FAILURE DETECTION AND CORRECTION FOR LED ARRAYS

    公开(公告)号:US20230007751A1

    公开(公告)日:2023-01-05

    申请号:US17785360

    申请日:2020-12-16

    申请人: Lumileds LLC

    摘要: A micro light-emitting diode (μLED) array system can include an image post processor configured to translate received image data to pulse width modulation (PWM) and/or analog current control data, an input frame buffer configured to receive the control data, a plurality of individually controllable μLEDS of a μLED array, a return frame buffer that receives data indicating a μLED electrical output characteristic including an output current, and compare circuitry configured to compare image data from the input and return frame buffers, and transfer comparison data to the image post processor, the image post processor configured to alter individual μLED control data based on the comparison data.

    CURRENT CONTROL FOR LED PIXEL ARRAYS

    公开(公告)号:US20220418069A1

    公开(公告)日:2022-12-29

    申请号:US17777916

    申请日:2020-11-20

    申请人: Lumileds LLC

    发明人: Zhi Hua Song

    IPC分类号: H05B45/325 H05B45/14

    摘要: A light-emitting diode (LED) array includes an array of pixel assemblies and a pulse width modulator. The pulse width modulator generates pulse width modulation (PWM) signals for controlling a duty cycle of each of the pixels. The pixel assemblies each include an LED, a switching circuit, and a close loop circuit. The switching circuit receives a PWM signal and alternately turns on and off the LED based on the PWM signal. The close loop circuit regulates an LED current provided by the switching circuit to the LED based on a feedback signal received from the switching circuit.

    Nano-photonics reflector for LED emitters

    公开(公告)号:US11532766B2

    公开(公告)日:2022-12-20

    申请号:US17246398

    申请日:2021-04-30

    申请人: LUMILEDS LLC

    摘要: A system, method and device for use as a reflector for a light emitting diode (LED) are disclosed. The system, method and device include a first layer designed to reflect transverse-electric (TE) radiation emitted by the LED, a second layer designed to block transverse-magnetic (TM) radiation emitted from the LED, and a plurality of ITO layers designed to operate as a transparent conducting oxide layer. The first layer may be a one-dimension (1D) distributed Bragg reflective (DBR) layer. The second layer may be a two-dimension (2D) photonic crystal (PhC), a three-dimension (3D) PhC, and/or a hyperbolic metamaterial (HMM). The 2D PhC may include horizontal cylinder bars, vertical cylinder bars, or both. The system, method and device may include a bottom metal reflector that may be Ag free and may act as a bonding layer.

    Control design for perceptually uniform color tuning

    公开(公告)号:US11523482B2

    公开(公告)日:2022-12-06

    申请号:US17118332

    申请日:2020-12-10

    申请人: Lumileds LLC

    发明人: Yifeng Qiu

    IPC分类号: H05B45/20

    摘要: Various embodiments include apparatuses and methods control apparatus to color tune a light-emitting diode (LED) array. In one specific example, a control apparatus to color tune a light-emitting diode (LED) array for perceptually uniform color-tuning is disclosed. The apparatus includes a correlated color temperature (CCT)-control device that is adjustable by an end-user to a desired color temperature of the LED array and producing an output signal corresponding to the desired color temperature. A storage device is electrically coupled to the CCT-control device to correlate a mechanical movement range of the CCT-control device to provide substantially uniform increases in perceptual CCT values from the LED array based on a set of N predetermined values. Other apparatuses and methods are described.

    HEATSINK WITH PROTRUDING PINS AND METHOD OF MANUFACTURE

    公开(公告)号:US20220373156A1

    公开(公告)日:2022-11-24

    申请号:US17748694

    申请日:2022-05-19

    申请人: LUMILEDS LLC

    摘要: A heatsink, a light-emitting diode (LED) module and a corresponding method of manufacture are described. A heatsink includes an electrically conductive heatsink core and an electrically insulating layer covering at least the first surface of the electrically conductive heatsink core. The electrically conductive heatsink core has a first pin that is integral with the electrically conductive heatsink core and protrudes from a first surface of the heatsink core. At least the first surface of the heatsink core is covered by an electrically insulating layer, which leaves at least portions of a lateral surface of the first pin exposed from the electrically insulating layer.