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公开(公告)号：US11315901B2
公开(公告)日：2022-04-26
申请号：US16632643
申请日：2017-09-21
IPC分类号： H01L21/67 , H01L23/00 , H01L21/683
摘要： A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.
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公开(公告)号：US11315813B2
公开(公告)日：2022-04-26
申请号：US15551733
申请日：2015-04-10
IPC分类号： H01L21/68 , H01L21/673 , H01L21/67 , H01L23/00
摘要： A substrate holder having a fixing surface for holding a substrate, a system having such a substrate holder, a use of such a substrate holder, a method for bonding two substrates and a product, particularly a substrate stack, produced using such a method and also a use of such a substrate holder for such a method.
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公开(公告)号：US11040525B2
公开(公告)日：2021-06-22
申请号：US16463092
申请日：2017-10-23
发明人： Jozsef Krol , Boris Povazay
摘要： A method and apparatus for embossing micro-structures and/or nano-structures. The method includes the steps of providing a structured embossing roll having end faces; coupling a crosslinking radiation into the structured embossing roll which is transparent for the crosslinking radiation, wherein the embossing roll functions as a light guide for the coupled in crosslinking radiation; providing a carrier having an embossing compound applied thereto; contacting the embossing roll with the embossing compound; coupling the crosslinking radiation out of the embossing roll; and curing the embossing compound which has been acted upon by the coupled out crosslinking radiation via the embossing roll.
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公开(公告)号：US11024530B2
公开(公告)日：2021-06-01
申请号：US16575493
申请日：2019-09-19
发明人： Jurgen Burggraf , Harald Wiesbauer
摘要： A product-substrate-to-carrier-substrate bond with a product substrate, which is bonded to a carrier substrate via a connection layer, wherein a soluble layer is arranged between the connection layer and the product substrate, and wherein a) the soluble layer is soluble due to an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are both at least predominantly transparent to the electromagnetic radiation transmitted through the connection layer, wherein a material of the soluble layer and the electromagnetic radiation are chosen such that an increase of temperature of the soluble layer caused by the interaction with the electromagnetic radiation is less than 50° C.
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公开(公告)号：US11020953B2
公开(公告)日：2021-06-01
申请号：US16359157
申请日：2019-03-20
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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公开(公告)号：US11020952B2
公开(公告)日：2021-06-01
申请号：US16358844
申请日：2019-03-20
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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公开(公告)号：US11020950B2
公开(公告)日：2021-06-01
申请号：US16357729
申请日：2019-03-19
IPC分类号： B32B38/18 , H01L21/18 , B32B37/00 , B32B37/18 , B32B37/10 , B29C65/78 , H01L21/67 , H01L21/683 , B29C65/00
摘要： A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
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公开(公告)号：US10971365B2
公开(公告)日：2021-04-06
申请号：US16481994
申请日：2017-02-21
IPC分类号： H01L21/20 , H01L21/02 , H01L21/268
摘要： A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.
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公开(公告)号：US10886156B2
公开(公告)日：2021-01-05
申请号：US16283889
申请日：2019-02-25
IPC分类号： H01L21/68 , H01L21/67 , H01L21/683 , H01L21/66
摘要： A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
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公开(公告)号：US20200219726A1
公开(公告)日：2020-07-09
申请号：US16821139
申请日：2020-03-17
摘要： A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.
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