as the back-and-forth direction of the plunger, and the motor 120 which is connected to the ball screw through the power transmission mechanism 110, wherein the plunger and the ball screw are not connected.-
公开(公告)号:US11414512B2
公开(公告)日:2022-08-16
申请号:US16604290
申请日:2018-04-13
申请人: THREEBOND CO., LTD.
发明人: Tetsunori Soga
IPC分类号: C08F290/04 , C09J151/06 , H01M8/0273 , H01M8/0284 , H01M8/10
摘要: The present invention aims to provide a photocurable resin composition which rapidly cures by irradiation with active energy rays such as ultraviolet rays and is excellent in adhesion to an electrolyte membrane which is a hard-to-bond material. A photocurable resin composition includes the following ingredients (A) to (C): ingredient (A): a polymer having one or more (meth)acryloyl groups and having a polyisobutylene skeleton containing a —[CH2C(CH3)2]— unit, ingredient (B): a photoradical polymerization initiator, and ingredient (C): a compound having a (meth)acryloyl group and a cationic polymerizable functional group in one molecule.
-
-
-
-
-
-
-
-
-