公开(公告)号：US11083055B2

公开(公告)日：2021-08-03

申请号：US16456862

申请日：2019-06-28

申请人： Lumileds LLC

发明人： Ronald Bonne ,  Udo Karbowski

IPC分类号： H05B45/10 ,  B60Q1/14

摘要： A LED controller for an LED pixel array includes an image frame buffer to receive image data and a standby image buffer connected to the image frame buffer to hold a standby image. A command and control module connected is configured to substitute the standby image in the standby image buffer for the image in the image frame buffer when image data is unavailable.

公开(公告)号：US10932336B2

公开(公告)日：2021-02-23

申请号：US16456858

申请日：2019-06-28

申请人： Lumileds LLC

发明人： Ronald Bonne ,  Udo Karbowski

IPC分类号： H05B45/10 ,  B60Q1/14

摘要： A LED controller for an LED pixel array includes a serial interface to an external data bus, along with an address generator connected to the serial interface and the LED pixel array. An image frame buffer is connected to the interface to receive image data and further connected to the address generator to receive an image frame buffer address. A command and control module is connected to the serial interface and configured to modify image frame buffer output signals. A calibration data storage module is connected to the command and control module to store calibration data related to pixel voltage response in the LED pixel array.

公开(公告)号：US10670250B2

公开(公告)日：2020-06-02

申请号：US16228022

申请日：2018-12-20

申请人： Lumileds LLC

发明人： Ronald Bonne

IPC分类号： F21V23/02 ,  F21V23/06 ,  F21V29/50 ,  H05B33/08 ,  H05K1/18 ,  H05K7/20 ,  F21V23/00 ,  F21K9/90 ,  F21V15/01 ,  F21K9/20 ,  F21V29/70 ,  H05B45/10 ,  H05B47/18 ,  F21Y115/10 ,  H05B45/00

摘要： Chip-on-board (COB) modular lighting systems and methods of manufacture are described herein. A system includes a COB assembly including a thermally conductive plate and a COB light-emitting diode (LED) device thermally coupled to the thermally conductive plate. The COB LED device includes multiple LED chips disposed on a surface of a substrate. The substrate includes first electrical power contacts exposed from at least the surface. The system further includes an electronics board that has second electrical power contacts. The electronics board is attached to the COB assembly such that the first and second electrical contacts are electrically coupled and the thermally conductive plate is attached to the electronics board.

公开(公告)号：US11476217B2

公开(公告)日：2022-10-18

申请号：US16814024

申请日：2020-03-10

申请人： Lumileds LLC

发明人： Michael Deckers ,  Tze Yang Hin ,  Ronald Bonne

IPC分类号： G02F1/1345 ,  H01L23/52 ,  H01L21/50 ,  H01L27/12 ,  G02F1/1362 ,  G02F1/1368 ,  H01L23/00 ,  H01L23/498 ,  H01L25/075 ,  H01L27/02 ,  H01L27/15

摘要： A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.

公开(公告)号：US11092321B2

公开(公告)日：2021-08-17

申请号：US16866066

申请日：2020-05-04

申请人： Lumileds LLC

发明人： Ronald Bonne

IPC分类号： F21V23/00 ,  H05K7/20 ,  H05K1/18 ,  F21V23/02 ,  F21V29/50 ,  F21V23/06 ,  F21K9/90 ,  F21V15/01 ,  F21K9/20 ,  F21V29/70 ,  H05B45/10 ,  H05B47/18 ,  F21Y115/10 ,  H05B45/00

摘要： Systems are described herein. A system includes a thermally conductive plate and multiple light-emitting devices (LEDs) on a surface of a substrate. The substrate is thermally coupled to the thermally conductive plate and includes first electrical power contacts on the surface. The system also includes an electronics board having second electrical power contacts. The electronics board is on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.

公开(公告)号：US11164287B2

公开(公告)日：2021-11-02

申请号：US16456849

申请日：2019-06-28

申请人： Lumileds LLC

发明人： Ronald Bonne ,  Jyoti Kiron Bhardwaj

IPC分类号： G06K9/54 ,  G06T3/40 ,  G09G3/20 ,  H05B45/50 ,  F21S41/141 ,  H05B45/00 ,  H05B47/105 ,  F21V23/04

摘要： A LED controller includes a power distribution module and an interface to an external data bus. An image frame buffer is connected to the interface to receive image data. A separate logic module is connected to the interface and configured to modify image frame buffer output signals sent to an LED pixel array connected to the image frame buffer. The LED pixel array can project light according to a pattern and intensity defined at least in part by the image held in the image frame buffer.

公开(公告)号：US20210288008A1

公开(公告)日：2021-09-16

申请号：US16814024

申请日：2020-03-10

申请人： Lumileds LLC

发明人： Michael Deckers ,  Tze Yang Hin ,  Ronald Bonne

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L27/15 ,  H01L25/075 ,  H01L27/02

摘要： A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.

公开(公告)号：US10893585B2

公开(公告)日：2021-01-12

申请号：US16456858

申请日：2019-06-28

申请人： Lumileds LLC

发明人： Ronald Bonne ,  Udo Karbowski

IPC分类号： H05B45/10 ,  B60Q1/14

摘要： A LED controller for an LED pixel array includes a serial interface to an external data bus, along with an address generator connected to the serial interface and the LED pixel array. An image frame buffer is connected to the interface to receive image data and further connected to the address generator to receive an image frame buffer address. A command and control module is connected to the serial interface and configured to modify image frame buffer output signals. A calibration data storage module is connected to the command and control module to store calibration data related to pixel voltage response in the LED pixel array.

公开(公告)号：US20230156920A1

公开(公告)日：2023-05-18

申请号：US17967713

申请日：2022-10-17

申请人： LUMILEDS LLC

发明人： Michael Deckers ,  Tze Yang Hin ,  Ronald Bonne

IPC分类号： H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H05K3/30 ,  F21S41/141 ,  F21S41/19 ,  F21S45/47 ,  F21S45/49

CPC分类号： H05K1/147 ,  H05K1/181 ,  H05K1/118 ,  H05K1/0203 ,  H05K3/363 ,  H05K3/305 ,  F21S41/141 ,  F21S41/192 ,  F21S45/47 ,  F21S45/49 ,  H05K2201/10106

摘要： An LED array assembly may include a hybridized device and a flexible PCB. The hybridized device may include a micro-LED array mounted on a driver IC. The driver IC may include driver IC contact pads on a top surface of the driver IC. The flexible PCB may have a bottom surface, first contact pads on the bottom surface, second contact pads on the bottom surface, and contact bridges. Each of the contact bridges extends from one of the first contact pads to one of the second contact pads. Each of the driver IC contact pads is bonded to a corresponding one of the first contact pads of the flexible PCB.

公开(公告)号：US20230126041A1

公开(公告)日：2023-04-27

申请号：US17898971

申请日：2022-08-30

申请人： Lumileds LLC

发明人： Isaac Wildeson ,  Hossein Lotfi ,  Ronald Bonne ,  Toni Lopez

IPC分类号： H01L33/00 ,  H01L25/075 ,  H01L33/62

摘要： A light emitting diode (LED) device comprises a plurality of pixels on a backplane, each pixel comprising: semiconductor layers, which include an N-type layer, an active region, and a P-type layer; a cathode electrically contacting the N-type layer; an anode comprising anode segments electrically contacting respective portions of the P-type layer; one or more dielectric materials insulating: the active region and the P-type layer from the cathode, the anode segments from each other, and the anode segments from the cathode; and a plurality of interconnects, each respective interconnect affixing a respective anode segment to the backplane. Methods of making and use the devices are also provided.