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200 条记录 (耗时 0.025 秒)

    Semiconductor device
    81.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08593168B2

    公开(公告)日：2013-11-26

    申请号：US13195409

    申请日：2011-08-01

    申请人： Kenichi Kawasaki

    发明人： Kenichi Kawasaki

    IPC分类号： G01R31/06

    CPC分类号： G01R31/31721

    摘要： A first power-cutoff switch is disposed between a power line and an internal power line dedicated for a circuit block, and has a current supply capacity having the level at which ON-current can protect an external examination environment. A second power-cutoff switch is disposed between a power line and an internal power line, and has a current supply capacity having the level at which ON-current can supply consumed current of the circuit block. A detecting circuit detects that a voltage of the internal power line matches a reference voltage. The first power-cutoff switch is ON/OFF by an operation state of the circuit block. The second power-cutoff switch is ON by detecting the matching of the volumes with the detecting circuit and is OFF by the ON/OFF operation of the first power-cutoff switch.

    摘要翻译： 第一断电开关设置在电源线和专用于电路块的内部电力线之间，并且具有电流供应能力，其具有能够保护外部检查环境的电平。 第二断电开关设置在电力线和内部电力线之间，并且具有电流供应能力，其具有导通电流可以供应电路块的消耗电流的电平。 检测电路检测内部电力线的电压与参考电压相匹配。 第一电源切断开关由电路块的运行状态开/关。 通过检测体积与检测电路的匹配，第二断电开关为ON，并且通过第一电源切断开关的ON / OFF操作关闭。

    Semiconductor circuit device
    82.
    发明授权
    Semiconductor circuit device 有权
    半导体电路器件

    公开(公告)号：US08421525B2

    公开(公告)日：2013-04-16

    申请号：US13046344

    申请日：2011-03-11

    申请人： Kenichi Kawasaki

    发明人： Kenichi Kawasaki

    IPC分类号： G05F1/10

    CPC分类号： G05F1/56 ,  G06F1/3203

    摘要： The semiconductor circuit device includes a power line receiving first voltage; each of internal circuits being provided with different operating voltages by the operation mode; a power supply circuit connected with one of internal circuits and the power line to provide second voltage lower than the first voltage to the one of internal circuits; and a control circuit controlling the power supply circuit in accordance with each of the operation modes, wherein when a change of a operation mode is performed, if a operating voltage after the change of a operation mode is higher than a operating voltage before the change of a operation mode, firstly the control circuit controls the power supply circuit to supply a second voltage higher than the operating voltage and secondly the control circuit controls the power supply circuit to supply the operation voltage after the change of a operation mode to the internal circuit.

    摘要翻译： 半导体电路装置包括：接收第一电压的电力线; 每个内部电路由操作模式提供不同的工作电压; 与所述内部电路和所述电力线之一连接的电源电路，以向所述一个内部电路提供低于所述第一电压的第二电压; 以及根据每种操作模式控制电源电路的控制电路，其中当执行操作模式的改变时，如果操作模式改变之后的操作电压高于在改变之前的操作电压 操作模式，首先控制电路控制电源电路提供比工作电压高的第二电压，其次控制电路控制电源电路，以便在将运行模式改变为内部电路之后提供工作电压。

    Information communication method, information communication system, information reception apparatus, and information transmission apparatus
    84.
    发明授权
    Information communication method, information communication system, information reception apparatus, and information transmission apparatus 失效
    信息通信方式，信息通信系统，信息接收装置，信息发送装置

    公开(公告)号：US08260194B2

    公开(公告)日：2012-09-04

    申请号：US12215817

    申请日：2008-06-30

    申请人： Kenichi Kawasaki

    发明人： Kenichi Kawasaki

    IPC分类号： H04H40/00

    CPC分类号： G01S13/825 ,  G01H9/00

    摘要： An information communication method includes transmitting a millimeter-band radio wave from a reception side, reflecting the transmitted radio wave at a transmission side while vibrating the transmitted radio wave corresponding to first information transmitted by the transmission side, and receiving the reflected radio wave at the reception side and reconstructing the first information based on a phase difference between the transmitted radio wave and the received radio wave.

    摘要翻译： 一种信息通信方法，包括从接收侧发送毫米波段无线电波，在发送侧反射发送的无线电波，同时对与发送侧发送的第一信息相对应的发送的无线电波振动，并且接收反射的无线电波 并且基于所发送的无线电波和所接收的无线电波之间的相位差重建第一信息。

    Method for manufacturing multilayer electronic component
    85.
    发明授权
    Method for manufacturing multilayer electronic component 有权
    多层电子部件的制造方法

    公开(公告)号：US08240016B2

    公开(公告)日：2012-08-14

    申请号：US12770914

    申请日：2010-04-30

    申请人： Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi

    发明人： Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi

    IPC分类号： H01G7/00

    CPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/2325 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/102 ,  H05K3/246 ,  H05K3/403 ,  H05K2201/0347 ,  H05K2203/025 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T428/25

    摘要： A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 μm or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.

    摘要翻译： 一种制造多层电子部件的方法包括制备层压体的步骤，该层压体包括多个堆叠的绝缘体层和沿着绝缘体层之间的界面延伸的多个内部电极，并且其中多个内部 电极在对应于第一和第二端面之一的预定表面处露出; 在所述预定表面上形成外部电极的步骤; 以及在边缘部分形成厚膜边缘电极的步骤。 形成外部电极的步骤包括将多个具有约1μm以上的粒径的导电粒子附着在层叠体的规定表面上的步骤，以及在导电粒子的规定表面上直接进行电镀的工序 附上。

    Laminated ceramic electronic component
    87.
    发明授权
    Laminated ceramic electronic component 有权
    层压陶瓷电子元件

    公开(公告)号：US08228663B2

    公开(公告)日：2012-07-24

    申请号：US12616844

    申请日：2009-11-12

    申请人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Toshiyuki Iwanaga

    发明人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Toshiyuki Iwanaga

    IPC分类号： H01G4/228 ,  H01G4/06

    CPC分类号： H01G4/232 ,  H01G4/2325 ,  H01G4/30

    摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.

    摘要翻译： 在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。 在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    88.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20120183682A1

    公开(公告)日：2012-07-19

    申请号：US13433320

    申请日：2012-03-29

    申请人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

    发明人： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

    IPC分类号： B05D5/00 ,  B05D3/02

    CPC分类号： H01G4/12 ,  H01G4/005 ,  H01G4/232

    摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

    摘要翻译： 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

    SEMICONDUCTOR DEVICE
    89.
    发明申请
    SEMICONDUCTOR DEVICE 失效
    半导体器件

    公开(公告)号：US20110304380A1

    公开(公告)日：2011-12-15

    申请号：US12962809

    申请日：2010-12-08

    申请人： Koichi Nakayama ,  Tetsuyoshi Shiota ,  Kenichi Kawasaki

    发明人： Koichi Nakayama ,  Tetsuyoshi Shiota ,  Kenichi Kawasaki

    IPC分类号： H03K17/16

    CPC分类号： H03K19/0016 ,  Y10T307/702 ,  Y10T307/74 ,  Y10T307/858

    摘要： A semiconductor device includes: a first power line to supply a first voltage to a plurality of internal circuits; a second power line to supply the first voltage to the plurality of internal circuits; a first switch provided between said first power line and each of the plurality of internal circuits; a second switch provided between said second power line and each of the plurality of internal circuits; and a control circuit to control the first switch of a second internal circuit included in the plurality of the internal circuits based on the amounts of noise and voltage drop at power-on in a first circuit included in the plurality of internal circuits.

    摘要翻译： 半导体器件包括：向多个内部电路提供第一电压的第一电力线; 第二电力线，用于向所述多个内部电路提供所述第一电压; 设置在所述第一电力线与所述多个内部电路中的每一个之间的第一开关; 设置在所述第二电力线与所述多个内部电路中的每一个之间的第二开关; 以及控制电路，其基于在所述多个内部电路中包括的第一电路中的通电时的噪声和电压降的量来控制包括在所述多个内部电路中的第二内部电路的第一开关。