Electrostatic chuck assembly for cryogenic applications

    公开(公告)号:US12033837B2

    公开(公告)日:2024-07-09

    申请号:US18237673

    申请日:2023-08-24

    发明人: Vijay D. Parkhe

    摘要: Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications. In one or more embodiments, an electrostatic chuck assembly is provided and includes an electrostatic chuck having a substrate supporting surface opposite a bottom surface, a cooling plate having a top surface, where the cooling plate contains an aluminum alloy having a coefficient of thermal expansion (CTE) of less than 22 ppm/° C., and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate, where the bonding layer contains a silicone material.

    TDS mitigation using different data preamble tones

    公开(公告)号:US12033664B2

    公开(公告)日:2024-07-09

    申请号:US17849504

    申请日:2022-06-24

    IPC分类号: G11B21/10

    CPC分类号: G11B21/103

    摘要: The present disclosure generally relates to a tape drive comprising a tape head and control circuitry. The tape head comprises a plurality of data elements, each data element including a write transducer and a read transducer. The control circuitry is configured to control the tape head to write at least three different frequency preamble tones prior to writing data to data tracks of a tape. A different preamble tone is written to adjacent data tracks of the tape. The data elements of the tape head are each configured to read one or more preamble tones prior to writing data to or reading data from the tape. The control circuitry is then configured to extract a signal content from each preamble tone read by each data element, and determine an optimized positioning for the tape head with respect to the tape to reduce alignment errors.

    End-face coupling structures within electrical backend

    公开(公告)号:US12025831B2

    公开(公告)日:2024-07-02

    申请号:US18297373

    申请日:2023-04-07

    摘要: End-face coupling structures within an electrical backend are provided via photonic integrated circuit (PIC), comprising: a first plurality of spacer layers; a second plurality of etch-stop layers, wherein each etch-stop layer of the second plurality of etch-stop layers is located between two spacer layers of the first plurality of spacer layers; and an optical coupler comprising a plurality of waveguides arranged as a waveguide array configured to receive an optical signal in a direction of travel, wherein each waveguide of the plurality of waveguides is located at a layer interface defined between an etch-stop layer and a spacer layer. Portions of the PIC can be formed by depositing layers of spacer and etch-stop materials in which cavities are formed to define the waveguides when the waveguide material is deposited or interconnects when a metal is deposited therein.

    Post-chemical mechanical polishing brush cleaning box

    公开(公告)号:US12023779B2

    公开(公告)日:2024-07-02

    申请号:US17375961

    申请日:2021-07-14

    发明人: Gary Ka Ho Lam

    IPC分类号: B24B37/34 A46B13/00 A46B13/02

    摘要: Embodiments provided herein include a system and method for cleaning a first surface of a substrate using a brush carousel assembly. In one embodiment, the brush carousel assembly includes one or more rotatable brush mounting assemblies coupled to a rotatable carriage, having a carriage support structure configured to rotate about a carriage axis. The brush carousel assembly further includes a second brush mounting assembly disposed a second radial distance from the carriage axis, and coupled to the support structure of the carriage that includes the one or more rotatable support members.

    Modification of SSB burst pattern
    88.
    发明授权

    公开(公告)号:US12021598B2

    公开(公告)日:2024-06-25

    申请号:US17238122

    申请日:2021-04-22

    摘要: Certain aspects of the present disclosure provide techniques for efficiently selecting beams for synchronization signal block (SSB) burst transmissions based on a condition. Techniques include selecting certain directions to transmit higher power beams and selecting certain directions to transmit lower power SSB burst transmissions. In some cases, an SSB burst parameter may be modified to use a reduced number of optimal SSB beams. The modified SSB burst parameter may have a reduced SSB burst duration, which may allow for reduced monitoring time by a UE and/or free up resources (that would otherwise be used for SSB transmissions) for data transmissions. Additional aspects relate generally to the beam management procedures in wireless communications systems. Some aspects more specifically relate to the selection of beams for communications to and from a UE and a network entity based on predicted mobility state information for a user equipment (UE).

    Integrated electrode and ground plane for a substrate support

    公开(公告)号:US12020912B2

    公开(公告)日:2024-06-25

    申请号:US17027393

    申请日:2020-09-21

    发明人: Vijay D. Parkhe

    IPC分类号: H01J37/32

    摘要: Embodiments described herein relate to apparatus for radio frequency (RF) grounding in process chambers. In one embodiment, a heater is disposed in a substrate support. The heater is surrounded by a ground shield assembly. The substrate support also includes a multi-zone electrode disposed therein. The multi-zone electrode includes one or more portions of an electrode disposed in a plane. One or more portions of a multi-zone ground plane are interposed with the one or more portions of the electrode. That is, the multi-zone ground plane and the multi-zone electrode are coplanar with the one or more portions of the electrode alternating with one or more portions of the multi-zone ground plane throughout a plane of the substrate support.