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公开(公告)号：US08958045B2
公开(公告)日：2015-02-17
申请号：US13088839
申请日：2011-04-18
Applicant: Dong-Ho Lee
Inventor： Dong-Ho Lee
IPC: G02F1/1345 , G02F1/1339 , G02F1/1362
CPC classification number: G02F1/13454 , G02F1/133345 , G02F1/1339 , G02F1/136227 , G02F1/136286 , G02F1/1368 , G02F2203/09
Abstract: An LCD device provides enhanced display quality. An insulating layer is formed on a first substrate. The insulating layer covers the contact portion of a switching device in which the switching device is electrically connected to a transparent electrode and has an opening for exposing a portion of the transparent electrode. A reflection electrode is electrically connected to the transparent electrode through the opening. The insulation layer covers a first portion of a driving circuit formed on the first substrate. A sealant is interposed between the first and second substrate to engage the first and second substrate and to cover a second portion of the driving circuit. Therefore, the driver circuit may operate normally, and the distortion of the signal outputted from the driver circuit may be prevented.
Abstract translation: LCD设备提供增强的显示质量。 在第一基板上形成绝缘层。 绝缘层覆盖开关器件的接触部分，其中开关器件电连接到透明电极并且具有用于暴露透明电极的一部分的开口。 反射电极通过开口与透明电极电连接。 绝缘层覆盖形成在第一基板上的驱动电路的第一部分。 密封剂插入在第一和第二基板之间以与第一和第二基板接合并覆盖驱动电路的第二部分。 因此，驱动器电路可以正常工作，并且可以防止从驱动器电路输出的信号的失真。
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公开(公告)号：US20130108806A1
公开(公告)日：2013-05-02
申请号：US13604117
申请日：2012-09-05
Applicant: Sang-Woo Han , Dong-Ho Lee , Ju-Suk Oh , Hak-Sun Kim , Kwan-Young Han , Kyu-Taek Lee , Sang-Gu Kim
Inventor： Sang-Woo Han , Dong-Ho Lee , Ju-Suk Oh , Hak-Sun Kim , Kwan-Young Han , Kyu-Taek Lee , Sang-Gu Kim
CPC classification number: B32B7/12 , B32B7/02 , B32B27/08 , B32B27/283 , B32B27/36 , B32B2250/24 , B32B2307/558 , B32B2307/584 , B32B2457/20 , B32B2457/202 , G02F2001/133331 , G02F2201/50 , G02F2201/54 , Y10T428/10 , Y10T428/24967 , Y10T428/31663 , Y10T428/31938
Abstract: A display protection window and a display device having the same. The display protection window includes a first plastic film, a second plastic film arranged opposite to the first plastic film, and an adhesive layer disposed between the first plastic film and the second plastic film to bond the first plastic film and the second plastic film to each other.
Abstract translation: 一种显示保护窗和具有该保护窗的显示装置。 显示保护窗包括第一塑料膜，与第一塑料膜相对布置的第二塑料膜，以及设置在第一塑料膜和第二塑料膜之间的粘合剂层，以将第一塑料膜和第二塑料膜粘合到每个 其他。
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公开(公告)号：US08426252B2
公开(公告)日：2013-04-23
申请号：US13537953
申请日：2012-06-29
Applicant: Hyun-Soo Chung , Ho-Jin Lee , Dong-Hyun Jang , Dong-Ho Lee
Inventor： Hyun-Soo Chung , Ho-Jin Lee , Dong-Hyun Jang , Dong-Ho Lee
CPC classification number: H01L25/0657 , H01L21/76898 , H01L23/481 , H01L25/50 , H01L2224/02371 , H01L2224/02372 , H01L2224/0401 , H01L2224/13025 , H01L2224/274 , H01L2225/06513 , H01L2225/06541 , H01L2924/01079 , H01L2924/01087
Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.
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公开(公告)号：US08299593B2
公开(公告)日：2012-10-30
申请号：US12683861
申请日：2010-01-07
Applicant: Dong-Ho Lee
Inventor： Dong-Ho Lee
IPC: H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40 , H01L25/065
CPC classification number: H01L25/105 , H01L2224/4824 , H01L2225/1023 , H01L2225/1058 , H01L2225/1064 , H01L2924/15311
Abstract: A stack package of the present invention is made by stacking at least two area array type chip scale packages. Each chip scale package of an adjacent pair of chip scale packages is attached to the other in a manner that the ball land pads of the upper stacked chip scale package face in the opposite direction to those of the lower stacked chip scale package, and the circuit patterns of the upper stacked chip scale package are electrically connected to the those of the lower stacked chip scale package by, for example, connecting boards. Therefore, it is possible to stack not only fan-out type chip scale packages, but to also efficiently stack ordinary area array type chip scale packages.
Abstract translation: 通过堆叠至少两个区域阵列型芯片级封装件来制造本发明的堆叠封装。 相邻的一对芯片级封装的每个芯片级封装以上堆叠芯片级封装的焊盘焊盘与下堆叠芯片尺寸封装的方向相反的方式附接到另一芯片尺寸封装，并且电路 上堆叠芯片级封装的图案通过例如连接板电连接到下堆叠芯片级封装的图案。 因此，不仅可以堆叠扇出式芯片级封装，而且可以有效地堆叠普通区域阵列型芯片级封装。
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公开(公告)号：US20120204459A1
公开(公告)日：2012-08-16
申请号：US13315262
申请日：2011-12-08
Applicant: Akira Hirai , Dong-Ho Lee , Seon-Chool Kim , Sang-Wook Lee , Sung-Ki Jung
Inventor： Akira Hirai , Dong-Ho Lee , Seon-Chool Kim , Sang-Wook Lee , Sung-Ki Jung
CPC classification number: G09F9/30 , G02F1/133308 , G02F2001/133331 , G02F2201/50
Abstract: A display device has a cover window that is light, has good resistance against external impact, and is capable of being processed with various shapes. A display device according to the present invention includes: a display panel including a display area and a non-display area; and a cover window positioned at the front side of the display panel and including a transparent area corresponding to the display area and a non-transparent area corresponding to the non-display area, wherein the cover window includes a cover window main body formed with the transparent area and the non-transparent area, and a transparent protection layer formed at the front surface of the cover window main body. The transparent protection layer extends to the rear surface corresponding to at least a portion of the non-transparent area of the cover window main body.
Abstract translation: 显示装置具有遮光罩，光线良好，具有良好的抵抗外部冲击的能力，能够以各种形状进行加工。 根据本发明的显示装置包括：显示面板，包括显示区域和非显示区域; 以及位于所述显示面板的前侧的盖窗，其具有对应于所述显示区域的透明区域和对应于所述非显示区域的不透明区域，其中所述盖窗口包括盖窗主体， 透明区域和非透明区域，以及形成在盖窗主体的前表面处的透明保护层。 透明保护层延伸到对应于盖窗主体的不透明区域的至少一部分的后表面。
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Patent Agency Ranking
公开(公告)号：US08189580B2
公开(公告)日：2012-05-29
申请号：US13121681
申请日：2010-01-15
Applicant: Seung-Ho Seo , Hae-Eun Moon , Dong-Ho Lee
Inventor： Seung-Ho Seo , Hae-Eun Moon , Dong-Ho Lee
IPC: H04L12/28
Abstract: Disclosed herein are methods of searching for a host in a network using IPv4 and of blocking and searching a host in an IPv6 network which blocking access to an unauthorized network. The present invention provides a method of searching for a host in an IPv6 network, including the steps of requesting host information, including link-layer address information and IP address information about an IP to be searched for, by sending a Neighbor Solicitation (NS) packet in which the IP to be searched for is set in an ICMPv6 target address to the network, after sending the NS packet, waiting for a predetermined time by taking a processing speed of a host and a transfer rate according to a network environment and state into consideration, after the predetermined time of waiting, determining whether a Neighbor Advertisement (NA) packet of the IP to be searched for has been received, and if, as a result of the determination, the NA packet of the IP to be searched for is determined to have been received, acquiring the host information from the NA packet.
Abstract translation: 这里公开的是使用IPv4搜索网络中的主机以及阻止和搜索IPv6网络中的主机以阻止对未授权网络的访问的方法。 本发明提供一种在IPv6网络中搜索主机的方法，包括通过发送邻居请求（NS）来请求包括链路层地址信息和关于要搜索的IP的IP地址信息的主机信息的步骤， 将要搜索的IP的分组设置在ICMPv6目标地址中，在发送NS分组之后，根据网络环境和状态通过采取主机的处理速度等待预定时间和传送速率 考虑到在预定的等待时间之后，确定是否已经接收到要搜索的IP的邻居广播（NA）分组，以及作为确定的结果，将要搜索的IP的NA分组 被确定为已经被接收，从NA分组获取主机信息。
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87.发明申请WAFER LEVEL PACKAGE HAVING A STRESS RELIEF SPACER AND MANUFACTURING METHOD THEREOF 有权具有应力消除间隔件的水平包装及其制造方法公开(公告)号：US20120104608A1
公开(公告)日：2012-05-03
申请号：US13346191
申请日：2012-01-09
Applicant: Hyun-Soo Chung , Ho-Jin Lee , Dong-Hyun Jang , Dong-Ho Lee
Inventor： Hyun-Soo Chung , Ho-Jin Lee , Dong-Hyun Jang , Dong-Ho Lee
IPC: H01L25/07
CPC classification number: H01L25/0657 , H01L21/76898 , H01L23/481 , H01L25/50 , H01L2224/02371 , H01L2224/02372 , H01L2224/0401 , H01L2224/13025 , H01L2224/274 , H01L2225/06513 , H01L2225/06541 , H01L2924/01079 , H01L2924/01087
Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.
Abstract translation: 在具有应力消除间隔物的半导体器件封装及其制造方法中，从芯片本体延伸的金属互连指状物提供芯片互连。 金属手指通过应力消除间隔物与芯片的主体隔离。 在一个示例中，这种隔离采取气隙的形式。 在另一个实例中，这种隔离采用弹性体材料的形式。 在这两种情况下，都避免了金属互连指和芯体之间的热膨胀系数的不匹配，从而减轻了与开裂和分层相关的问题，从而提高了器件的产量和器件的可靠性。
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公开(公告)号：US08111520B2
公开(公告)日：2012-02-07
申请号：US12344817
申请日：2008-12-29
Applicant: Hyun-Soo Chung , Dong-Ho Lee , Dong-Han Kim , Seong-Deok Hwang , Ki-Hyuk Kim
Inventor： Hyun-Soo Chung , Dong-Ho Lee , Dong-Han Kim , Seong-Deok Hwang , Ki-Hyuk Kim
IPC: H05K1/18
CPC classification number: H05K1/185 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/32145 , H01L2224/73267 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H05K3/3457 , H05K3/4694 , H05K2201/10719
Abstract: A semiconductor module can include a printed circuit board (PCB) and a semiconductor package inserted into an inner space of the PCB. The semiconductor package may be electrically connected to the PCB. The PCB may thus surround the semiconductor package so that cracks may not be generated in the outer terminals.
Abstract translation: 半导体模块可以包括插入到PCB的内部空间中的印刷电路板（PCB）和半导体封装。 半导体封装可以电连接到PCB。 因此，PCB可以围绕半导体封装，从而可能不会在外部端子中产生裂纹。
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公开(公告)号：US20110182293A1
公开(公告)日：2011-07-28
申请号：US13121681
申请日：2010-01-15
Applicant: Seung-Ho Seo , Hae-Eun Moon , Dong-Ho Lee
Inventor： Seung-Ho Seo , Hae-Eun Moon , Dong-Ho Lee
Abstract: Disclosed herein are methods of searching for a host in a network using IPv4 and of blocking and searching a host in an IPv6 network which blocking access to an unauthorized network. The present invention provides a method of searching for a host in an IPv6 network, including the steps of requesting host information, including link-layer address information and IP address information about an IP to be searched for, by sending a Neighbor Solicitation (NS) packet in which the IP to be searched for is set in an ICMPv6 target address to the network, after sending the NS packet, waiting for a predetermined time by taking a processing speed of a host and a transfer rate according to a network environment and state into consideration, after the predetermined time of waiting, determining whether a Neighbor Advertisement (NA) packet of the IP to be searched for has been received, and if, as a result of the determination, the NA packet of the IP to be searched for is determined to have been received, acquiring the host information from the NA packet.
Abstract translation: 这里公开的是使用IPv4搜索网络中的主机以及阻止和搜索IPv6网络中的主机以阻止对未授权网络的访问的方法。 本发明提供一种在IPv6网络中搜索主机的方法，包括通过发送邻居请求（NS）来请求包括链路层地址信息和关于要搜索的IP的IP地址信息的主机信息的步骤， 将要搜索的IP的分组设置在ICMPv6目标地址中，在发送NS分组之后，根据网络环境和状态通过采取主机的处理速度等待预定时间和传送速率 考虑到在预定的等待时间之后，确定是否已经接收到要搜索的IP的邻居广播（NA）分组，以及作为确定的结果，将要搜索的IP的NA分组 被确定为已经被接收，从NA分组获取主机信息。
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公开(公告)号：US20110122597A1
公开(公告)日：2011-05-26
申请号：US13014227
申请日：2011-01-26
Applicant: Hyoung-Hak Kim , Tae-Hyeong Park , Dong-Ho Lee
Inventor： Hyoung-Hak Kim , Tae-Hyeong Park , Dong-Ho Lee
IPC: H05K9/00
CPC classification number: G02F1/13452
Abstract: A driving device including a board on which a timing controller for signal processing and a memory are mounted, the board having a conductive field, in which the conductive field has a non-contact region which is coated with an insulating material, and an exposed contact region which is not covered with the insulating material, the exposed contact region formed adjacent to the timing controller or the memory, a conductive member disposed in the exposed contact region, and a shield covering the board and electrically connected to the conductive field via the conductive member
Abstract translation: 一种驱动装置，包括其上安装有用于信号处理的定时控制器和存储器的板，所述板具有导电场，其中导电场具有涂覆有绝缘材料的非接触区域，以及暴露的触点 未被绝缘材料覆盖的区域，与定时控制器或存储器相邻形成的暴露的接触区域，设置在暴露的接触区域中的导电部件，以及覆盖该基板并通过导电性电连接到导电场的屏蔽 会员
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